Patents by Inventor Yoshimitsu TAKANO

Yoshimitsu TAKANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Separator for non-aqueous secondary battery, non-aqueous secondary battery, and method of manufacturing non-aqueous secondary battery
    Patent number: 11777175
    Abstract: A separator includes a porous substrate, and a porous layer formed on one or both surfaces of the substrate and containing a polyvinylidene fluoride type resin and a filler, in which the filler content in the porous layer is from 30 to 80% by mass with respect to the total mass of the polyvinylidene fluoride type resin and the filler, and the polyvinylidene fluoride type resin is at least one resin selected from the following resin A and B: resin A: a copolymer having a weight average molecular weight of from 100,000 to 350,000, and a content of HFP is more than 5% by mass but not more than 11% by mass; and resin B: a copolymer having a weight average molecular weight of from 100,000 to 1,000,000, in which a content of HFP is more than 11% by mass but not more than 15% by mass.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: October 3, 2023
    Assignee: TEIJIN LIMITED
    Inventors: Susumu Honda, Satoshi Nishikawa, Takashi Yoshitomi, Tomoya Hamada, Yoshimitsu Takano
  • SEPARATOR FOR NON-AQUEOUS SECONDARY BATTERY, NON-AQUEOUS SECONDARY BATTERY, AND METHOD OF MANUFACTURING NON-AQUEOUS SECONDARY BATTERY
    Publication number: 20180190957
    Abstract: A separator includes a porous substrate, and a porous layer formed on one or both surfaces of the substrate and containing a polyvinylidene fluoride type resin and a filler, in which the filler content in the porous layer is from 30 to 80% by mass with respect to the total mass of the polyvinylidene fluoride type resin and the filler, and the polyvinylidene fluoride type resin is at least one resin selected from the following resin A and B: resin A: a copolymer having a weight average molecular weight of from 100,000 to 350,000, and a content of HFP is more than 5% by mass but not more than 11% by mass; and resin B: a copolymer having a weight average molecular weight of from 100,000 to 1,000,000, in which a content of HFP is more than 11% by mass but not more than 15% by mass.
    Type: Application
    Filed: June 30, 2016
    Publication date: July 5, 2018
    Applicant: TEIJIN LIMITED
    Inventors: Susumu HONDA, Satoshi NISHIKAWA, Takashi YOSHITOMI, Tomoya HAMADA, Yoshimitsu TAKANO