Abstract: A printed circuit board includes: a substrate; a first electrode formed on the substrate; a protrusion member formed on the first electrode and extending from a central portion of the first electrode towards an outer peripheral portion of the first electrode; and a solder covering the first electrode and the protrusion member and connecting the first electrode to a second electrode of a component mounted on the substrate.

Abstract: A substrate unit includes an electronic component having a plurality of electrodes arranged in a given shape, a circuit substrate having a first face where the electronic component is mounted and the electrodes are jointed and a second face underside of the first face, and a resin-coated portion formed on the second face according to a projected area of the second face to which the given shape is projected.

Abstract: An electronic apparatus includes: a package body that has a tabular outside shape and is packaged with a built-in electronic circuit; a bump that electrically connects the electronic circuit inside the package body to a wiring outside the package body; a wiring board that has a wiring at least on its surface, the wiring board mounted with the package body so that the electronic circuit of the package body is electrically connected to the wiring via the bump; and an adhesive that bonds the package body onto the wiring board so as to bond only an edge of the package body to the wiring board.

Abstract: A packaging structure of semiconductor elements and for mounting such elements on which high density pads are formed on a board at a high production yield, where bumps or gold wires are bonded in a staggered manner within a pad on a semiconductor element. The spaces between bumps or gold wires can be widened without changing the semiconductor element.