Patents by Inventor Yoshinobu Nekado

Yoshinobu Nekado has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9817192
    Abstract: An optical module includes a housing including an internal space that has an opening in a substrate mounting surface, an element mounting surface that forms a portion of an inner surface of the internal space, and a waveguide introduction opening that is formed in a side surface intersecting the substrate mounting surface and is opened to the opening of the substrate mounting surface and communicated with the internal space, an optical element that is mounted on the element mounting surface, and an electronic element that is mounted on the element mounting surface and is connected to the optical element. When the substrate mounting surface is mounted on a circuit substrate, an optical waveguide that protrudes from a surface of the circuit substrate is introduced into the internal space through the waveguide introduction opening.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: November 14, 2017
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshinobu Nekado, Yozo Ishikawa, Naoya Nishimura, Toshinori Uemura, Hideyuki Nasu
  • Publication number: 20170192177
    Abstract: An optical module includes a housing including an internal space that has an opening in a substrate mounting surface, an element mounting surface that forms a portion of an inner surface of the internal space, and a waveguide introduction opening that is formed in a side surface intersecting the substrate mounting surface and is opened to the opening of the substrate mounting surface and communicated with the internal space, an optical element that is mounted on the element mounting surface, and an electronic element that is mounted on the element mounting surface and is connected to the optical element. When the substrate mounting surface is mounted on a circuit substrate, an optical waveguide that protrudes from a surface of the circuit substrate is introduced into the internal space through the waveguide introduction opening.
    Type: Application
    Filed: March 7, 2017
    Publication date: July 6, 2017
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshinobu NEKADO, Yozo ISHIKAWA, Naoya NISHIMURA, Toshinori UEMURA, Hideyuki NASU
  • Patent number: 9632265
    Abstract: An optical module includes a housing including an internal space that has an opening in a substrate mounting surface, an element mounting surface that forms a portion of an inner surface of the internal space, and a waveguide introduction opening that is formed in a side surface intersecting the substrate mounting surface and is opened to the opening of the substrate mounting surface and communicated with the internal space, an optical element that is mounted on the element mounting surface, and an electronic element that is mounted on the element mounting surface and is connected to the optical element. When the substrate mounting surface is mounted on a circuit substrate, an optical waveguide that protrudes from a surface of the circuit substrate is introduced into the internal space through the waveguide introduction opening.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: April 25, 2017
    Assignee: FURUKAWA ELECTRIC CO. LTD.
    Inventors: Yoshinobu Nekado, Yozo Ishikawa, Naoya Nishimura, Toshinori Uemura, Hideyuki Nasu
  • Publication number: 20160116695
    Abstract: An optical module includes a housing including an internal space that has an opening in a substrate mounting surface, an element mounting surface that forms a portion of an inner surface of the internal space, and a waveguide introduction opening that is formed in a side surface intersecting the substrate mounting surface and is opened to the opening of the substrate mounting surface and communicated with the internal space, an optical element that is mounted on the element mounting surface, and an electronic element that is mounted on the element mounting surface and is connected to the optical element. When the substrate mounting surface is mounted on a circuit substrate, an optical waveguide that protrudes from a surface of the circuit substrate is introduced into the internal space through the waveguide introduction opening.
    Type: Application
    Filed: January 4, 2016
    Publication date: April 28, 2016
    Applicant: Furukawa Electric Co., Ltd.
