Patents by Inventor Yoshinari Satoda

Yoshinari Satoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin adhesive sheet for working semiconductor wafers
    Patent number: 6010782
    Abstract: A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon--carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.
    Type: Grant
    Filed: September 19, 1997
    Date of Patent: January 4, 2000
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Gosei Uemura, Yoshinari Satoda, Eiji Shigemura
  • Process for working a semiconductor wafer
    Patent number: 5714029
    Abstract: A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon-carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.
    Type: Grant
    Filed: January 6, 1992
    Date of Patent: February 3, 1998
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Gosei Uemura, Yoshinari Satoda, Eiji Shigemura
  • Thin adhesive sheet for working semiconductor wafers
    Patent number: 5637395
    Abstract: A thin adhesive sheet for working semiconductor wafers is described, comprising a light-permeable support and a pressure-sensitive adhesive layer on the support, wherein the adhesive layer is a composition comprising 100 parts by weight of a base polymer, from 1 to 100 parts by weight of a low molecular weight compound containing at least two photopolymerizable carbon-carbon double bonds in the molecule, and from 0.1 to 5 parts by weight of a photopolymerization initiator. This adhesive sheet is firmly bonded to a semiconductor wafer during the wafer cutting process whereafter and during the wafer polishing process. After irradiation, the adhesive force of the adhesive sheet is markedly reduced. As a result, the pick-up operation can be carried out easily. This adhesive sheet is useful in working semiconductor wafers.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: June 10, 1997
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Gosei Uemura, Yoshinari Satoda, Eiji Shigemura