Abstract: A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.

Abstract: A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.

Abstract: A semiconductor force sensor capable of preventing a diaphragm part (37) from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part (37), wherein a force transmitting means for applying a measured force to the diaphragm part (37) of a semiconductor force sensor element (31) is formed of a sphere (33) having a rigidity, and a through hole (63) passing through an opposed wall part (55) toward the diaphragm (37) is formed in the opposed wall parts (55) at a position opposed to the center part of the diaphragm part (37) so that a part of the sphere (33) can face the outside of the opposed wall part (55) and stores a part of the remaining part of the sphere (33) to allow the sphere (33) to be moved only in a direction orthogonal to the diaphragm part (37) and rotated on the center part of the diaphragm part (37).

Abstract: A semiconductor force sensor capable of preventing a diaphragm part (37) from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part (37), wherein a force transmitting means for applying a measured force to the diaphragm part (37) of a semiconductor force sensor element (31) is formed of a sphere (33) having a rigidity, and a through hole (63) passing through an opposed wall part (55) toward the diaphragm (37) is formed in the opposed wall parts (55) at a position opposed to the center part of the diaphragm part (37) so that a part of the sphere (33) can face the outside of the opposed wall part (55) and stores a part of the remaining part of the sphere (33) to allow the sphere (33) to be moved only in a direction orthogonal to the diaphragm part (37) and rotated on the center part of the diaphragm part (37).

Abstract: A capacitance-type pressure sensor unit capable of being assembled without applying a pressure at an increased level to a circuit board. A connector body (6) has a base (6b) received in a peripheral wall section (13b) of a receiving casing (13) constituting a main body of the casing (13) and fixed to an end (13e) of the peripheral wall section (13b) by caulking. A pressure sensor element (3) constituted of a first insulating substrate (1) and a second insulating substrate (2) is arranged in a bottom wall section (13a) of the receiving casing (13) and a fluid chamber (15) into which pressure measured fluid is introduced is defined between a rear surface of the first insulating substrate (1) and the bottom wall section (13a).

Abstract: Pressure sensitive layers are disposed on respective resin films through electrodes to face each other, and include high conductivity flaky carbon particles and low conductivity amorphous-based carbon particles. The two kinds of carbon particles are bound together by a resin-system binder. Accordingly, when a pushing force is applied to the resin films, an average distance between the carbon particles is decreased to cause a tunnel conduction phenomenon, resulting in a decrease in conductive resistance between the electrodes. As a result, a pressure sensing property can be made gentle.

Abstract: A membrane switch having a pair of flexible printed boards and a pair of contacts respectively disposed on said printed boards. The contacts are formed of powdered alloy of silver and palladium bounded by resinous material, and a conductive layer of silver powder is disposed between the flexible printed board and the contact. Preferably, the powdered alloy contains 50-97 weight percent silver and palladium in the remainder of weight percent.

Abstract: The present invention provides a pressure sensor module which is capable of restraining application of a pressure of increased magnitude to a connector, reducing the number of parts therefor and compacting a structure thereof. A connector body (3a) is provided on a base section thereof with a flange (3g). An annular support (4) which is made of a material hard to be deformed under a high pressure as compared with the connector body (3a) is provided with an annular engagement recess (4b). The annular support (4) is fitted on the connector body (3a) to engage the flange (3g) with the annular engagement recess (4b). The annular support (4) is contacted on one end surface (4a) thereof with a pressure non-sensing side insulating substrate (5a) of a pressure sensing element (5) outside the base section of the connector body (3a).

Abstract: A sensor unit is disclosed which is adapted to be used as a detector for a fuel gauge, an oil pressure gauge or the like for a vehicle. A variable resistor serving as a signal converting device is securely fitted at both ends thereof in board fixing grooves formed at a frame fixed on a fixing bracket, so that fixing of the variable resistor may be accomplished without using adhesives. Fixing and electrical connection of a connection conductor are attained by merely fitting the connection conductor in an extension restraining groove without soldering.