Patents by Inventor Yoshinao Kitamura

Yoshinao Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020076545
    Abstract: The present invention provides a pressure-sensitive adhesion sheet being excellent in moisture and heat resistance and having a high adhesion to inorganic materials such as glass and tile, particularly a high adhesion even under high temperature and high humidity conditions, without using a silane coupling agent. The pressure-sensitive adhesion sheet for a silicone oxide-containing material comprises a base material having formed on at least one surface thereof a layer composed of an acrylic pressure-sensitive adhesive, wherein the base material is selected from a foamed base material having a water absorption rate less than 15% by weight after having been immersed in warm water having a temperature of 40° C. for 24 hours and a plastic film having a water vapor permeability of 500 g or less/m2/24 hours, and the acrylic pressure-sensitive adhesive to be used in combination with the base material selected is specified.
    Type: Application
    Filed: December 7, 2001
    Publication date: June 20, 2002
    Applicant: NITTO DENKO
    Inventors: Katsunari Oji, Yoshinao Kitamura, Takao Yoshikawa
  • Patent number: 6337128
    Abstract: The present invention provides a pressure-sensitive adhesion sheet being excellent in moisture and heat resistance and having a high adhesion to inorganic materials such as glass and tile, particularly a high adhesion even under high temperature and high humidity conditions, without using a silane coupling agent. The pressure-sensitive adhesion sheet for a silicone oxide-containing material comprises a base material having formed on at least one surface thereof a layer composed of an acrylic pressure-sensitive adhesive, wherein the base material is selected from a foamed base material having a water absorption rate less than 15% by weight after having been immersed in warm water having a temperature of 40° C. for 24 hours and a plastic film having a water vapor permeability of 500 g or less/m2/24 hours, and the acrylic pressure-sensitive adhesive to be used in combination with the base material selected is specified.
    Type: Grant
    Filed: December 15, 1998
    Date of Patent: January 8, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Katsunari Oji, Yoshinao Kitamura, Takao Yoshikawa
  • Patent number: 5759679
    Abstract: An adhesive sheet with a foamed substrate, comprising a substrate comprising a foamed elastomer having specific properties, and a layer of a pressure-sensitive adhesive formed on the substrate. Due to use of the substrate having specific properties, the adhesive sheet has excellent adhesive properties to rough surfaces and also has excellent oil resistant adhesive properties.
    Type: Grant
    Filed: September 9, 1996
    Date of Patent: June 2, 1998
    Assignee: Nitto Denko Corporation
    Inventors: Yoshinao Kitamura, Katsunari Oji, Hiroshi Sugawa
  • Patent number: 5334447
    Abstract: A foam substrate-attached adhesive sheet or tape comprising a substrate having formed thereon a layer of a pressure-sensitive adhesive, wherein the substrate is a foam elastomer having a breaking elongation of at least 800% and an apparent 800% modulus of from 1.0 to 15 kg/cm.sup.2 in a tensile test of 23.degree. C., and a breaking elongation of at least 400% and an apparent 400% modulus of from 2.0 to 60 kg/cm.sup.2 in a tensile test of -30.degree. C.
    Type: Grant
    Filed: December 3, 1993
    Date of Patent: August 2, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Yoshinao Kitamura, Shinkiti Yamashita, Yasuyuki Tokunaga, Masahiko Ando, Takeshi Yamanaka
  • Patent number: 5334686
    Abstract: A pressure-sensitive adhesive and adhesive sheets using the pressure-sensitive adhesive are disclosed. The pressure-sensitive adhesive comprising (a) from 50 to 84% by weight of an acrylic monomer, (b) from 15 to 28% by weight of an N,N-di-substituted (meth)acrylamide, (c) from 1 to 10% by weight of a monomer having an acid group, and (d) from 0 to 25% by weight of other monomer copolmerizable with the components (a) to (c).
    Type: Grant
    Filed: November 30, 1993
    Date of Patent: August 2, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Masahiko Ando, Takeshi Yamanaka, Yutaka Moroishi, Yasuyuki Tokunaga, Yoshinao Kitamura