Patents by Inventor Yoshimitsu Wada

Yoshimitsu Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959979
    Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.
    Type: Grant
    Filed: March 8, 2023
    Date of Patent: April 16, 2024
    Assignee: TDK CORPORATION
    Inventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
  • Publication number: 20230251331
    Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.
    Type: Application
    Filed: March 8, 2023
    Publication date: August 10, 2023
    Applicant: TDK Corporation
    Inventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
  • Patent number: 11630165
    Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: April 18, 2023
    Assignee: TDK CORPORATION
    Inventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
  • Publication number: 20220337605
    Abstract: An object is to provide a management apparatus for reducing undeclared claims for cyber attacks. A management apparatus (10) according to a first example aspect of the present disclosure includes a data collection unit (11) for collecting, from a security apparatus configured to monitor a network managed by a cyber insurance policyholder, security information related to data indicating a suspected occurrence of a cyber attack and detected based on a predetermined communication pattern and a determination unit (12) for determining whether or not the security information satisfies a coverage trigger condition by using a database for managing the coverage trigger condition, the coverage trigger condition defining a coverage criteria of cyber insurance.
    Type: Application
    Filed: September 30, 2019
    Publication date: October 20, 2022
    Applicant: NEC Corporation
    Inventors: Hidehisa TOYAMA, Yoshimitsu Wada, Masahiko Honda
  • Publication number: 20220214409
    Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.
    Type: Application
    Filed: March 24, 2022
    Publication date: July 7, 2022
    Applicant: TDK CORPORATION
    Inventors: Kunihiro UEDA, Yoshimitsu WADA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Tsuyoshi UMEHARA
  • Patent number: 11313920
    Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: April 26, 2022
    Assignee: TDK CORPORATION
    Inventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
  • Publication number: 20200209324
    Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.
    Type: Application
    Filed: March 12, 2020
    Publication date: July 2, 2020
    Applicant: TDK CORPORATION
    Inventors: Kunihiro UEDA, Yoshimitsu WADA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Tsuyoshi UMEHARA
  • Patent number: 10634734
    Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: April 28, 2020
    Assignee: TDK CORPORATION
    Inventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
  • Publication number: 20180017634
    Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.
    Type: Application
    Filed: July 5, 2017
    Publication date: January 18, 2018
    Applicant: TDK CORPORATION
    Inventors: Kunihiro UEDA, Yoshimitsu WADA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Tsuyoshi UMEHARA
  • Publication number: 20170052232
    Abstract: A magnetic sensor device that can prevent an increase in detection error even when stress is applied to a magnetic sensor chip due to heat generation or the like at the time of operation includes a magnetic sensor chip that has a nearly-square shape in a plan view, and a die pad having a mounting surface where the magnetic sensor chip is mounted. Opening portions are formed at positions where four corners of the magnetic sensor chip mounted on the mounting surface overlap, respectively. An area ratio of the opening portions to an area of the die pad is 20% or greater. Also, an area of the overlapped portions with the magnetic sensor chip and the opening portions is 40% or greater relative to the area of the opening portions in a plan view of the die pad.
    Type: Application
    Filed: June 29, 2016
    Publication date: February 23, 2017
    Inventors: Yoshimitsu WADA, Kunihiro UEDA
  • Patent number: 9372243
    Abstract: The magnetic sensor of the invention comprises a base portion, a sensor chip positioned on the base portion, a wiring portion adapted to electrically connect a terminal of the sensor chip to a connecting lead, a resin having a low elastic modulus for coating at least the sensor chip, and a resin having a high elastic modulus for coating at least the low elastic-modulus resin and the wiring portion, wherein the sensor chip includes a magneto-resistive effect device, and the low elastic-modulus resin has an elastic modulus ranging from 10 kPa to 80 MPa while the high elastic-modulus resin has an elastic modulus of 1 GPa or more, and enables the sensor chip to perform well in a good state although having a structure of sealing up the sensor chip with the resin member.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: June 21, 2016
    Assignee: TDK CORPORATION
    Inventors: Yoshimitsu Wada, Nozomu Hachisuka, Yoshihiro Kudo, Jun Ono, Nobutaka Nishio
  • Publication number: 20150054498
    Abstract: The magnetic sensor of the invention comprises a base portion, a sensor chip positioned on the base portion, a wiring portion adapted to electrically connect a terminal of the sensor chip to a connecting lead, a resin having a low elastic modulus for coating at least the sensor chip, and a resin having a high elastic modulus for coating at least the low elastic-modulus resin and the wiring portion, wherein the sensor chip includes a magneto-resistive effect device, and the low elastic-modulus resin has an elastic modulus ranging from 10 kPa to 80 MPa while the high elastic-modulus resin has an elastic modulus of 1 GPa or more, and enables the sensor chip to perform well in a good state although having a structure of sealing up the sensor chip with the resin member.
