Patents by Inventor Yoshinobu OOTAKA

Yoshinobu OOTAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11769650
    Abstract: Provided are a multistage-connected multipole and a charged particle beam device that can be produced with precision in machining without requiring precision in brazing between a pole and an insulation material. This multi-stage connected multipole 100 comprises: a plurality of poles Q1-Q4 that are arranged along the optical-axis direction of a charged particle beam, and that have cutouts Non surfaces facing each other; and braces P1-P3 that are arranged between the plurality of poles Q1-Q4 and are made of an insulator. The poles Q1-Q4 and the braces P1-P3 are joined by fitting the braces P1-P3 into the cutouts N and applying brazing so as to be interposed by a bonding material.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: September 26, 2023
    Assignee: Hitachi High-Tech Corporation
    Inventors: Hideto Dohi, Yoshinobu Ootaka, Masashi Inada, Hideyuki Kazumi, Hideo Kashima
  • Patent number: 11769649
    Abstract: An object is to provide a multipole unit capable of achieving both high positional accuracy and ease of assembling and preventing a decrease in the transmission rate of the magnetic flux. A multipole unit 109a includes a pole 1 that is made of a soft magnetic metal material, a shaft 2 that is made of a soft magnetic metal material and is magnetically connected to the pole, and a coil 3 that is wound around the shaft 2. The pole 1 is provided with a first fitting portion JP1 that forms a first recessed portion or a first protruding portion. The shaft 2 is provided with a second fitting portion JP2 that forms a second protruding portion or a second recessed portion. The first fitting portion JP1 and the second fitting portion JP2 are fitted with each other such that the pole 1 and the shaft 2 are physically separated from each other.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: September 26, 2023
    Assignee: Hitachi High-Tech Corporation
    Inventors: Masanori Mita, Yoshinobu Ootaka, Hideto Dohi, Zhaohui Cheng
  • Publication number: 20220270844
    Abstract: An object is to provide a multipole unit capable of achieving both high positional accuracy and ease of assembling and preventing a decrease in the transmission rate of the magnetic flux. A multipole unit 109a includes a pole 1 that is made of a soft magnetic metal material, a shaft 2 that is made of a soft magnetic metal material and is magnetically connected to the pole, and a coil 3 that is wound around the shaft 2. The pole 1 is provided with a first fitting portion JP1 that forms a first recessed portion or a first protruding portion. The shaft 2 is provided with a second fitting portion JP2 that forms a second protruding portion or a second recessed portion. The first fitting portion JP1 and the second fitting portion JP2 are fitted with each other such that the pole 1 and the shaft 2 are physically separated from each other.
    Type: Application
    Filed: January 14, 2022
    Publication date: August 25, 2022
    Inventors: Masanori MITA, Yoshinobu OOTAKA, Hideto DOHI, Zhaohui CHENG
  • Publication number: 20220037113
    Abstract: Provided are a multistage-connected multipole and a charged particle beam device that can be produced with precision in machining without requiring precision in brazing between a pole and an insulation material. This multi-stage connected multipole 100 comprises: a plurality of poles Q1-Q4 that are arranged along the optical-axis direction of a charged particle beam, and that have cutouts Non surfaces facing each other; and braces P1-P3 that are arranged between the plurality of poles Q1-Q4 and are made of an insulator. The poles Q1-Q4 and the braces P1-P3 are joined by fitting the braces P1-P3 into the cutouts N and applying brazing so as to be interposed by a bonding material.
    Type: Application
    Filed: December 23, 2019
    Publication date: February 3, 2022
    Inventors: Hideto DOHI, Yoshinobu OOTAKA, Masashi INADA, Hideyuki KAZUMI, Hideo KASHIMA