Abstract: A dielectric display device includes a pair of substrates, at least one of which is transparent, spaced in parallel a constant distance apart, and facing each other. A dielectric display material is inserted between the pair of substrates. Further, a pair of electrodes, at least one of which includes a plurality of line (or scanning) electrodes, are disposed on the sides of the substrate facing the other substrate. Finally, a static erasing conductor is disposed extending peripherally along, and spaced a constant distance from, the ends of the electrodes for preventing intrusion of static electricity into electric lead lines.

Abstract: A method for mounting a semiconductor chip on a first wire board, bonding a second wire board to a connecting terminal of the first wire board with a thermo-setting layer of anisotropic conductivity, covering the undersurface and periphery of the semiconductor chip by a first thermo-setting epoxy resin so as to embed and seal the semiconductor chip therein, and cover the connecting part of the first wire board and the second wire board by a second thermo-setting epoxy resin.