Patents by Inventor Yoshimitsu Wada
Yoshimitsu Wada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11959979Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: GrantFiled: March 8, 2023Date of Patent: April 16, 2024Assignee: TDK CORPORATIONInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Publication number: 20230251331Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: ApplicationFiled: March 8, 2023Publication date: August 10, 2023Applicant: TDK CorporationInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Patent number: 11630165Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: GrantFiled: March 24, 2022Date of Patent: April 18, 2023Assignee: TDK CORPORATIONInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Publication number: 20220337605Abstract: An object is to provide a management apparatus for reducing undeclared claims for cyber attacks. A management apparatus (10) according to a first example aspect of the present disclosure includes a data collection unit (11) for collecting, from a security apparatus configured to monitor a network managed by a cyber insurance policyholder, security information related to data indicating a suspected occurrence of a cyber attack and detected based on a predetermined communication pattern and a determination unit (12) for determining whether or not the security information satisfies a coverage trigger condition by using a database for managing the coverage trigger condition, the coverage trigger condition defining a coverage criteria of cyber insurance.Type: ApplicationFiled: September 30, 2019Publication date: October 20, 2022Applicant: NEC CorporationInventors: Hidehisa TOYAMA, Yoshimitsu Wada, Masahiko Honda
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Publication number: 20220214409Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: ApplicationFiled: March 24, 2022Publication date: July 7, 2022Applicant: TDK CORPORATIONInventors: Kunihiro UEDA, Yoshimitsu WADA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Tsuyoshi UMEHARA
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Patent number: 11313920Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: GrantFiled: March 12, 2020Date of Patent: April 26, 2022Assignee: TDK CORPORATIONInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Publication number: 20200209324Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: ApplicationFiled: March 12, 2020Publication date: July 2, 2020Applicant: TDK CORPORATIONInventors: Kunihiro UEDA, Yoshimitsu WADA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Tsuyoshi UMEHARA
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Patent number: 10634734Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: GrantFiled: July 5, 2017Date of Patent: April 28, 2020Assignee: TDK CORPORATIONInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Publication number: 20180017634Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: ApplicationFiled: July 5, 2017Publication date: January 18, 2018Applicant: TDK CORPORATIONInventors: Kunihiro UEDA, Yoshimitsu WADA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Tsuyoshi UMEHARA
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Publication number: 20170052232Abstract: A magnetic sensor device that can prevent an increase in detection error even when stress is applied to a magnetic sensor chip due to heat generation or the like at the time of operation includes a magnetic sensor chip that has a nearly-square shape in a plan view, and a die pad having a mounting surface where the magnetic sensor chip is mounted. Opening portions are formed at positions where four corners of the magnetic sensor chip mounted on the mounting surface overlap, respectively. An area ratio of the opening portions to an area of the die pad is 20% or greater. Also, an area of the overlapped portions with the magnetic sensor chip and the opening portions is 40% or greater relative to the area of the opening portions in a plan view of the die pad.Type: ApplicationFiled: June 29, 2016Publication date: February 23, 2017Inventors: Yoshimitsu WADA, Kunihiro UEDA
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Patent number: 9372243Abstract: The magnetic sensor of the invention comprises a base portion, a sensor chip positioned on the base portion, a wiring portion adapted to electrically connect a terminal of the sensor chip to a connecting lead, a resin having a low elastic modulus for coating at least the sensor chip, and a resin having a high elastic modulus for coating at least the low elastic-modulus resin and the wiring portion, wherein the sensor chip includes a magneto-resistive effect device, and the low elastic-modulus resin has an elastic modulus ranging from 10 kPa to 80 MPa while the high elastic-modulus resin has an elastic modulus of 1 GPa or more, and enables the sensor chip to perform well in a good state although having a structure of sealing up the sensor chip with the resin member.Type: GrantFiled: July 18, 2014Date of Patent: June 21, 2016Assignee: TDK CORPORATIONInventors: Yoshimitsu Wada, Nozomu Hachisuka, Yoshihiro Kudo, Jun Ono, Nobutaka Nishio
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Publication number: 20150054498Abstract: The magnetic sensor of the invention comprises a base portion, a sensor chip positioned on the base portion, a wiring portion adapted to electrically connect a terminal of the sensor chip to a connecting lead, a resin having a low elastic modulus for coating at least the sensor chip, and a resin having a high elastic modulus for coating at least the low elastic-modulus resin and the wiring portion, wherein the sensor chip includes a magneto-resistive effect device, and the low elastic-modulus resin has an elastic modulus ranging from 10 kPa to 80 MPa while the high elastic-modulus resin has an elastic modulus of 1 GPa or more, and enables the sensor chip to perform well in a good state although having a structure of sealing up the sensor chip with the resin member.Type: ApplicationFiled: July 18, 2014Publication date: February 26, 2015Inventors: Yoshimitsu WADA, Nozomu HACHISUKA, Yoshihiro KUDO, Jun ONO, Nobutaka NISHIO