    Inventors: Yoshinobu NEKADO, Yozo ISHIKAWA, Naoya NISHIMURA, Toshinori UEMURA, Hideyuki NASU
  • Patent number: 8632263
    Abstract: An optical module includes a module housing body including an electrical connection section for electrically connecting the electronic substrate and the optical module to each other and a housing section for housing the optical module, where the module housing body is mounted on the electronic substrate in such a manner that an electrical connection terminal of the electronic substrate and the electrical connection section is connected to each other and a fixing member for maintaining a state in which an electrical connection terminal of the optical module has contact with the electrical connection section in the module housing body. The optical module is housed in the housing section and is fixed in a removable manner by the fixing member, and the optical waveguide and the optical element are configured to be optically coupled to each other in a state in which the optical module is fixed.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: January 21, 2014
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Yoshinobu Nekado, Hideyuki Nasu
  • Patent number: 8382384
    Abstract: An optical module includes a module housing body including an electrical connection section for electrically connecting the electronic substrate and the optical module to each other and a housing section for housing the optical module, where the module housing body is mounted on the electronic substrate in such a manner that an electrical connection terminal of the electronic substrate and the electrical connection section is connected to each other and a fixing member for maintaining a state in which an electrical connection terminal of the optical module has contact with the electrical connection section in the module housing body. The optical module is housed in the housing section and is fixed in a removable manner by the fixing member, and the optical waveguide and the optical element are configured to be optically coupled to each other in a state in which the optical module is fixed.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: February 26, 2013
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yoshinobu Nekado, Hideyuki Nasu
  • Publication number: 20110026888
    Abstract: An optical module includes a module housing body including an electrical connection section for electrically connecting the electronic substrate and the optical module to each other and a housing section for housing the optical module, where the module housing body is mounted on the electronic substrate in such a manner that an electrical connection terminal of the electronic substrate and the electrical connection section is connected to each other and a fixing member for maintaining a state in which an electrical connection terminal of the optical module has contact with the electrical connection section in the module housing body. The optical module is housed in the housing section and is fixed in a removable manner by the fixing member, and the optical waveguide and the optical element are configured to be optically coupled to each other in a state in which the optical module is fixed.
    Type: Application
    Filed: April 13, 2009
    Publication date: February 3, 2011
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshinobu Nekado, Hideyuki Nasu
  • Patent number: 6829418
    Abstract: An optical waveguide circuit device strong in impact strength in dropping, etc. is provided. A waveguide pattern is formed on a silicon substrate in this optical waveguide circuit device. For example, this waveguide pattern has an optical input waveguide, a first slab waveguide, an arrayed waveguide including a plurality of channel waveguides having lengths different from each other and arranged side by side, a second slab waveguide, and a plurality of optical output waveguides arranged side by side. The first slab waveguide is separated on a cross separating face crossing an optical path passing the first slab waveguide. A temperature dependence in light transmission central wavelength of an arrayed waveguide grating is reduced by sliding and moving a separating slab waveguide side by a slide moving member along the separating face depending on temperature.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: December 7, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kazuhisa Kashihara, Yoshinobu Nekado, Kazutaka Nara, Tunetoshi Saito
  • Patent number: 6826332
    Abstract: At least one of two slab waveguides constituting an arrayed waveguide grating is cut and separated together with a substrate on a cross separating face. A slide moving member is arranged over a waveguide forming area formed on the substrate including the separating slab waveguide and a waveguide forming area formed on the substrate including the separating slab waveguide. Temperature dependence of the center wavelength of the arrayed waveguide grating is reduced by slide-moving the separating slab waveguide by the slide moving member along the cross separating face dependently on temperature. The shift of an initial center wavelength is corrected by plastically deforming the slide moving member so that the initial center wavelength is conformed to a grid wavelength.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: November 30, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Tsunetoshi Saito, Kazuhisa Kashihara, Kanji Tanaka, Junichi Hasegawa, Yoshinobu Nekado, Yoshimi Ono
  • Patent number: 6763164
    Abstract: The invention provides a simple metallic film manufacturing method for manufacturing an arrayed waveguide grating able to set each light transmitting central wavelength to a set wavelength at optionally predetermined temperature (for example 25° C.). The arrayed waveguide grating is manufactured by using this method. The light transmitting central wavelength of a circuit forming a waveguide forming area on a substrate is measured, and a shift of the light transmitting central wavelength from the set wavelength is corrected by annealing process. A mask has a hole approximately formed in the same shape as the manufactured metallic film, and is arranged such that the hole of the mask corresponds to a manufacturing portion of the metallic film. The metallic film is manufactured by evaporation, etc.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: July 13, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kazuhisa Kashihara, Kazutaka Nara, Yoshinobu Nekado
  • Patent number: 6757453
    Abstract: The present invention is an optical waveguide module having e.g., a high impact resisting property and a high vibration resisting property. An optical waveguide circuit chip is supported by at least a peripheral portion of an edge portion and is stored into a storing portion of a package. The optical waveguide chip is formed by arranging an optical waveguide forming area on a substrate. An elastic member for impact relaxation of the optical waveguide circuit chip is arranged in at least one portion of the vicinity of the edge portion of the optical waveguide circuit chip. For example, the elastic member is arranged in the vicinity of each of four corners of the optical waveguide circuit chip.
