Patents by Inventor Yoshinobu Ozaki

Yoshinobu Ozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935870
    Abstract: One aspect of the present disclosure is a manufacturing method for a support piece used in the formation of a dolmen structure in a semiconductor device, including processes of: (A) preparing a laminate film including a base material film, an adhesive layer, and a support piece formation film, for example, including a thermosetting resin layer, in this order; and (B) forming support pieces on a surface of the adhesive layer by singulating the support piece formation film, in which the process (B) includes a process of forming a cut in the support piece formation film partway in a thickness direction, and a process of singulating the support piece formation film in a cooled state by expansion, in this order.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: March 19, 2024
    Inventors: Yoshinobu Ozaki, Kei Itagaki, Kohei Taniguchi, Shintaro Hashimoto, Tatsuya Yahata
  • Publication number: 20230253366
    Abstract: A semiconductor device includes: a substrate; an adhesive member arranged on a surface of the substrate; a first chip stacked on the adhesive member with a first adhesive piece interposed therebetween; and a second chip stacked on the first chip with a second adhesive piece interposed therebetween. The adhesive member has a multilayer structure including a pair of surface layers formed of a cured product of a thermosetting resin composition and an intermediate layer arranged between the pair of surface layers.
    Type: Application
    Filed: July 1, 2021
    Publication date: August 10, 2023
    Inventors: Kohei TANIGUCHI, Yoshinobu OZAKI, Kei ITAGAKI, Kazuhiro YAMAMOTO, Kanami NAKAMURA, Hiroki HASHIMOTO
  • Publication number: 20220336281
    Abstract: A collet for compressing an adhesive-attached chip, the collet including a main body having a first pressing surface to which a pressing force from a compressing device is directly transmitted, and a projecting portion projecting from the main body and having a second pressing surface provided along an outer circumference of the first pressing surface, the first pressing surface and the second pressing surface forming a holding surface for holding the adhesive-attached chip.
    Type: Application
    Filed: September 3, 2020
    Publication date: October 20, 2022
    Inventors: Tsuyoshi TAZAWA, Kei ITAGAKI, Yoshinobu OZAKI, Ayako TAIRA
  • Publication number: 20220216114
    Abstract: A method for evaluating pickup property of a dicing/die-bonding integrated film including a base layer, an adhesive, and a bonding adhesive layer in order, the method including preparing a laminate including the dicing/die-bonding integrated film and a wafer having a thickness of 10 to 100 ?m laminated on the bonding adhesive layer, singulating the wafer into a plurality of chips having an area of 9 mm2 or less, pushing a center portion of the chip from a side of the base layer, and measuring a peeling strength when an edge of the chip is peeled off from the adhesive layer.
    Type: Application
    Filed: May 10, 2019
    Publication date: July 7, 2022
    Inventors: Tsuyoshi TAZAWA, Naohiro KIMURA, Keisuke OHKUBO, Yoshinobu OZAKI
  • Publication number: 20220157802
    Abstract: A semiconductor device having a dolmen structure, includes: a substrate; a first chip disposed on the substrate; a plurality of support pieces disposed around the first chip, on the substrate; and a bonding adhesive piece-attached chip supported by the plurality of support pieces and disposed to cover the first chip, in which the bonding adhesive piece-attached chip includes a second chip, and a bonding adhesive piece provided on one surface of the second chip, and a shear strength of the support pieces and the bonding adhesive piece-attached chip at 250° C. is 3.2 MPa or more.
    Type: Application
    Filed: April 25, 2019
    Publication date: May 19, 2022
    Inventors: Shintaro HASHIMOTO, Kouhei TANIGUCHI, Tatsuya YAHATA, Yoshinobu OZAKI
  • Publication number: 20220149008
    Abstract: A support piece formation laminate film according to the present disclosure includes a base material film, a pressure-sensitive adhesive layer, and a support piece formation film, in this order, in which the support piece formation film has a multi-layer structure including at least a metal layer. The support piece formation laminate film is applied to a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip, on the substrate, and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip.
    Type: Application
    Filed: April 24, 2020
    Publication date: May 12, 2022
    Inventors: Tatsuya YAHATA, Kohei TANIGUCHI, Shintaro HASHIMOTO, Yoshinobu OZAKI, Kei ITAGAKI
  • Publication number: 20220149009
    Abstract: One aspect of the present disclosure is a manufacturing method for a support piece used in the formation of a dolmen structure in a semiconductor device, including processes of: (A) preparing a laminate film including a base material film, an adhesive layer, and a support piece formation film, for example, including a thermosetting resin layer, in this order; and (B) forming support pieces on a surface of the adhesive layer by singulating the support piece formation film, in which the process (B) includes a process of forming a cut in the support piece formation film partway in a thickness direction, and a process of singulating the support piece formation film in a cooled state by expansion, in this order.