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Patent number: 7957101Abstract: A suspension is provided for improving reliability in reading/writing of data by improving stiffness in a longitudinal direction of a flexure while realizing low pitch/roll stiffness of a tongue part. The suspension includes: a flexure, including two branched outrigger parts extending to the tip side of the flexure, and a tongue part for mounting a magnetic head slider, located between the outrigger parts and linked to the tip sides of the outrigger parts; a trace formed on the flexure; and a fixed part in which at least a part of a bent part formed in the trace is fixed to the tongue part.Type: GrantFiled: March 20, 2007Date of Patent: June 7, 2011Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Hidetoshi Matsui, Takashi Honda, Yoshimitsu Wada
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Patent number: 7333299Abstract: A suspension is provided, which comprises: a flexure with elasticity for supporting a head slider having at least one head element; a first load beam having first ribs for reinforcement at both side ends of the first load beam, for supporting the flexure; and a second load beam having second ribs for reinforcement at both side ends of the second load beam, at least a part of the second load beam being overlapped with the first load beam and being fixed to the first load beam, at least a part of the first and second ribs being overlapped with each other.Type: GrantFiled: November 29, 2004Date of Patent: February 19, 2008Assignee: TDK CorporationInventors: Yoshimitsu Wada, Takeshi Wada, Takashi Honda, Yoshihisa Higuchi
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Publication number: 20070223143Abstract: A suspension is provided for improving reliability in reading/writing of data by improving stiffness in a longitudinal direction of a flexure while realizing low pitch/roll stiffness of a tongue part. The suspension includes: a flexure, including two branched outrigger parts extending to the tip side of the flexure, and a tongue part for mounting a magnetic head slider, located between the outrigger parts and linked to the tip sides of the outrigger parts; a trace formed on the flexure; and a fixed part in which at least a part of a bent part formed in the trace is fixed to the tongue part.Type: ApplicationFiled: March 20, 2007Publication date: September 27, 2007Applicant: SAE MAGNETICS (H.K.) Ltd.Inventors: Hidetoshi MATSUI, Takashi HONDA, Yoshimitsu WADA
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Patent number: 7141508Abstract: A manufacturing method of an MR thin-film magnetic head with an MR film and lead conductors overlapping each other, includes a step of depositing a conductor layer on at least the magnetoresistive effect film, a step of forming a cap layer patterned on the deposited conductor layer, and a step of dry-etching the deposited conductor layer through a mask of the patterned cap layer using an Ar gas and an O2 gas, an O2 gas or a N2 gas so as to pattern the deposited conductor film to form the lead conductors.Type: GrantFiled: August 7, 2002Date of Patent: November 28, 2006Assignee: TDK CorporationInventors: Katsuya Kanakubo, Yoshimitsu Wada, Kazuhiro Hattori
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Publication number: 20050128644Abstract: A suspension is provided, which comprises: a flexure with elasticity for supporting a head slider having at least one head element; a first load beam having first ribs for reinforcement at both side ends of the first load beam, for supporting the flexure; and a second load beam having second ribs for reinforcement at both side ends of the second load beam, at least a part of the second load beam being overlapped with the first load beam and being fixed to the first load beam, at least a part of the first and second ribs being overlapped with each other.Type: ApplicationFiled: November 29, 2004Publication date: June 16, 2005Applicant: TDK CORPORATIONInventors: Yoshimitsu Wada, Takeshi Wada, Takashi Honda, Yoshihisa Higuchi
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Patent number: 6665145Abstract: In conjunction with a so-called patterned medium including recording tracks each having an array of unit minute recording portions of a magnetic material separated by non-recording portions of a nonmagnetic material, a magnetic head slider is prevented from sticking to the medium. The magnetic recording medium includes recording tracks each having an array of unit minute recording portions of a magnetic material separated by non-recording portions of a nonmagnetic material. The surface height of the unit minute recording portions is set higher than the surface height of the non-recording portions.Type: GrantFiled: February 9, 2000Date of Patent: December 16, 2003Assignee: TDK CorporationInventor: Yoshimitsu Wada
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Publication number: 20030146186Abstract: A manufacturing method of an MR thin-film magnetic head with an MR film and lead conductors overlapping each other, includes a step of depositing a conductor layer on at least the magnetoresistive effect film, a step of forming a cap layer patterned on the deposited conductor layer, and a step of dry-etching the deposited conductor layer through a mask of the patterned cap layer using an Ar gas and an O2 gas, an O2 gas or a N2 gas so as to pattern the deposited conductor film to form the lead conductors.Type: ApplicationFiled: August 7, 2002Publication date: August 7, 2003Applicant: TDK CORPORATIONInventors: Katsuya Kanakubo, Yoshimitsu Wada, Kazuhiro Hattori
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Patent number: D489075Type: GrantFiled: September 20, 2001Date of Patent: April 27, 2004Assignee: TDK CorporationInventors: Yoshimitsu Wada, Tetsuya Roppongi, Takeshi Wada, Isamu Sato