    Type: Grant
    Filed: March 18, 2002
    Date of Patent: June 29, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yoshinobu Nekado, Tsunetoshi Saito, Kazuhisa Kashihara
  • Patent number: 6668117
    Abstract: An arrayed waveguide grating optical multiplexer/demultiplexer is provided to suppress a temperature depending characteristic of a center wavelength. The arrayed waveguide grating comprises at least one optical input waveguide, a first slab waveguide, an arrayed waveguide, a second slab waveguide, and a plurality of optical output waveguides. The first slab waveguide is separated on an cross separating plane which is intersected to a path of light passing through the first slab waveguide to constitute separated slab waveguides. A slide moving member is provided which may move at least one of these separated slab waveguides along the cross separating plane, depending upon the temperature. A front surface side of the waveguide forming region and a rear surface side of the substrate are sandwiched by a positional shift suppressing member such as a clip. The possition depressing the waveguide forming region by the clip is escaped from the optical axis of the separated slab waveguides.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: December 23, 2003
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Junichi Hasegawa, Atsushi Hi Raizumi, Tsunetoshi Saito, Yoshinobu Nekado
  • Patent number: 6668116
    Abstract: An arrayed waveguide grating type optical multiplexer/demultiplexer of the invention eliminates the temperature dependency of the light transmission center wavelengths and suppresses an increase in insertion loss with a simple configuration even under the conditions of high temperature and high humidity. A waveguide forming area comprising an optical input waveguide, a first slab waveguide, an arrayed waveguide formed of a plurality of channel waveguides arranged side by side having a different length each other, and a plurality of optical output waveguides connected one by one is formed on a substrate. For example, the first slab waveguide is separated at crossed separation planes that cross the path of light passing through the first slab waveguide. On the crossed separation planes, a matching grease is applied. A thin film member for covering the area arranged with the matching grease is disposed to suppress the evaporation of the matching grease.
    Type: Grant
    Filed: July 16, 2001
    Date of Patent: December 23, 2003
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kazuhisa Kashihara, Kazutaka Nara, Yoshinobu Nekado, Tunetoshi Saito
  • Patent number: 6584270
    Abstract: The permeation of the moisture into a case made of metal is roughly perfectly suppressed, and the optical communications of high quality are made possible by the operation of component(s) accommodated in the case. A plurality of through holes through which the outside of the case and a component accommodating portion communicate with each other are provided in the metallic case including a body having the component accommodating portion, and a lid. Fixed components in which an optical fiber ribbon and an optical fiber(s) are respectively sandwiched between associated metallic substrates and associated optical fiber fixing plates to be fixed by solder are fitted into the respective through holes to be hermetically sealed and fixed to the metallic case.
    Type: Grant
    Filed: January 22, 2001
    Date of Patent: June 24, 2003
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kazuhisa Kashihara, Kanji Tanaka, Yoshinobu Nekado
  • Publication number: 20030039043
    Abstract: An optical device capable of optically coupling an optical element to be mounted to an optical waveguide circuit with low transmission losses is provided. On a base (20) provided with a substrate (1), a positioning pattern (15) made of a Pt film, a high melting point material having a melting point higher than a temperature of consolidating glass, is formed. Then, glass layers are formed by depositing glass particles by flame hydrolysis deposition and consolidating the deposited glass particles. The glass layers cover the top of the positioning pattern (15) and the base (20). The glass layers on the top and the periphery of the positioning pattern (15) are removed to expose the positioning pattern (15) and the base (20) therearound. The exposed area is to be a optical element mounting face 4. The positioning pattern (15) allows a light receiving device (8) to be positioned and fixed on the optical element mounting face 4 accurately.
