Abstract: In the past, it was difficult to fix an adherend sufficiently during polishing processing and to peel off the adherend conveniently. Provided is a non-reactive temporary fixing composition for plane polishing having a shear stress strength of not less than 0.05 MPa and a normal stress strength of less than 100 N.

Abstract: The present invention provides a temporary fixing composition capable of fixing wafers and the like and metals with high adhesive strength and removing easily and completely the wafers and the like and the metals without breakage thereof. The temporary fixing composition used for flat surface polishing includes the following components (A) to (C): Component (A): a thermoplastic resin polymerized from an ?-olefin having 16 to 35 carbon atoms alone; Component (B): a hydrogenated tackifier; and Component (C): a hydrocarbon compound which is in the state of a solid at 25° C., and having a melt viscosity of 1 to 5000 mPa·s at 100° C. and a Shore D hardness of 30 to 100.

Abstract: In the past, it was difficult to fix an adherend sufficiently during polishing processing and to peel off the adherend conveniently. Provided is a non-reactive temporary fixing composition for plane polishing having a shear strength of not less than 0.05 MPa and a peeling strength of less than 100 N.