Patents by Inventor Yoshinari Sasaki
Yoshinari Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8809732Abstract: An ablation method including a steps of ablating a region of a substrate (1) by a laser beam (3); and removing debris ablated from the region (1) by a flow of a fluid (7), namely, a gas or vapor, a liquid or a combination of the fluids. The flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter remove the entrapped debris from the region by directing the flow of fluid, with any entrapped debris, away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.Type: GrantFiled: December 19, 2012Date of Patent: August 19, 2014Assignees: TEL Solar AG, Sony CorporationInventors: Neil Sykes, Yoshinari Sasaki, Hidehisa Murase, Naoki Yamada, Kosei Aso
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Patent number: 8581140Abstract: A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.Type: GrantFiled: August 25, 2006Date of Patent: November 12, 2013Assignees: Sony Corporation, Exitech LimitedInventors: Kosei Aso, Yoshinari Sasaki, Hidehisa Murase, Naoki Yamada
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Patent number: 8555703Abstract: A leakage diagnosis apparatus for diagnosing presence/absence of refrigerant leakage in a refrigerant circuit performing a refrigeration cycle, wherein refrigerant leakage diagnosis using the amount of refrigerant exergy loss in a circuit component of the refrigerant circuit is realized. In a leakage diagnosis apparatus, an exergy calculation section calculates a leakage index value which changes in accordance with the amount of refrigerant leaking out of a refrigerant circuit based on the amount of refrigerant exergy loss in the circuit component. Then, a leakage determination section determines whether there is refrigerant leakage in the refrigerant circuit based on the leakage index value calculated by the exergy calculation section.Type: GrantFiled: September 24, 2009Date of Patent: October 15, 2013Assignee: Daikin Industries, Ltd.Inventors: Tsuyoshi Yonemori, Yoshinari Sasaki, Takahiro Yamaguchi, Manabu Yoshimi
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Patent number: 8350582Abstract: A fluid sensor for detecting refrigerant leakage from a refrigerant circuit includes a sensor main body having two electrodes spaced apart from each other. The fluid sensor is configured such that the fluid sensor is connectable to an impedance measurement device to measure impedance between the two electrodes.Type: GrantFiled: October 22, 2008Date of Patent: January 8, 2013Assignee: Daikin Industries, Ltd.Inventors: Yoshinari Sasaki, Takahiro Yamaguchi, Tsuyoshi Yonemori, Manabu Yoshimi, Youyou Xu
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Patent number: 8344285Abstract: The invention firstly comprises a method of ablation processing including a step of ablating a region of a substrate (1) by way of a laser beam (3) characterized by a further step of removing debris ablated from the region (1) by way of a flow of a fluid (7), namely a gas or vapour, a liquid or a combination of these, wherein the flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter to remove the entrapped debris from the region by directing the flow of fluid with any entrapped debris away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.Type: GrantFiled: June 13, 2005Date of Patent: January 1, 2013Assignees: Exitech Limited, Sony CorporationInventors: Neil Sykes, Yoshinari Sasaki, Hidehisa Murase, Naoki Yamada, Kousei Aso
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Patent number: 8288681Abstract: A laser processing apparatus is provided. The laser processing apparatus removes and extracts debris generated by irradiating a transparent resin layer formed on a substrate with laser light during a patterning process, and includes a debris extraction module provided on the upper side of the substrate, wherein the debris extraction module sucks and extracts debris due to sublimation, thermal processing and composite action thereof generated from the transparent resin layer on the substrate irradiated with the laser light from the lower side thereof.Type: GrantFiled: September 6, 2006Date of Patent: October 16, 2012Assignee: Sony CorporationInventors: Hidehisa Murase, Yoshinari Sasaki, Kosei Aso, Naoki Yamada