    Type: Application
    Filed: July 18, 2014
    Publication date: February 26, 2015
    Inventors: Yoshimitsu WADA, Nozomu HACHISUKA, Yoshihiro KUDO, Jun ONO, Nobutaka NISHIO
  • Patent number: 7957101
    Abstract: A suspension is provided for improving reliability in reading/writing of data by improving stiffness in a longitudinal direction of a flexure while realizing low pitch/roll stiffness of a tongue part. The suspension includes: a flexure, including two branched outrigger parts extending to the tip side of the flexure, and a tongue part for mounting a magnetic head slider, located between the outrigger parts and linked to the tip sides of the outrigger parts; a trace formed on the flexure; and a fixed part in which at least a part of a bent part formed in the trace is fixed to the tongue part.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: June 7, 2011
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Hidetoshi Matsui, Takashi Honda, Yoshimitsu Wada
  • Patent number: 7333299
    Abstract: A suspension is provided, which comprises: a flexure with elasticity for supporting a head slider having at least one head element; a first load beam having first ribs for reinforcement at both side ends of the first load beam, for supporting the flexure; and a second load beam having second ribs for reinforcement at both side ends of the second load beam, at least a part of the second load beam being overlapped with the first load beam and being fixed to the first load beam, at least a part of the first and second ribs being overlapped with each other.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: February 19, 2008
    Assignee: TDK Corporation
    Inventors: Yoshimitsu Wada, Takeshi Wada, Takashi Honda, Yoshihisa Higuchi
  • Publication number: 20070223143
    Abstract: A suspension is provided for improving reliability in reading/writing of data by improving stiffness in a longitudinal direction of a flexure while realizing low pitch/roll stiffness of a tongue part. The suspension includes: a flexure, including two branched outrigger parts extending to the tip side of the flexure, and a tongue part for mounting a magnetic head slider, located between the outrigger parts and linked to the tip sides of the outrigger parts; a trace formed on the flexure; and a fixed part in which at least a part of a bent part formed in the trace is fixed to the tongue part.
    Type: Application
    Filed: March 20, 2007
    Publication date: September 27, 2007
    Applicant: SAE MAGNETICS (H.K.) Ltd.
    Inventors: Hidetoshi MATSUI, Takashi HONDA, Yoshimitsu WADA
  • Patent number: 7141508
    Abstract: A manufacturing method of an MR thin-film magnetic head with an MR film and lead conductors overlapping each other, includes a step of depositing a conductor layer on at least the magnetoresistive effect film, a step of forming a cap layer patterned on the deposited conductor layer, and a step of dry-etching the deposited conductor layer through a mask of the patterned cap layer using an Ar gas and an O2 gas, an O2 gas or a N2 gas so as to pattern the deposited conductor film to form the lead conductors.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: November 28, 2006
    Assignee: TDK Corporation
    Inventors: Katsuya Kanakubo, Yoshimitsu Wada, Kazuhiro Hattori
  • Publication number: 20050128644
    Abstract: A suspension is provided, which comprises: a flexure with elasticity for supporting a head slider having at least one head element; a first load beam having first ribs for reinforcement at both side ends of the first load beam, for supporting the flexure; and a second load beam having second ribs for reinforcement at both side ends of the second load beam, at least a part of the second load beam being overlapped with the first load beam and being fixed to the first load beam, at least a part of the first and second ribs being overlapped with each other.
    Type: Application
    Filed: November 29, 2004
    Publication date: June 16, 2005
    Applicant: TDK CORPORATION
    Inventors: Yoshimitsu Wada, Takeshi Wada, Takashi Honda, Yoshihisa Higuchi
  • Patent number: 6665145
    Abstract: In conjunction with a so-called patterned medium including recording tracks each having an array of unit minute recording portions of a magnetic material separated by non-recording portions of a nonmagnetic material, a magnetic head slider is prevented from sticking to the medium. The magnetic recording medium includes recording tracks each having an array of unit minute recording portions of a magnetic material separated by non-recording portions of a nonmagnetic material. The surface height of the unit minute recording portions is set higher than the surface height of the non-recording portions.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: December 16, 2003
    Assignee: TDK Corporation
    Inventor: Yoshimitsu Wada
  • Publication number: 20030146186
    Abstract: A manufacturing method of an MR thin-film magnetic head with an MR film and lead conductors overlapping each other, includes a step of depositing a conductor layer on at least the magnetoresistive effect film, a step of forming a cap layer patterned on the deposited conductor layer, and a step of dry-etching the deposited conductor layer through a mask of the patterned cap layer using an Ar gas and an O2 gas, an O2 gas or a N2 gas so as to pattern the deposited conductor film to form the lead conductors.
    Type: Application
    Filed: August 7, 2002
    Publication date: August 7, 2003
    Applicant: TDK CORPORATION
    Inventors: Katsuya Kanakubo, Yoshimitsu Wada, Kazuhiro Hattori
  • Patent number: D489075
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: April 27, 2004
    Assignee: TDK Corporation
    Inventors: Yoshimitsu Wada, Tetsuya Roppongi, Takeshi Wada, Isamu Sato