    Type: Application
    Filed: April 24, 2020
    Publication date: May 12, 2022
    Inventors: Yoshinobu OZAKI, Kei ITAGAKI, Kohei TANIGUCHI, Shintaro HASHIMOTO, Tatsuya YAHATA
  • Publication number: 20220149031
    Abstract: A semiconductor device according to the present disclosure has a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip, on the substrate, and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, in which the support piece contains a cured product of a thermosetting resin composition, or includes a layer containing a cured product of a thermosetting resin composition, and a resin layer or a metal layer.
    Type: Application
    Filed: April 24, 2020
    Publication date: May 12, 2022
    Inventors: Tatsuya YAHATA, Kohei TANIGUCHI, Shintaro HASHIMOTO, Yoshinobu OZAKI
  • Patent number: 10309355
    Abstract: In a saddle-ride type vehicle in which an intake device is arranged at a position covered by a fuel tank from above, the intake device including: an air cleaner; a connecting tube having an upstream end thereof connected to the air cleaner; a throttle device including a throttle valve and connected to a downstream end of the connecting tube; and a resonator, a curved portion bulged upward and curved in a chevron shape is formed in the connecting tube, and the resonator arranged between the fuel tank and the connecting tube is connected to the connecting tube on the air cleaner side further than a top portion of the curved portion as seen in a side view of the vehicle.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: June 4, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Yoshinobu Ozaki
  • Patent number: 10227957
    Abstract: In a saddle-ride type vehicle in which a cleaner case of an air cleaner is configured with first and second case half bodies coupled to each other and arranged in a vehicle width direction, and is arranged in a space surrounded by a vehicle body frame, a first case half body is provided with: a cleaner element insertion/removal port opened outward so as to permit insertion and removal of a cleaner element therethrough; a purified air outlet connected with a connecting tube for guiding purified air to an engine body side; and an outside air suction port for introducing air from an outside into the cleaner case.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: March 12, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Yoshinobu Ozaki
  • Patent number: 10100789
    Abstract: In a saddle-ride type vehicle in which an air cleaner is arranged inward in a vehicle width direction of at least a pair of left and right main frames and arranged below a riding seat, a cleaner case for the air cleaner is configured long in a longitudinal direction of the vehicle and has a cleaner case main portion storing therein a cleaner element, and a connecting tube connection portion extending forward from the cleaner case main portion so as to be connected to a connecting tube. A pair of left and right side covers covering the cleaner case from opposite sides in the vehicle width direction are supported by side cover supporting portions that are provided on left and right opposite side walls of the cleaner case main portion and the connecting tube connection portion.
    Type: Grant
    Filed: March 20, 2017
    Date of Patent: October 16, 2018
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Yoshinobu Ozaki, Mizuki Fujiwara
  • Publication number: 20170284350
    Abstract: In a saddle-ride type vehicle in which an intake device is arranged at a position covered by a fuel tank from above, the intake device including: an air cleaner; a connecting tube having an upstream end thereof connected to the air cleaner; a throttle device including a throttle valve and connected to a downstream end of the connecting tube; and a resonator, a curved portion bulged upward and curved in a chevron shape is formed in the connecting tube, and the resonator arranged between the fuel tank and the connecting tube is connected to the connecting tube on the air cleaner side further than a top portion of the curved portion as seen in a side view of the vehicle.
    Type: Application
    Filed: March 27, 2017
    Publication date: October 5, 2017
    Applicant: HONDA MOTOR CO., LTD.
    Inventor: Yoshinobu OZAKI
  • Publication number: 20170284347
    Abstract: In a saddle-ride type vehicle in which an air cleaner is arranged inward in a vehicle width direction of at least a pair of left and right main frames and arranged below a riding seat, a cleaner case for the air cleaner is configured long in a longitudinal direction of the vehicle and has a cleaner case main portion storing therein a cleaner element, and a connecting tube connection portion extending forward from the cleaner case main portion so as to be connected to a connecting tube. A pair of left and right side covers covering the cleaner case from opposite sides in the vehicle width direction are supported by side cover supporting portions that are provided on left and right opposite side walls of the cleaner case main portion and the connecting tube connection portion.
    Type: Application
    Filed: March 20, 2017
    Publication date: October 5, 2017
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Yoshinobu OZAKI, Mizuki FUJIWARA
  • Publication number: 20170241381
    Abstract: In a saddle-ride type vehicle in which a cleaner case of an air cleaner is configured with first and second case half bodies coupled to each other and arranged in a vehicle width direction, and is arranged in a space surrounded by a vehicle body frame, a first case half body is provided with: a cleaner element insertion/removal port opened outward so as to permit insertion and removal of a cleaner element therethrough; a purified air outlet connected with a connecting tube for guiding purified air to an engine body side; and an outside air suction port for introducing air from an outside into the cleaner case.
