Patents by Inventor Yoshimitsu Takahata

Yoshimitsu Takahata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190330457
    Abstract: The present invention is a polyolefin rubber composition containing: 100 parts by mass of (A) an ethylene-?-olefin-unconjugated polyene random copolymer; 1-100 parts by mass of (B) an organopolysiloxane having a degree of polymerization of 20 or higher and having 0 or 1-3 alkenyl groups per molecule, the organopolysiloxane being represented by the following average compositional formula (1): RaSiO(4-a)/2 (in the formula, R represents the same or different monovalent hydrocarbon groups, and a is a positive number of 1.95-2.05); 10-100 parts by mass of (C) reinforcing silica having a specific surface area of 50 m2/g or higher by the BET method with respect to 100 total parts by mass of components (A) and (B); and 1-150 parts by mass of (D) particles selected from the group consisting of specific organic resin particles, inorganic particles, and silicone powder particles. This polyolefin rubber composition can be compression molded, steam vulcanized, etc.
    Type: Application
    Filed: January 15, 2018
    Publication date: October 31, 2019
    Applicants: AMADERUS HOLDINGS CO., LTD., SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naozumi MORI, Takeshi URATANI, Hideki KISHIDA, Masayuki YOSHIDA, Minoru IGARASHI, Masaki TANAKA, Yoshimitsu TAKAHATA
  • Patent number: 7391101
    Abstract: A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a resin and having a concave portion (1a), a lead (2) formed integral with the package (1) by insert molding, with its one end exposed into the concave portion (1a) and its other end extended from the package (1) to the outside, a sensor chip (3) arranged in the concave portion (1a) for detecting pressure, and a bonding wire (4) electrically connecting the sensor chip (3) and the lead (2) with each other. An interface between the lead (2) and the package (1) on the side of the concave portion (1a) is covered with a first protective resin portion (6) of electrically insulating property, and the bonding wire (4) is covered with a second protective resin portion (7) that is softer than the first protective resin portion (6).
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: June 24, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshimitsu Takahata, Hiroshi Nakamura, Masaaki Taruya, Shinsuke Asada
  • Patent number: 7187225
    Abstract: This invention provides an electronic control unit is capable of suppressing electromagnetic noise having a frequency band used in a portable wireless apparatus, and capable of exhibiting a noise resistance property against electromagnetic noise. The electronic control unit including a constant voltage power supply circuit portion, an analog signal inputting circuit portion, and a conversion processing circuit portion, an analog sensor and a driving power supply being connected to the outside, and the unit being connected to the analog sensor through a power supply line and a signal line, in which the analog signal inputting circuit portion includes a current limiting circuit portion, an integrating circuit portion, a current limiting resistor, a signal noise absorbing circuit, and a first bypass capacitor, and capacitance (C1) and parasitic inductance (L1) of the first bypass capacitor are set in a range of 7×106<1/[2??(L1×C1)]<35×106.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: March 6, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masaharu Yuhara, Yasuhiro Shiraki, Kazuhito Okishio, Hiroshi Nakamura, Hisato Umemaru, Yoshimitsu Takahata, Yasuaki Gotoh
  • Publication number: 20070029657
    Abstract: A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The semiconductor pressure sensor includes a package (1) made of a resin and having a concave portion (1a), a lead (2) formed integral with the package (1) by insert molding, with its one end exposed into the concave portion (1a) and its other end extended from the package (1) to the outside, a sensor chip (3) arranged in the concave portion (1a) for detecting pressure, and a bonding wire (4) electrically connecting the sensor chip (3) and the lead (2) with each other. An interface between the lead (2) and the package (1) on the side of the concave portion (1a) is covered with a first protective resin portion (6) of electrically insulating property, and the bonding wire (4) is covered with a second protective resin portion (7) that is softer than the first protective resin portion (6).
    Type: Application
    Filed: November 28, 2005
    Publication date: February 8, 2007
    Inventors: Yoshimitsu Takahata, Hiroshi Nakamura, Masaaki Taruya, Shinsuke Asada
  • Publication number: 20060104000
    Abstract: This invention provides an electronic control unit is capable of suppressing electromagnetic noise having a frequency band used in a portable wireless apparatus, and capable of exhibiting a noise resistance property against electromagnetic noise. The electronic control unit including a constant voltage power supply circuit portion, an analog signal inputting circuit portion, and a conversion processing circuit portion, an analog sensor and a driving power supply being connected to the outside, and the unit being connected to the analog sensor through a power supply line and a signal line, in which the analog signal inputting circuit portion includes a current limiting circuit portion, an integrating circuit portion, a current limiting resistor, a signal noise absorbing circuit, and a first bypass capacitor, and capacitance (C1) and parasitic inductance (L1) of the first bypass capacitor are set in a range of 7×106<1/[2??(L1×C1)]<35×106.
    Type: Application
    Filed: August 11, 2005
    Publication date: May 18, 2006
    Inventors: Masaharu Yuhara, Yasuhiro Shiraki, Kazuhito Okishio, Hiroshi Nakamura, Hisato Umemaru, Yoshimitsu Takahata, Yasuaki Gotoh