Abstract: A ceramic electronic component includes an element body including a dielectric and internal electrodes; a pair of external electrodes respectively formed on side surfaces of the element body, each of the external electrodes including a base layer and a plating layer formed on at least a part of the base layer, the base layer of each of the external electrodes containing metal and being formed to continuously cover a portion of a lower surface of the element body and the corresponding side surface of the element body connected to the lower surface, the base layer of each of the external electrodes being electrically connected to one or more of the internal electrodes; and an insulating layer formed on an upper surface of the element body, the insulating layer having a thickness that is less than a thickness of the plating layer of each of the external electrodes.

Abstract: A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the multilayer chip having a parallelepiped rectangular shape, the plurality of internal electrode layers being alternately exposed to two opposite faces of the multilayer chip, and two external electrodes that are formed respectively on the two opposite faces. The two external electrodes have a structure in which a plated layer is formed on a conductive thin film intermittently formed with a thickness of 0.1 µm or more and 1.5 µm or less.

Abstract: A capacitor that can make a failure mode into an open mode even when a short circuit caused by insulation breakdown occurs in a dielectric layer is provided. The capacitor includes: a substrate; an MIM structure disposed on the Substrate, the MIM structure including a dielectric layer, a bottom electrode layer disposed on one side of the dielectric layer and composed of a first conductive material, and a top electrode layer disposed on the other side of the dielectric layer; a first external electrode disposed on the substrate; a second external electrode disposed on the substrate; and a connection conductor connecting between the bottom electrode layer and the first external electrode, the connection conductor including a first contact portion contacting the substrate.

Abstract: A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a first side surface facing in a direction of a first axis, a second side surface facing in a direction of a second axis orthogonal to the first axis, a ridge that connects the first side surface and the second side surface to each other, and internal electrodes laminated along a third axis orthogonal to the first axis and the second axis and led out in a lead-out region. The external electrode includes a protrusion provided at a position along the ridge and protruding in the directions of the first axis and the second axis, and a first base portion and a second base portion extending from the protrusion along the first side surface and the second side surface, respectively, the external electrode covering the lead-out region.

Abstract: A ceramic electronic component includes an element body including a dielectric and internal electrodes; a pair of external electrodes respectively formed on side surfaces of the element body, each of the external electrodes including a base layer and a plating layer formed on at least a part of the base layer, the base layer of each of the external electrodes containing metal and being formed to continuously cover a portion of a lower surface of the element body and the corresponding side surface of the element body connected to the lower surface, the base layer of each of the external electrodes being electrically connected to one or more of the internal electrodes; and an insulating layer formed on an upper surface of the element body, the insulating layer having a thickness that is less than a thickness of the plating layer of each of the external electrodes.

Abstract: A trench capacitor according to one embodiment of the present invention includes a base member with an upper surface having a plurality of trenches provided therein and an MIM structure provided on the base member so as to be embedded in the plurality of trenches. In the embodiment, the plurality of trenches include a first trench and a second trench adjacent to the first trench in a first direction orthogonal to a depth direction of the plurality of trenches. The base member includes a first wall separating the first trench from the second trench. The first wall includes a first portion having an acute angle at a distal end thereof in a section including the first direction and the depth direction.

Abstract: A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a first side surface facing in a direction of a first axis, a second side surface facing in a direction of a second axis orthogonal to the first axis, a ridge that connects the first side surface and the second side surface to each other, and internal electrodes laminated along a third axis orthogonal to the first axis and the second axis and led out in a lead-out region. The external electrode includes a protrusion provided at a position along the ridge and protruding in the directions of the first axis and the second axis, and a first base portion and a second base portion extending from the protrusion along the first side surface and the second side surface, respectively, the external electrode covering the lead-out region.

Abstract: A trench capacitor according to one embodiment of the present invention includes a base member with an upper surface having a plurality of trenches provided therein and an MIM structure provided on the base member so as to be embedded in the plurality of trenches. In the embodiment, the plurality of trenches include a first trench and a second trench adjacent to the first trench in a first direction orthogonal to a depth direction of the plurality of trenches. The base member includes a first wall separating the first trench from the second trench. The first wall includes a first portion having an acute angle at a distal end thereof in a section including the first direction and the depth direction.

Abstract: Provided is a method of preventing reverse current flow through an ion exchange membrane electrolyzer, which method is capable of preventing a reverse current from being generated after stopping operation of the ion exchange membrane electrolyzer. A method of preventing reverse current flow through an ion exchange membrane electrolyzer 100, the ion exchange membrane electrolyzer 100 having an anode chamber 107 housing an anode, a cathode chamber 110 housing a cathode, an anode solution-supplying manifold 121 to feed anode solution to the anode chamber 107, and a cathode solution-supplying manifold 124 to feed cathode solution to the cathode chamber 110.

Abstract: Provided is a method of preventing reverse current flow through an ion exchange membrane electrolyzer, which method is capable of preventing a reverse current from being generated after stopping operation of the ion exchange membrane electrolyzer. A method of preventing reverse current flow through an ion exchange membrane electrolyzer 100, the ion exchange membrane electrolyzer 100 having an anode chamber 107 housing an anode, a cathode chamber 110 housing a cathode, an anode solution-supplying manifold 121 to feed anode solution to the anode chamber 107, and a cathode solution-supplying manifold 124 to feed cathode solution to the cathode chamber 110.

