Abstract: An imaging module includes: a planar light emitter that includes a light-emitting face and a light-emitter terminal; a power supply cable that is connected to the light-emitter terminal and that supplies electric power to the planar light emitter; a solid-state image sensing device that captures an image of an illumination object that is irradiated with light emitted from the light-emitting face; a coaxial cable that is electrically connected to the solid-state image sensing device; a light shield that is disposed between the solid-state image sensing device and the planar light emitter; and a light guide that guides light emitted from the light-emitting face to an outside of the imaging module. The planar light emitter, the solid-state image sensing device, part of the light shield, and the light guide constitute a rigid portion of the imaging module.

Abstract: An imaging module of the invention includes an image-sensing device that has a light-receiving face, a substrate, a signal cable including a conductor, and a resin mold. A wiring of the substrate includes an electrode terminal and a cable terminal. The image-sensing device electrode is electrically connected to the electrode terminal via solder. The conductor is electrically connected to the cable terminal via solder. The resin mold coats the electrode surface, the cable terminal, the conductor, and the solder. On a plane of projection of the image-sensing device when viewed in a direction from the image-sensing device to the signal cable, the substrate, the resin mold, and the signal cable are disposed inside an outline of the image-sensing device.

Abstract: An imaging module includes an imaging element including a light receiving surface, an electrode surface on a side opposite to the light receiving surface, and imaging element electrodes formed on the electrode surface, a substrate including a first surface, a second surface on a side opposite to the first surface, and a first end surface facing the electrode surface, a cable portion having a conductor electrically connected to the imaging element electrodes via a wire on the substrate, a sealing resin that covers at least the first surface and the second surface, and an identification resin attached to a portion of the sealing resin on the first surface or a portion of the sealing resin on the second surface.

Abstract: An imaging module includes: a planar light emitter that includes a light-emitting face and a light-emitter terminal; a power supply cable that is connected to the light-emitter terminal and that supplies electric power to the planar light emitter; a solid-state image sensing device that captures an image of an illumination object that is irradiated with light emitted from the light-emitting face; a coaxial cable that is electrically connected to the solid-state image sensing device; a light shield that is disposed between the solid-state image sensing device and the planar light emitter; and a light guide that guides light emitted from the light-emitting face to an outside of the imaging module. The planar light emitter, the solid-state image sensing device, part of the light shield, and the light guide constitute a rigid portion of the imaging module.

Abstract: An imaging module includes: a support substrate that includes a first surface, a second surface on an opposite side of the first surface, and a first mounting terminal disposed on the first surface; a planar light emitter including a light-emitting face, and a light-emitter terminal disposed on the first surface of the support substrate and connected to the first mounting terminal; and a solid-state image sensing device disposed adjacent to the planar light emitter and that includes a light-incident surface that has a quadrangular shape in plan view and that captures an image of an imaging object that is irradiated with light emitted from the light-emitting face.

Abstract: An electronic component unit includes: an electronic module in which a rear substrate is electrically connected via an electric cable to an electronic element; an external connection terminal that is electrically connected to an external circuit; a relay substrate including a terminal connection electrode to which the external connection terminal is electrically connected either directly or via a connection conductor; and a relay connector on the relay substrate. The electronic element is any one of: an imaging element; a laser element; and a sensor element.

Abstract: An imaging module of the invention includes an image-sensing device that has a light-receiving face, a substrate, a signal cable including a conductor, and a resin mold. A wiring of the substrate includes an electrode terminal and a cable terminal. The image-sensing device electrode is electrically connected to the electrode terminal via solder. The conductor is electrically connected to the cable terminal via solder. The resin mold coats the electrode surface, the cable terminal, the conductor, and the solder. On a plane of projection of the image-sensing device when viewed in a direction from the image-sensing device to the signal cable, the substrate, the resin mold, and the signal cable are disposed inside an outline of the image-sensing device.

Abstract: An imaging module includes an imaging element including a light receiving surface, an electrode surface on a side opposite to the light receiving surface, and imaging element electrodes formed on the electrode surface, a substrate including a first surface, a second surface on a side opposite to the first surface, and a first end surface facing the electrode surface, a cable portion having a conductor electrically connected to the imaging element electrodes via a wire on the substrate, a sealing resin that covers at least the first surface and the second surface, and an identification resin attached to a portion of the sealing resin on the first surface or a portion of the sealing resin on the second surface.

Abstract: An electronic component unit includes: an electronic module in which a rear substrate is electrically connected via an electric cable to an electronic element; an external connection terminal that is electrically connected to an external circuit; a relay substrate including a terminal connection electrode to which the external connection terminal is electrically connected either directly or via a connection conductor; and a relay connector on the relay substrate. The electronic element is any one of: an imaging element; a laser element; and a sensor element.

Abstract: An image capturing module includes an image capturing element, a light emitting element, and a case that is configured to hold the image capturing element and the light emitting element. The case has a light projection aperture that is configured to open toward the front surface of the case, and a light housing part that is located behind the light projection aperture to house the light emitting element. The light housing part and the light projection aperture are connected to each other inside the case, and the rear end of the light projection aperture is configured to open toward a light emitting surface of the light emitting element. The opening area of the rear end of the light projection aperture is smaller than the area of the light emitting surface of the light emitting element.

Abstract: An imaging module includes: a support substrate that includes a first surface, a second surface on an opposite side of the first surface, and a first mounting terminal disposed on the first surface; a planar light emitter including a light-emitting face, and a light-emitter terminal disposed on the first surface of the support substrate and connected to the first mounting terminal; and a solid-state image sensing device disposed adjacent to the planar light emitter and that includes a light-incident surface that has a quadrangular shape in plan view and that captures an image of an imaging object that is irradiated with light emitted from the light-emitting face.

Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plaurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.

Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.