    Type: Application
    Filed: January 13, 2017
    Publication date: August 24, 2017
    Inventor: Yoshinobu OZAKI
  • Patent number: 9556833
    Abstract: An air cleaner positioned above a cylinder head is connected to an intake port of the cylinder head through a connecting tube, a throttle device, and an insulator. An insulator attachment surface is formed in a rear-side wall of a cylinder head such that the insulator attachment surface is inclined to extend in a forward direction while extending upwardly. An insulator is formed in such an arc shape in a side view wherein a flow direction of air flowing inside the insulator is directed more in a forward direction as the air approaches the cylinder head. A throttle device having an intake passage thereof directed in a vertical direction is connected to the insulator. A connecting tube is formed to curve in such a shape that the connecting tube has its upstream end opened in a forward direction and is rounded outwardly in an obliquely rearward direction.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: January 31, 2017
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Yoshinobu Ozaki, Ryoji Imai
  • Patent number: 9150269
    Abstract: In a motorcycle including an engine equipped with an inlet system, a crankcase and a cylinder block; and a fuel tank which supplies fuel to the engine, an evaporation system is formed in a compact manner using the layout space above the crankcase. The evaporation system includes a canister which temporarily traps evaporated fuel evaporated inside the fuel tank; a purge device which introduces the evaporated fuel trapped in the canister into the inlet system; and a fresh air filter which filters air introduced to the canister during a purging operation for making the inlet system suction the evaporated fuel. In such evaporation system, the canister is disposed in the rear of the cylinder block and above the crankcase, and the air filter is disposed between the cylinder block and the canister.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: October 6, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yoshinobu Ozaki, Takeshi Shimura
  • Patent number: 9120524
    Abstract: A vehicle can include a pair of right and left main frames extending from a head pipe of a front portion to a rear direction. An engine is disposed below the main frames, a fuel tank is disposed above the main frames, and an air cleaner is disposed above the engine E and adjacent to the fuel tank. The air cleaner is disposed in the front direction side of the fuel tank, and a part of the air cleaner is disposed in the lower direction side of the fuel tank. An inner side portion disposed between the pair of right and left main frames and outer side portions disposed so as to bulge to the outer side in the width direction of the vehicle of the pair of right and left main frames are connected.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: September 1, 2015
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Yoshinobu Ozaki
  • Patent number: 8839756
    Abstract: An intake air routing device for an engine having a plurality of cylinders, includes a pair of half case bodies forming an air chamber, an air filter arranged in the air chamber and configured to purify outside air received via an intake duct, and a plurality of intake passages extending from the air chamber. The plurality of intake passages are connected with respective intakes ports of the engine. A partition plate is disposed in the air chamber, and is formed separately from the case bodies. The partition plate is arranged in the air chamber such that it extends in the air chamber by a predetermined length in a direction intersecting with a direction where the intake passages are lined up so as to partition the intake passages from each other. Such intake air routing device reduces intake interference while maintaining a small size of the intake air routing device.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: September 23, 2014
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yoshinobu Ozaki, Akihiko Hamazaki
  • Publication number: 20140209060
    Abstract: An air cleaner positioned above a cylinder head is connected to an intake port of the cylinder head through a connecting tube, a throttle device, and an insulator. An insulator attachment surface is formed in a rear-side wall of a cylinder head such that the insulator attachment surface is inclined to extend in a forward direction while extending upwardly. An insulator is formed in such an arc shape in a side view wherein a flow direction of air flowing inside the insulator is directed more in a forward direction as the air approaches the cylinder head. A throttle device having an intake passage thereof directed in a vertical direction is connected to the insulator. A connecting tube is formed to curve in such a shape that the connecting tube has its upstream end opened in a forward direction and is rounded outwardly in an obliquely rearward direction.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 31, 2014
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Yoshinobu OZAKI, Ryoji IMAI
  • Publication number: 20140131130
    Abstract: A vehicle can include a pair of right and left main frames extending from a head pipe of a front portion to a rear direction. An engine is disposed below the main frames, a fuel tank is disposed above the main frames, and an air cleaner is disposed above the engine E and adjacent to the fuel tank. The air cleaner is disposed in the front direction side of the fuel tank, and a part of the air cleaner is disposed in the lower direction side of the fuel tank. An inner side portion disposed between the pair of right and left main frames and outer side portions disposed so as to bulge to the outer side in the width direction of the vehicle of the pair of right and left main frames are connected.
    Type: Application
    Filed: October 24, 2013
    Publication date: May 15, 2014
    Applicant: HONDA MOTOR CO., LTD.
    Inventor: Yoshinobu OZAKI