Abstract: A piezoelectric valve includes: a valve main part including a gas pressure chamber receiving compressed gas supplied from outside; a plate inside the valve main part, and an actuator fixed to the plate and inside the valve main part, which is a case with an opening on a front surface. The plate includes a gas discharge path and a valve seat coming into contact with a valve element of the actuator opening and closing the gas discharge path. A lid member that closes the opening of the case has a gas discharge opening communicating with the gas discharge path of the plate; is welded and fixed to a front surface of the plate, where the gas discharge path opens, on an annular welded part surrounding the gas discharge opening; and is welded and fixed to an end surface of the case on an annular welded part on the outer peripheral part.

Abstract: A piezoelectric valve includes: a valve main part including a gas pressure chamber receiving compressed gas supplied from outside; a plate inside the valve main part, and an actuator fixed to the plate and inside the valve main part, which is a case with an opening on a front surface. The plate includes a gas discharge path and a valve seat coming into contact with a valve element of the actuator opening and closing the gas discharge path. A lid member that closes the opening of the case has a gas discharge opening communicating with the gas discharge path of the plate; is welded and fixed to a front surface of the plate, where the gas discharge path opens, on an annular welded part surrounding the gas discharge opening; and is welded and fixed to an end surface of the case on an annular welded part on the outer peripheral part.

Abstract: Provided is a piezoelectric valve in which the valve is opened/closed utilizing a displacement of a laminated piezoelectric element, including: a valve main body having a gas pressure chamber that receives compressed gas supplied externally; and an actuator having a valving element, the laminated piezoelectric element that generates a driving force required for operating the valving element as the displacement, and a displacement enlarging mechanism that enlarges the displacement of the laminated piezoelectric element to be acted on the valving element, the actuator being disposed in the valve main body, in which a surface of the laminated piezoelectric element is coated with silicone in a state in which the laminated piezoelectric element is integrated into the actuator.

Abstract: An electrical heating bonding device 1 bonds a member M1 to be bonded, which is made of a metal, and a member M2 to be bonded, which is made of a resin. The electrical heating bonding device 1 includes: an upper electrode 11 and a lower electrode 12 which sandwich the member M1 to be bonded, and are electrically conductive with the member M1 to be bonded; a pressurizing unit 20 which applies pressure to a bonding surface between the member M1 to be bonded and the member M2 to be bonded; a temperature sensor 30 which detects a temperature of the member M1 to be bonded; and a control unit 40 which controls the pressurizing unit 20 to apply the pressure to the bonding surface, after the temperature detected by the temperature sensor 30 reaches a predetermined set temperature Ts.

Abstract: A current diffusion bonding apparatus (1) includes upper and lower electrodes (11, 12), which sandwich members to be bonded (M, M) and which are electrically conductible with the members to be bonded (M, M); a power supply unit (20), which supplies a current to the electrodes (11, 12); and a pressurizing unit (30), which applies a pressure to bonding surfaces S. If a temperature T detected by a temperature sensor (45) is a first set temperature T1 or lower, the pressurizing unit (30) applies a pressure to the bonding surfaces S while restricting the displacement of the members to be bonded (M, M), and if the temperature T exceeds the first set temperature T1, the pressurizing unit (30) applies a pressure based on the elastic force of a spring (35d), which elastically deforms according to the displacement of the members to be bonded (M, M), to the bonding surfaces S.

Abstract: An electrical heating bonding device 1 bonds a member M1 to be bonded, which is made of a metal, and a member M2 to be bonded, which is made of a resin. The electrical heating bonding device 1 includes: an upper electrode 11 and a lower electrode 12 which sandwich the member M1 to be bonded, and are electrically conductive with the member M1 to be bonded; a pressurizing unit 20 which applies pressure to a bonding surface between the member M1 to be bonded and the member M2 to be bonded; a temperature sensor 30 which detects a temperature of the member M1 to be bonded; and a control unit 40 which controls the pressurizing unit 20 to apply the pressure to the bonding surface, after the temperature detected by the temperature sensor 30 reaches a predetermined set temperature Ts.

Abstract: A current diffusion bonding apparatus (1) includes upper and lower electrodes (11, 12), which sandwich members to be bonded (M, M) and which are electrically conductible with the members to be bonded (M, M); a power supply unit (20), which supplies a current to the electrodes (11, 12); and a pressurizing unit (30), which applies a pressure to bonding surfaces S. If a temperature T detected by a temperature sensor (45) is a first set temperature T1 or lower, the pressurizing unit (30) applies a pressure to the bonding surfaces S while restricting the displacement of the members to be bonded (M, M), and if the temperature T exceeds the first set temperature T1, the pressurizing unit (30) applies a pressure based on the elastic force of a spring (35d), which elastically deforms according to the displacement of the members to be bonded (M, M), to the bonding surfaces S.