Patents by Inventor Yoshinari Yamashita
Yoshinari Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7109637Abstract: A thin-film bulk acoustic oscillator comprises: a base; a barrier layer disposed on the base; a lower electrode disposed on the barrier layer; a piezoelectric thin film disposed on the lower electrode; and an upper electrode disposed on the piezoelectric thin film. The piezoelectric thin film includes a columnar crystal that extends in the direction intersecting the film surface. The top surface of the piezoelectric thin film is flattened by polishing so as to have a root mean square roughness of 2 nm or smaller.Type: GrantFiled: April 1, 2004Date of Patent: September 19, 2006Assignee: TDK CorporationInventors: Eiju Komuro, Hisatoshi Saitou, Yoshinari Yamashita
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Patent number: 7102896Abstract: An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components 16; wherein the electronic components 16 are mounted on the mounting substrate 11 via a substrate component 19 having a higher heat resistance than the mounting substrate 11 and that the mounting substrate 11 is composed of a member having a lower dielectric constant that the substrate component 19.Type: GrantFiled: May 18, 2004Date of Patent: September 5, 2006Assignee: TDK CorporationInventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
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Publication number: 20060066473Abstract: To achieve a purpose of accurately detecting a distance to a target even in a close range, a pulse wave radar device according to the present invention cuts off an output of a demodulation circuit so that no of receiving pulse may be detected, during a period when a transmitting pulse wave output from a transmitting antenna or a transmitting pulse output from a pulse generation circuit is leaking to a receiving antenna or a receiving circuit.Type: ApplicationFiled: September 22, 2005Publication date: March 30, 2006Applicant: TDK CorporationInventors: Takeshi Yokoyama, Hitoyoshi Kurata, Tomohiro Honya, Yoshinari Yamashita
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Patent number: 6980066Abstract: It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered. The high-frequency module according to the present invention includes a main module including a first high-frequency circuit at least a part of which is constituted by a conductive pattern built in a multi-layered substrate and a sub-module including a second high-frequency circuit, and the sub-module is inserted into a cavity formed in the main module. According to the present invention, the main module including the first high-frequency circuit and the sub-module including the second high-frequency circuit are constituted as separate components and the main module and the sub-module are integrated by inserting the sub-module into the cavity formed in the main module. Therefore, it is possible to use only a main module and sub-module that have been inspected after manufacture and found to be non-defective.Type: GrantFiled: March 27, 2002Date of Patent: December 27, 2005Assignee: TDK CorporationInventors: Shinya Nakai, Yoshinari Yamashita, Hideaki Ninomiya
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Patent number: 6917526Abstract: An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.Type: GrantFiled: April 22, 2004Date of Patent: July 12, 2005Assignee: TDK CorporationInventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
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Patent number: 6914787Abstract: An electronic component module includes a mounting substrate including a shield layer and on which a first cavity and a second cavity are formed. A first electronic component positioned in the first cavity is used in a first frequency band. A second electronic component positioned in the second cavity is used in a second frequency band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface. And, connection terminals formed on the mounting substrate are electrically connected to the electronic components through transmission lines.Type: GrantFiled: May 18, 2004Date of Patent: July 5, 2005Assignee: TDK CorporationInventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
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Patent number: 6855996Abstract: An electronic device substrate structure including a substrate 2, a metal thin film 4 as a (111)-oriented film of a face-centered cubic structure or as a (0001)-oriented film of a hexagonal closest packed structure formed on the substrate 2, and a wurtzite type thin film 5 as a (0001)-oriented film of a wurtzite crystal structure formed on the metal thin film 4, wherein: each of the two thin films is a polycrystalline film containing at least two kinds of crystal grains different in direction of crystal orientation in the plane; when the metal thin film 4 is a (111)-oriented film, <11-20> axes in the plane of the wurtzite type thin film 5 are parallel to <1-10> axes in the plane of the metal thin film 4; and when the metal thin film 4 is a (0001)-oriented film, <11-20> axes in the plane of the wurtzite type thin film 5 are parallel to <11-20> axes in the plane of the metal thin film 4.Type: GrantFiled: August 29, 2003Date of Patent: February 15, 2005Assignee: TDK CorporationInventors: Takao Noguchi, Hisatoshi Saitou, Hidenori Abe, Yoshinari Yamashita
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Publication number: 20050006984Abstract: A thin-film bulk acoustic oscillator comprises: a base; a barrier layer disposed on the base; a lower electrode disposed on the barrier layer; a piezoelectric thin film disposed on the lower electrode; and an upper electrode disposed on the piezoelectric thin film. The piezoelectric thin film includes a columnar crystal that extends in the direction intersecting the film surface. The top surface of the piezoelectric thin film is flattened by polishing so as to have a root mean square roughness of 2 nm or smaller.Type: ApplicationFiled: April 1, 2004Publication date: January 13, 2005Applicant: TDK CORPORATIONInventors: Eiju Komuro, Hisatoshi Saitou, Yoshinari Yamashita
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Publication number: 20040264156Abstract: An electronic component module includes: printed-circuit boards on which a shield layer is formed; a spacer positioned between the printed-circuit boards, the spacer equipped with a shielding feature which forms as partitions a first cavity and a second cavity between the printed-circuit boards; a first electronic component positioned in the first cavity and mounted on any one of the printed-circuit boards and used in a first frequency band; a second electronic component positioned in the second cavity and mounted on any one of the printed-circuit boards, the second electronic component used in a second frequency band; a patch antenna formed on the surface of the printed-circuit board opposite that on which the spacer is mounted, the antenna transmitting and receiving radio waves at least one of in the first and second frequency bands; and terminals formed on the surface of the printed-circuit board opposite that on which the spacer is mounted.Type: ApplicationFiled: April 22, 2004Publication date: December 30, 2004Applicant: TDK CORPORATIONInventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
