Patents by Inventor Yoshinaro Amano

Yoshinaro Amano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same
    Publication number: 20020191377
    Abstract: A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10−6/K at 30-800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).
    Type: Application
    Filed: December 13, 2001
    Publication date: December 19, 2002
    Inventors: Mitsuo Osada, Norio Hirayama, Tadashi Arikawa, Yoshinaro Amano, Hidetoshi Maesato, Hidefumi Hayashi, Hiroshi Murai