    Type: Application
    Filed: November 27, 2001
    Publication date: February 27, 2003
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshinobu Nekado, Hiroshi Kawashima, Kazutaka Nara, Isao Ohyama, Kazuhisa Kashihara
  • Publication number: 20020191914
    Abstract: An arrayed waveguide grating optical multiplexer/demultiplexer is provided to suppress a temperature depending characteristic of a center wavelength. The arrayed waveguide grating comprises at least one optical input waveguide, a first slab waveguide, an arrayed waveguide, a second slab waveguide, and a plurality of optical output waveguides. The first slab waveguide is separated on an cross separating plane which is intersected to a path of light passing through the first slab waveguide to constitute separated slab waveguides. A slide moving member is provided which may move at least one of these separated slab waveguides along the cross separating plane, depending upon the temperature. A front surface side of the waveguide forming region and a rear surface side of the substrate are sandwiched by a positional shift suppressing member such as a clip. The possition depressing the waveguide forming region by the clip is escaped from the optical axis of the separated slab waveguides.
    Type: Application
    Filed: March 12, 2002
    Publication date: December 19, 2002
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Junichi Hasegawa, Atsushi Hiraizumi, Tsunetoshi Saito, Yoshinobu Nekado
  • Publication number: 20020181871
    Abstract: At least one of two slab waveguides constituting an arrayed waveguide grating is cut and separated together with a substrate on a cross separating face (8). A slide moving member (17) is arranged over a waveguide forming area formed on the substrate including the separating slab waveguide (3a) and a waveguide forming area formed on the substrate including the separating slab waveguide (3b). Temperature dependence of the center wavelength of the arrayed waveguide grating is reduced by slide-moving the separating slab waveguide (3a) by the slide moving member (17) along the cross separating face (8) dependently on temperature. The shift of an initial center wavelength is corrected by plastically deforming the slide moving member (17) so that the initial center wavelength is conformed to a grid wavelength.
    Type: Application
    Filed: April 23, 2002
    Publication date: December 5, 2002
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Tsunetoshi Saito, Kazuhisa Kashihara, Kanji Tanaka, Junichi Hasegawa, Yoshinobu Nekado, Yoshimi Ono
  • Publication number: 20020164128
    Abstract: While optical circuits of chips are optically connected to each other, an optical device capable of properly realizing such a setting function of a switching function is realized. Both a chip forming an optical waveguide and another chip forming another optical waveguide are arranged on substrates. A sandwiching member for sandwiching both upper surfaces and lower surfaces of these chips is provided in such a mode that this sandwiching member covers the optical connection regions of the optical waveguides. The sandwiching member is arranged by an elastic member provided in contact with the forming region of the chips, and also, a flat plate member provided in contact with a rear surface of the substrate. While stress is applied by a stress applying member, this sandwiching member sandwiches the upper surfaces and the lower surfaces of the chips.
    Type: Application
    Filed: March 20, 2002
    Publication date: November 7, 2002
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshinobu Nekado, Kazuhisa Kashihara
  • Publication number: 20020159674
    Abstract: The present invention is an optical waveguide module having e.g., a high impact resisting property and a high vibration resisting property. An optical waveguide circuit chip is supported by at least a peripheral portion of an edge portion and is stored into a storing portion of a package. The optical waveguide chip is formed by arranging an optical waveguide forming area on a substrate. An elastic member for impact relaxation of the optical waveguide circuit chip is arranged in at least one portion of the vicinity of the edge portion of the optical waveguide circuit chip. For example, the elastic member is arranged in the vicinity of each of four corners of the optical waveguide circuit chip.
    Type: Application
    Filed: March 18, 2002
    Publication date: October 31, 2002
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshinobu Nekado, Tsunetoshi Saito, Kazuhisa Kashihara
  • Patent number: 6456763
    Abstract: An arrayed waveguide grating type optical multiplexer/demultiplexer in which a light transmission central wavelength is independent of temperature. A substrate is formed on a waveguide forming region in which optical input waveguides, a first slab waveguide, an arrayed waveguide including a plurality of channel waveguides that are arranged side by side, a second slab waveguide, and a plurality of optical output waveguides arranged side by side are sequentially connected. Dividing lines are set to divide the first slab waveguide into two by intersecting dividing planes that intersect with a route of light traveling along the first slab waveguide. A position shifting member is fixed so as to be secured in a waveguide forming region at its one end and in a waveguide forming region on its other end. The position shifting member fixes to a base the waveguide forming region on the side of a divided slab waveguide and slides the waveguide forming region on the side of another divided slab waveguide.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: September 24, 2002
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kazuhisa Kashihara, Kazutaka Nara, Yoshinobu Nekado