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Publication number: 20040233644Abstract: An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface, and connection terminals 18 formed on the mounting substrate 11 and electrically connected to the electronic components 16 through transmission lines 12.Type: ApplicationFiled: May 18, 2004Publication date: November 25, 2004Applicant: TDK CORPORATIONInventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
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Publication number: 20040233648Abstract: An electronic component module according to the invention includes: a mounting substrate 11 including a shield layer 13 and on which a first cavity 14a and a second cavity 14b are formed; a first electronic component 16a positioned in the first cavity 14a and used in a first frequency band; a second electronic component 16b positioned in the second cavity 14b and used in a second frequency band; lid members 15 which seal the first cavity 14a and the second cavity 14b; and patch antennas 17 which transmit/receive radio waves in the frequency bands, the antennas connected to the electronic components 16; wherein the electronic components 16 are mounted on the mounting substrate 11 via a substrate component 19 having a higher heat resistance than the mounting substrate 11 and that the mounting substrate 11 is composed of a member having a lower dielectric constant that the substrate component 19.Type: ApplicationFiled: May 18, 2004Publication date: November 25, 2004Applicant: TDK CORPORATIONInventors: Eriko Ajioka, Shigeru Asami, Hideaki Shimoda, Hiroshi Ikeda, Yoshinari Yamashita, Hitoyoshi Kurata
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Publication number: 20040113719Abstract: It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered.Type: ApplicationFiled: September 25, 2003Publication date: June 17, 2004Inventors: Shinya Nakai, Yoshinari Yamashita, Hideaki Ninomiya
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Publication number: 20040099918Abstract: An electronic device substrate structure including a substrate 2, a metal thin film 4 as a (111)-oriented film of a face-centered cubic structure or as a (0001)-oriented film of a hexagonal closest packed structure formed on the substrate 2, and a wurtzite type thin film 5 as a (0001)-oriented film of a wurtzite crystal structure formed on the metal thin film 4, wherein: each of the two thin films is a polycrystalline film containing at least two kinds of crystal grains different in direction of crystal orientation in the plane; when the metal thin film 4 is a (111)-oriented film, <11-20> axes in the plane of the wurtzite type thin film 5 are parallel to <1-10> axes in the plane of the metal thin film 4; and when the metal thin film 4 is a (0001)-oriented film, <11-20> axes in the plane of the wurtzite type thin film 5 are parallel to <11-20> axes in the plane of the metal thin film 4.Type: ApplicationFiled: August 29, 2003Publication date: May 27, 2004Applicant: TDK CORPORATIONInventors: Takao Noguchi, Hisatoshi Saitou, Hidenori Abe, Yoshinari Yamashita
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Patent number: 5445862Abstract: According to the present specification there is disclosed a porous film having a number of throughholes extending from one side to the other side, obtained by molding into a sheet form a resin composition comprising an ethylene-.alpha.-olefin copolymer, a thermoplastic elastomer and an inorganic filler and then subjecting the sheet to stretching for orientation. Said porous film has excellent flexibility, stretchability and moisture permeability. These properties are made possible by using individual components in particular proportions, molding the resulting composition into a sheet form and then stretching the sheet to form fine throughholes therein so as to have a moisture permeability of 2,000 g/m.sup.2.24 hr or more.Type: GrantFiled: December 22, 1994Date of Patent: August 29, 1995Assignee: Tokuyama CorporationInventors: Shingo Kaneko, Yoshio Murakami, Yoshinari Yamashita
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Patent number: 4807036Abstract: A complex circuit component for a video signal circuit in a television receiver set has a single substrate, on which a first ceramic trap for removing speech carrier wave together with an inductor for that trap, a second trap for removing color subcarrier wave, and a delay circuit coupled with output of said second trap are mounted. The capacitors for those circuits are implemented by a pair of conductive patterns deposited on front surface and rear surface of the substrate. The capacitor for said first ceramic trap is subject to trimming so that the characteristics of the trap is adjustable.Type: GrantFiled: July 16, 1987Date of Patent: February 21, 1989Assignee: TDK CorporationInventors: Hisashi Osada, Hideaki Fujioka, Ikuo Kato, Yoshinari Yamashita
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Patent number: 4160748Abstract: A non-linear resistor comprises a sintered body of a ceramic composition which comprises 99.93 to 50 mole % of zinc oxide as ZnO; 0.01 to 10 mole % of a specific rare earth oxide as R.sub.2 O.sub.3 (R represents lanthanum, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium or lutetium) 0.01 to 10 mole % of an alkaline earth oxide as MO (M represents calcium, strontium or barium) and 0.05 to 30 mole % of cobalt oxide as CoO.Type: GrantFiled: December 23, 1977Date of Patent: July 10, 1979Assignee: TDK Electronics Co., Ltd.Inventors: Masatada Yodogawa, Susumu Miyabayashi, Yoshinari Yamashita, Takashi Yamamoto, Kohji Hayashi, Hisayoshi Ueoka
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Patent number: 4077915Abstract: A non-linear resistor comprises a sintered body of a ceramic composition which comprises 99.94 to 80.0 mole % of zinc oxide as ZnO, 0.02 to 10.0 mole % of the specific rare earth oxide selected from the group consisting of oxides of cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium as R.sub.2 O.sub.3, and 0.04 to 10 mole % of manganese oxide as MnO.Type: GrantFiled: September 2, 1976Date of Patent: March 7, 1978Assignee: TDK Electronics Co., Ltd.Inventors: Masatada Yodogawa, Susumu Miyabayashi, Yoshinari Yamashita, Takashi Yamamoto, Kohji Hayashi, Hisayoshi Ueoka