Abstract: A plasma processing apparatus which forms a first film on a pattern formed on a substrate having dense and coarse areas, and then performs sputtering or etching on the first film.

Abstract: A method for producing a microlens according to the present invention includes an etching step and a surface treatment step. In the etching step, a target object which is obtained by forming a second organic film having a lens shape on a first organic film that is formed on a substrate is subjected to etching that uses a plasma of a first processing gas, while using the second organic film as a mask, so that the first organic film is etched so as to transfer the lens shape of the second organic film to the first organic film, thereby forming a microlens in the first organic film. In the surface treatment step, a surface treatment is performed so as to smooth the surface of the microlens that is formed in the first organic film.

Abstract: A plasma processing apparatus which forms a first film on a pattern formed on a substrate having dense and coarse areas, and then performs sputtering or etching on the first film.

Abstract: A plasma processing method performed using a plasma processing apparatus includes a first step of forming a first film on a pattern formed on a substrate and having dense and coarse areas, and a second step of performing sputtering or etching on the first film.

Abstract: A plasma processing method performed using a plasma processing apparatus includes a first step of forming a first film on a pattern formed on a substrate and having dense and coarse areas, and a second step of performing sputtering or etching on the first film.

Abstract: A method for producing a microlens according to the present invention includes an etching step and a surface treatment step. In the etching step, a target object which is obtained by forming a second organic film having a lens shape on a first organic film that is formed on a substrate is subjected to etching that uses a plasma of a first processing gas, while using the second organic film as a mask, so that the first organic film is etched so as to transfer the lens shape of the second organic film to the first organic film, thereby forming a microlens in the first organic film. In the surface treatment step, a surface treatment is performed so as to smooth the surface of the microlens that is formed in the first organic film.

Abstract: A method of selectively etching a first region R1 made of silicon oxide with respect to a second region R2 made of silicon nitride by performing a plasma processing upon a processing target object is provided. The processing target object has the second region R2 forming a recess; the first region R1 configured to fill the recess; and a mask MK provided on the first region R1. The method includes a first process of generating plasma of a processing gas containing a fluorocarbon gas, and a second process of etching the first region with radicals of fluorocarbon contained in a deposit. In the second process, a high frequency power contributing to the generating of the plasma is applied in a pulse shape, and these processes are repeated.

Abstract: A method of selectively etching a first region R1 made of silicon oxide with respect to a second region R2 made of silicon nitride by performing a plasma processing upon a processing target object is provided. The processing target object has the second region R2 forming a recess; the first region R1 configured to fill the recess; and a mask MK provided on the first region R1. The method includes a first process of generating plasma of a processing gas containing a fluorocarbon gas, and a second process of etching the first region with radicals of fluorocarbon contained in a deposit. In the second process, a high frequency power contributing to the generating of the plasma is applied in a pulse shape, and these processes are repeated.