Patents by Inventor Yoshino Miyazawa

Yoshino Miyazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7339386
    Abstract: A probe is mountable to a printed circuit board testing device which performs a test on a predetermined land and/or a predetermined via hole of a printed circuit board. The probe includes a probe tip and a protrusion. The probe tip is contactable with the land and/or the via hole and projectable from the probe. The protrusion is disposed at a surface of the probe, the surface of the probe being disposed opposite to where the probe tip is projectable. The protrusion is grounded by a reaction pressure that is generated when the probe tip contacts the land and/or the via hole.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: March 4, 2008
    Assignee: Fujitsu Limited
    Inventors: Susumu Miyazawa, Mikio Hara, Syuji Kagiyama, Yasuo Mori, Kyosuke Yoshizu, Shigenori Makita, Yoshino Miyazawa
  • Publication number: 20060076968
    Abstract: A probe is mountable to a printed circuit board testing device which performs a test on a predetermined land and/or a predetermined via hole of a printed circuit board. The probe includes a probe tip and a protrusion. The probe tip is contactable with the land and/or the via hole and projectable from the probe. The protrusion is disposed at a surface of the probe, the surface of the probe being disposed opposite to where the probe tip is projectable. The protrusion is grounded by a reaction pressure that is generated when the probe tip contacts the land and/or the via hole.
    Type: Application
    Filed: November 30, 2005
    Publication date: April 13, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Susumu Miyazawa, Mikio Hara, Syuji Kagiyama, Yasuo Mori, Kyosuke Yoshizu, Shigenori Makita, Yoshino Miyazawa