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Patent number: 8283596Abstract: A laser processing apparatus is provided for patterning with laser light a resin film or a metal film formed on a substrate. The apparatus includes a laser light source; and a debris collection device having a transmission window through which the laser light is transmitted, a vortex generation mechanism generating a vortex gas flow by allowing gas to flow into a region near a laser light-irradiated area of the resin film or the metal film, and a screening device having an opening through which the incident laser light passes and screening a flow of debris. The mechanism is placed close to the resin film or the metal film on the substrate. Debris generated by laser light irradiation and before and after being stacked on the object film is entrained in the vortex gas flow generated by the vortex generation mechanism and is exhausted to outside through the screening device.Type: GrantFiled: June 12, 2008Date of Patent: October 9, 2012Assignee: Sony CorporationInventors: Hidehisa Murase, Yoshinari Sasaki, Kosei Aso, Naoki Yamada
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Patent number: 8132419Abstract: In a refrigeration system (10) that includes a refrigerant circuit (20) configured by connecting a plurality of circuit component parts including a compressor (30), a pressure reduction device (36, 39) and a plurality of heat exchangers (34, 37) and operates in a refrigeration cycle by circulating refrigerant through the refrigerant circuit (20), a refrigerant state detection section (51) is provided for detecting the refrigerant temperatures and entropies at the entrance and exit of each of the compressor (30), the pressure reduction device (36, 39) and the heat exchangers (34, 37), and a variation calculation section (52) is provided that uses the refrigerant temperatures and entropies detected by the refrigerant state detection section (51) to separately calculate the magnitude of energy variation of refrigerant produced in each of the circuit component parts.Type: GrantFiled: March 23, 2007Date of Patent: March 13, 2012Assignee: Daikin Industries, Ltd.Inventors: Tsuyoshi Yonemori, Yoshinari Sasaki, Takahiro Yamaguchi
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Publication number: 20110227255Abstract: Disclosed herein is a manufacturing method for a molded article having a very fine uneven surface structure wherein, while a laser irradiation region is successively moved with respect to a working face of a working object article for each one shot, a laser beam is repetitively irradiated upon the working face of the working object article, the manufacturing method including the steps of: setting an energy density for the laser beam; setting a number of shots with which a desired fine shape is to be formed; calculating a speed of movement of the laser irradiation region with respect to the working face; and irradiating the laser beam of the set energy density while the working face is moved relative to the laser irradiation region at the calculated speed of movement to form a very fine uneven structure formed from working marks on the working face on which the fine shape is formed.Type: ApplicationFiled: February 23, 2011Publication date: September 22, 2011Applicant: Sony CorporationInventors: Hidehisa Murase, Yoshinari Sasaki, Shunsuke Matsui, Kosei Aso
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Publication number: 20110174059Abstract: A leakage diagnosis apparatus for diagnosing presence/absence of refrigerant leakage in a refrigerant circuit performing a refrigeration cycle, wherein refrigerant leakage diagnosis using the amount of refrigerant exergy loss in a circuit component of the refrigerant circuit is realized. In a leakage diagnosis apparatus, an exergy calculation section calculates a leakage index value which changes in accordance with the amount of refrigerant leaking out of a refrigerant circuit based on the amount of refrigerant exergy loss in the circuit component. Then, a leakage determination section determines whether there is refrigerant leakage in the refrigerant circuit based on the leakage index value calculated by the exergy calculation section.Type: ApplicationFiled: September 24, 2009Publication date: July 21, 2011Inventors: Tsuyoshi Yonemori, Yoshinari Sasaki, Takahiro Yamaguchi, Manabu Yoshimi
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Patent number: 7863542Abstract: A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas.Type: GrantFiled: August 25, 2006Date of Patent: January 4, 2011Assignees: Sony Corporation, Exitech LimitedInventors: Hidehisa Murase, Yoshinari Sasaki, Kosei Aso, Naoki Yamada
