Abstract: An electronic device testing apparatus includes a housing unit which disassembles an empty test carrier and assembles the test carrier while housing an untested die in the test carrier, a test unit which tests the die housed in the test carrier, and a retrieving unit which disassembles the test carrier, retrieves the tested die from the test carrier, and reassembles the empty test carrier.

Abstract: A test carrier includes a base member and a cover member between which a die is interposed. The base film of the base member has: first interconnect patterns which are formed in advance; and a printing region where second interconnect patterns which electrically connect to the first interconnect patterns are to be formed by printing.

Abstract: A carrier disassembling apparatus which disassembles a test carrier including a base member and a cover member coming into close contact with each other, includes: a first reversing arm which sucks and holds the cover member; and a disassembly table which sucks and holds the base member. The first reversing arm can approach and separate from the disassembly table. The first reversing arm includes a first contract surface which comes into contact with the cover member. The first contract surface includes a protrusion which protrudes toward the cover member.

Abstract: A test carrier includes a film-shaped base film which has first bumps which contact test pads of a die; and a cover film which is superposed over the base film, and the test carrier holds the die between the base film and the cover film. The first bumps are relatively higher than second bumps which the die has.

Abstract: [Problem] A carrier assembly apparatus which is able to be streamlined in structure is provided. [Solution] The carrier assembly apparatus 1 comprises: an assembly table 31 which supports a base member 70 on which a die 90 is placed, a holding head 46 which holds a cover member 80, a pressure reduction head 44 which has a pressure reduction chamber 443 accommodating the cover member 80 and having an opening part 444 and which abuts against the assembly table 31 so as to form a sealed space, a first elevating actuator 43 which simultaneously move the holding head 46 and the pressure reduction head 44 to the assembly table 31, and a second elevating actuator 47 which moves the holding head 46 relative to the pressure reduction head 44.

Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.

Abstract: [Problem] A test carrier able to secure a high air-tightness is provided. [Solution] A test carrier 10 comprises a cover member 50A and a base member 20A which are bonded together while sandwiching a die 90 between them. ultraviolet rays can pass through the cover member 50A.

Abstract: [Object] To provide a carrier disassembling apparatus capable of disassembling a carrier for test. [Means for solving] A carrier disassembling apparatus 1, which disassembles a carrier for test 60, comprises a holding head 11 that holds a cover member 80, a holding table 20 that holds a base member 70, and a first carrier arm 16 that causes the holding head 11 to depart relatively from the holding table 20 to separate the cover member 80 and the base member 70 from each other, the holding head 11 has a first closing member 12 that forms a first closed space 13 between the holding head 11 and the cover member 80, the holding table 20 has a second closing member 21 that forms a second closed space 24 between the holding table 20 and the base member 70, and the carrier disassembling apparatus 1 further comprises a vacuum pump 90 that reduces pressure within the closed spaces 13 and 24.

Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.

Abstract: Provided is a manufacturing apparatus that manufactures an integrated circuit package by packaging an integrated circuit chip, the manufacturing apparatus comprising a flattening section that flattens the integrated circuit chip; a holding section that holds a base substrate; a transporting section that transports the flattened integrated circuit chip to load the integrated circuit chip on the base substrate held by the holding section; and a packaging section that packages the integrated circuit chip and the base substrate as the integrated circuit package.

Abstract: A test carrier 10A comprises: a base board 21A which holds a die 90; and a cover board 31A which is laid over the base board 21A so as to cover the die 90. The test carrier 10A comprises a seal member 24 which is interposed between the base board 21A and the cover board 31A and which surrounds the die 90.

Abstract: A test carrier 10 comprises: a film-shaped base film 40 which has first bumps 42 which contact test pads 91 of a die 90; and a cover film 70 which is superposed over the base film 40, and the test carrier 10 holds the die 90 between the base film 40 and the cover film 70. The first bumps 42 are relatively higher than second bumps 92 which the die 90 has.

Abstract: A test carrier includes a base member and a cover member between which a die is interposed. The base film of the base member has: first interconnect patterns which are formed in advance; and a printing region where second interconnect patterns which electrically connect to the first interconnect patterns are to be formed by printing.

Abstract: A carrier disassembling apparatus 1, which disassembles a carrier for test 60, comprises a holding head 11 that holds a cover member 80, a holding table 20 that holds a base member 70, and a first carrier arm 16 that causes the holding head 11 to depart relatively from the holding table 20 to separate the cover member 80 and the base member 70 from each other, the holding head 11 has a first closing member 12 that forms a first closed space 13 between the holding head 11 and the cover member 80, the holding table 20 has a second closing member 21 that forms a second closed space 24 between the holding table 20 and the base member 70, and the carrier disassembling apparatus 1 further comprises a vacuum pump 90 that reduces pressure within the closed spaces 13 and 24.

Abstract: [Problem] A test carrier able to secure a high air-tightness is provided. [Solution] A test carrier 10 comprises a cover member 50A and a base member 20A which are bonded together while sandwiching a die 90 between them. ultraviolet rays can pass through the cover member 50A. [Selected Drawings] FIG.

Abstract: [Problem] A carrier assembly apparatus which is able to be streamlined in structure is provided. [Solution] The carrier assembly apparatus 1 comprises: an assembly table 31 which supports a base member 70 on which a die 90 is placed, a holding head 46 which holds a cover member 80, a pressure reduction head 44 which has a pressure reduction chamber 443 accommodating the cover member 80 and having an opening part 444 and which abuts against the assembly table 31 so as to form a sealed space, a first elevating actuator 43 which simultaneously move the holding head 46 and the pressure reduction head 44 to the assembly table 31, and a second elevating actuator 47 which moves the holding head 46 relative to the pressure reduction head 44.

Abstract: The electronic device mounting apparatus 1 comprises: a first camera 123 for imaging a flexible board 74 of a base member 70 of a test carrier 60 to generate a first image information; an image processing apparatus 40 for detecting a position of an alignment mark 79 of the flexible board 74 from the first image information and calculating a print start position 782 of the first interconnect patterns 78 on the flexible board 74 on the basis of the position of the alignment mark 79; a printing head 122 for forming a first interconnect pattern 78 on the flexible board 74 from the print start position 782; and a second conveyor arm 21 for mounting a die 90 on the flexible board 74 on which the first interconnect pattern 78 is formed.

Abstract: Provided is a manufacturing apparatus that manufactures an integrated circuit package by packaging an integrated circuit chip, the manufacturing apparatus comprising a flattening section that flattens the integrated circuit chip; a holding section that holds a base substrate; a transporting section that transports the flattened integrated circuit chip to load the integrated circuit chip on the base substrate held by the holding section; and a packaging section that packages the integrated circuit chip and the base substrate as the integrated circuit package.