Patents by Inventor Yoshinobu Morino

Yoshinobu Morino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8877697
    Abstract: An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: November 4, 2014
    Assignee: Arakawa Chemical Industries, Ltd.
    Inventors: Takashi Tanaka, Keita Tanaka, Yoshinobu Morino
  • Publication number: 20120090646
    Abstract: An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.
    Type: Application
    Filed: August 20, 2010
    Publication date: April 19, 2012
    Applicant: ARAKAWA CHEMICAL INDUSTRIES, LTD.
    Inventors: Takashi Tanaka, Keita Tanaka, Yoshinobu Morino