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Publication number: 20100244863Abstract: It is possible to detect refrigerant leakage while pinpointing the location where refrigerant leakage is occurring in a refrigerant circuit of a refrigeration system. A fluid sensor (8) is a fluid sensor for detecting refrigerant leakage from a refrigerant circuit (10), wherein the fluid sensor includes a sensor main body (8a) having two electrodes (81, 82) spaced apart, and the fluid sensor (8) is configured such that the fluid sensor (8) is capable of being connected to an impedance measurement device (9) for measuring impedance between the two electrodes (81, 82).Type: ApplicationFiled: October 22, 2008Publication date: September 30, 2010Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Yoshinari Sasaki, Takahiro Yamaguchi, Tsuyoshi Yonemori, Manabu Yoshimi, Youyou Xu
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Patent number: 7784303Abstract: A positive displacement expander includes a volume change mechanism (90) for changing the volume of a first fluid chamber (72) of an expansion mechanism (60). The expansion mechanism (60) includes a first rotary mechanism (70) and a second rotary mechanism (80) each having a cylinder (71, 81) containing a rotor (75, 85). The first fluid chamber (72) of the first rotary mechanism (70) and a second fluid chamber (82) of the second rotary mechanism (80) are in fluid communication with each other to form an actuation chamber (66). Meanwhile, the first fluid chamber (72) of the first rotary mechanism (70) is smaller than the second fluid chamber (82) of the second rotary mechanism (80). The volume change mechanism (90) includes an auxiliary chamber (93) fluidly communicating with the first fluid chamber (72) and an auxiliary piston (92) for changing the volume of the auxiliary chamber (93). The auxiliary chamber (93) is in fluid communication with the first fluid chamber (72) of the first rotary mechanism (70).Type: GrantFiled: August 5, 2005Date of Patent: August 31, 2010Assignee: Daikin Industries, Ltd.Inventors: Katsumi Sakitani, Michio Moriwaki, Masakazu Okamoto, Eiji Kumakura, Yume Inokuchi, Tetsuya Okamoto, Yoshinari Sasaki
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Patent number: 7730741Abstract: An outdoor heat exchanger (23), an indoor heat exchanger (24), a compression/expansion unit (30), and other circuit components are connected in a refrigerant circuit (20). The compression/expansion unit (30) includes a compression mechanism (50), an electric motor (45), and an expansion mechanism (60). In addition, the refrigerant circuit (20) has an injection pipeline (26). When an injection valve (27) is opened, a portion of high pressure refrigerant after heat dissipation flows into the injection pipeline (26) and is introduced into an expansion chamber (66) of the expansion mechanism (60) in the process of expansion. In the expansion mechanism (60), power is recovered from both high pressure refrigerant introduced into the expansion chamber (66) from an inflow port (34) and high pressure refrigerant introduced into the expansion chamber (66) from the injection pipeline (26).Type: GrantFiled: July 1, 2005Date of Patent: June 8, 2010Assignee: Daikin Industries, Ltd.Inventors: Katsumi Sakitani, Michio Moriwaki, Yume Inokuchi, Yoshinari Sasaki
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Patent number: 7692115Abstract: Disclosed is a laser processing device. The laser processing device includes a laser beam source irradiating a laser beam, and a laser processing head. The laser processing head includes a transmitting window through which the laser beam passes, an aperture formed in a bottom of the laser head and allowing the laser beam to pass through via the transmitting window, an introducing hole introducing a gas into the laser processing head, and an exhausting hole discharging a gas in the laser processing head to outside. The laser processing head further includes a air hole introducing the gas to the periphery of the laser irradiating area, an air hole allowing to discharge the ambient gas of the laser irradiating area, and a masking shield having an opening placed between the transmitting window and the aperture, and an aerating portion communicated with the introducing hole and exhausting hole.Type: GrantFiled: November 1, 2007Date of Patent: April 6, 2010Assignee: Sony CorporationInventors: Yoshinari Sasaki, Kosei Aso, Hidehisa Murase, Naoki Yamada
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Publication number: 20100062222Abstract: Disclosed herein is a die manufacturing method including the steps of: forming a pattern on the machining surface of a cylindrical resin original plate by laser machining; and fabricating a cylindrical die by the electroforming method using the resin original plate having the pattern formed.Type: ApplicationFiled: September 2, 2009Publication date: March 11, 2010Applicant: SONY CORPORATIONInventors: Hidehisa Murase, Yoshinari Sasaki, Kosei Aso, Tomohide Jozaki, Setsuo Okino