Abstract: A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and a close contact portion. The dielectric layer includes a first surface, a second surface facing the first surface, and a plurality of through-holes communicating between the first surface and the second surface. The first internal electrode portion is provided on a first through-hole portion. The second internal electrode portion is provided on a second through-hole portion. The close contact portion brings at least one of the first external electrode layer and the second external electrode layer into close contact with the dielectric layer, the close contact portion being provided on a third through-hole portion, the third through-hole portion being the remaining portion of the plurality of through-holes.

Abstract: A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and an adsorbing portion. The first internal electrode portion is provided on a first through-hole portion, one end of the first internal electrode portion being connected to the first external electrode layer. The second internal electrode portion is provided on a second through-hole portion, one end of the second internal electrode portion being connected to the second external electrode layer. The adsorbing portion adsorbs the first external electrode layer and the second external electrode layer, the adsorbing portion being provided on a third through-hole portion.

Abstract: Proposed are thin film MIM capacitors with which deterioration of insulating properties and leakage current properties can be sufficiently inhibited. Also proposed is a manufacturing method for the thin film MIM capacitors. For the thin film MIM capacitor (1), a lower electrode (3), a base metal thin film (4), the dielectric thin film (5) and the upper electrode (6) are formed to approximately the same area. The lower electrode (3) has a configuration that differs from the other films to form a part for external connection. The side surface of the base metal thin film (4), the dielectric thin film (5), and the upper electrode (6) are covered with a base metal oxide (7) that comprises the same metal atoms as the base metal thin film (4).

Abstract: A capacitor forming unit according to one embodiment includes a dielectric plate with a plurality of through holes; a first conductor film formed on an upper surface of the dielectric plate; a first insulator film formed on the front end portion of the upper surface of the dielectric plate; a second conductor film formed on a lower surface of the dielectric plate; a second insulator film formed on the rear end portion of the lower surface of the dielectric plate; first electrode rods disposed in some of the through holes; and second electrode rods disposed in the remaining through holes where the first electrode rods are not disposed. The first electrodes are electrically connected to the first conductor film and electrically insulated from the second conductor film. The second electrode rods are electrically connected to the second conductor film and are electrically insulated from the first conductor film.

Abstract: A capacitor according to the present invention includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode, and a second internal electrode. The dielectric layer is formed of a metal oxide having a crystalline structure and includes a first surface, a second surface on the opposite side to the first surface, and a plurality of through holes communicating with the first surface and the second surface. The first external electrode layer is disposed on the first surface. The second external electrode layer is disposed on the second surface. The first internal electrode is formed in through holes, and is connected to the first external electrode layer. The second internal electrode is formed in the through holes, and is connected to the second external electrode layer.

Abstract: There is provided a capacitor including a dielectric layer having a first plane, a second plane opposite to the first plane, and a plurality of through-holes communicated with the first plane and the second plane; a first external conductor layer disposed on a part of the first plane; a second external conductor layer disposed on the second plane; a third external conductor layer disposed on another part of the first plane; a first internal conductor housed in a part of a plurality of the through-holes and connected to the first external conductor layer; a second internal conductor housed in another part of a plurality of the through-holes and connected to the second external conductor layer; and a third internal conductor housed in the other part of a plurality of the through-holes and connected to the second external conductor layer and the third external conductor layer.

Abstract: A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and an adsorbing portion. The first internal electrode portion is provided on a first through-hole portion, one end of the first internal electrode portion being connected to the first external electrode layer. The second internal electrode portion is provided on a second through-hole portion, one end of the second internal electrode portion being connected to the second external electrode layer. The adsorbing portion adsorbs the first external electrode layer and the second external electrode layer, the adsorbing portion being provided on a third through-hole portion.

Abstract: A capacitor includes a dielectric layer, a first external electrode layer, a second external electrode layer, a first internal electrode portion, a second internal electrode portion, and a close contact portion. The first internal electrode portion is provided on a first through-hole portion, one end of the first internal electrode portion being connected to the first external electrode layer. The second internal electrode portion is provided on a second through-hole portion, one end of the second internal electrode portion being connected to the second external electrode layer. The close contact portion brings at least any one of the first external electrode layer and the second external electrode layer into close contact with the dielectric layer, the close contact portion being provided on a third through-hole portion.

Abstract: A capacitor forming unit includes a dielectric plate, a first conductor film formed on a plate upper surface region other than front and rear end portions, a first insulator film formed on the upper surface front end portion, a second insulator film formed on the upper surface rear end portion, a second conductor film formed on a plate lower surface region other than front and rear end portion, a third insulator film formed on the front end portion lower surface, and a fourth insulator film formed on the lower surface rear end portion. One or more first electrode rods are disposed in through holes, and electrically connected to the first conductor film and electrically insulated from the second conductor film. One or more second electrode rods are disposed in other through holes, and electrically connected to the second conductor film and electrically insulated from the first conductor film.

Abstract: A capacitor forming unit includes a dielectric plate, a first conductor film formed on a plate upper surface region other than front and rear end portions, a first insulator film formed on the upper surface front end portion, a second insulator film formed on the upper surface rear end portion, a second conductor film formed on a plate lower surface region other than front and rear end portion, a third insulator film formed on the front end portion lower surface, and a fourth insulator film formed on the lower surface rear end portion. One or more first electrode rods are disposed in through holes, and electrically connected to the first conductor film and electrically insulated from the second conductor film. One or more second electrode rods are disposed in other through holes, and electrically connected to the second conductor film and electrically insulated from the first conductor film.