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Publication number: 20090151377Abstract: In a refrigeration system (10) that includes a refrigerant circuit (20) configured by connecting a plurality of circuit component parts including a compressor (30), a pressure reduction device (36, 39) and a plurality of heat exchangers (34, 37) and operates in a refrigeration cycle by circulating refrigerant through the refrigerant circuit (20), a refrigerant state detection means (51) is provided for detecting the refrigerant temperatures and entropies at the entrance and exit of each of the compressor (30), the pressure reduction device (36, 39) and the heat exchangers (34, 37), and a variation calculation means (52) is provided that uses the refrigerant temperatures and entropies detected by the refrigerant state detection means (51) to separately calculate the magnitude of energy variation of refrigerant produced in each of the circuit component parts.Type: ApplicationFiled: March 23, 2007Publication date: June 18, 2009Inventors: Tsuyoshi Yonemori, Yoshinari Sasaki, Takahiro Yamaguchi
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Publication number: 20090113907Abstract: A refrigeration apparatus having a refrigerant circuit (20) for performing a vapor compression refrigeration cycle is disclosed. Refrigerant in a wet state, which provides an optimum coefficient of performance (COP) for a present operating condition, is drawn into the compressor (31). If the operating condition changes, the opening of an expansion valve (23) is adjusted such that the suction refrigerant of the compressor (31) is brought into a wet state which provides an optimum coefficient of performance for a new operating condition.Type: ApplicationFiled: September 9, 2005Publication date: May 7, 2009Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Katsumi Sakitani, Michio Moriwaki, Yume Inokuchi, Tetsuya Okamoto, Yoshinari Sasaki, Eiji Kumakura, Masakazu Okamoto
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Publication number: 20090068598Abstract: A laser processing apparatus is provided for patterning with laser light a resin film or a metal film formed on a substrate. The apparatus includes a laser light source; and a debris collection device having a transmission window through which the laser light is transmitted, a vortex generation mechanism generating a vortex gas flow by allowing gas to flow into a region near a laser light-irradiated area of the resin film or the metal film, and a screening device having an opening through which the incident laser light passes and screening a flow of debris. The mechanism is placed close to the resin film or the metal film on the substrate. Debris generated by laser light irradiation and before and after being stacked on the object film is entrained in the vortex gas flow generated by the vortex generation mechanism and is exhausted to outside through the screening device.Type: ApplicationFiled: June 12, 2008Publication date: March 12, 2009Applicant: SONY CORPORATIONInventors: Hidehisa Murase, Yoshinari Sasaki, Kosei Aso, Naoki Yamada
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Publication number: 20080310983Abstract: A positive displacement expander includes a volume change mechanism (90) for changing the volume of a first fluid chamber (72) of an expansion mechanism (60). The expansion mechanism (60) includes a first rotary mechanism (70) and a second rotary mechanism (80) each having a cylinder (71, 81) containing a rotor (75, 85). The first fluid chamber (72) of the first rotary mechanism (70) and a second fluid chamber (82) of the second rotary mechanism (80) are in fluid communication with each other to form an actuation chamber (66). Meanwhile, the first fluid chamber (72) of the first rotary mechanism (70) is smaller than the second fluid chamber (82) of the second rotary mechanism (80). The volume change mechanism (90) includes an auxiliary chamber (93) fluidly communicating with the first fluid chamber (72) and an auxiliary piston (92) for changing the volume of the auxiliary chamber (93). The auxiliary chamber (93) is in fluid communication with the first fluid chamber (72) of the first rotary mechanism (70).Type: ApplicationFiled: August 5, 2005Publication date: December 18, 2008Inventors: Katsumi Sakitani, Michio Moriwaki, Masakazu Okamoto, Eiji Kumakura, Yume Inokuchi, Tetsuya Okamoto, Yoshinari Sasaki