Patents by Inventor Yoshinobu Saito

Yoshinobu Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220187274
    Abstract: Provided is a test plate with which a test can be carried out in a simple manner and problems that may otherwise occur along with the lapse of time hardly occur. This invention provides a nematode trap plate (1) including: a container (10); and a solid medium (11) formed in the container (10), the solid medium (11) allowing nematodes to move over its surface, and the surface of the solid medium (11) having at least one fall-in cavity (2a) for catching nematodes.
    Type: Application
    Filed: April 24, 2020
    Publication date: June 16, 2022
    Inventors: Michiyo Suzuki, Yuya Hattori, Toshiyuki Saito, Yoshinobu Harada
  • Publication number: 20220163875
    Abstract: An accessory device capable of preventing setting information to be written from being destroyed is provided. The accessory device capable of being attached to or detached from an electronic apparatus, comprising an operation member, a lock mechanism configured to perform a locking operation to lock the accessory device and the electronic apparatus in response to an operation of the operation member, a movement restriction release mechanism configured to release a restriction on a movement of the operation member, and an operation restricting member configured to restrict an operation of the movement restriction release mechanism. The operation restricting member makes it more difficult to perform the operation of the movement restriction release mechanism when a power of the accessory device is in an on state than when the power of the accessory device is in an off state.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 26, 2022
    Inventors: Keiichiro Saito, Yoshinobu Okano, Takayuki Shu
  • Patent number: 11325284
    Abstract: A protective member forming method for forming a protective member on a surface on one side of a wafer includes a resin state recognizing step of heating a thermoplastic resin in contact with the surface on the one side of the wafer while propagating an ultrasonic vibration between a resin placing surface of a stage and a wafer holding surface and recognizing whether or not the thermoplastic resin sandwiched between the surface on the one side of the wafer held on the wafer holding surface and the resin placing surface has been unified. When the thermoplastic resin is recognized to have been unified, the thermoplastic resin is spread out onto a whole area of the surface on the one side of the wafer, followed by cooling the thermoplastic resin to cure the thermoplastic resin.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: May 10, 2022
    Assignee: DISCO CORPORATION
    Inventor: Yoshinobu Saito
  • Publication number: 20220115250
    Abstract: A laser beam irradiating unit of a laser processing apparatus includes a laser oscillator configured to oscillate a laser, a condenser configured to condense a laser beam emitted from the laser oscillator, and a plasma light detector configured to detect plasma light emitted from a region subjected to processing by application of the laser beam.
    Type: Application
    Filed: October 5, 2021
    Publication date: April 14, 2022
    Inventor: Yoshinobu SAITO
  • Publication number: 20220108903
    Abstract: A processing apparatus includes a wafer unloading unit, a wafer table, a frame unloading unit, a frame table, a tape affixing unit, a tape-affixed frame transporting unit, a tape compression-bonding unit, a frame unit unloading unit that unloads a frame unit in which a tape of a tape-affixed frame and the undersurface of a wafer are compression-bonded to each other from the wafer table, a reinforcing portion removing unit, a no-ring unit unloading unit, and a frame cassette table.
    Type: Application
    Filed: September 20, 2021
    Publication date: April 7, 2022
    Inventors: Yoshinobu SAITO, Yoshinori KAKINUMA
  • Publication number: 20220108910
    Abstract: A holding mechanism includes a wafer holding section that holds a wafer under suction, and a frame support section that is disposed on the outer circumference of the wafer holding section and that supports a frame. The frame support section includes a permanent magnet.
    Type: Application
    Filed: September 20, 2021
    Publication date: April 7, 2022
    Inventors: Yoshinobu SAITO, Yoshinori KAKINUMA, Takashi MORI
  • Publication number: 20220063059
    Abstract: A grinding wheel includes an annular base having a free end portion and a plurality of segment grindstones fixed on the free end portion of the annular base in a state of being spaced from one another in a circumferential direction. The plurality of segment grindstones are divided into a plurality of grindstone groups each including a predetermined number of segment grindstones. Each of the segment grindstones included in each of the grindstone groups has a grinding surface formed into a rectangular shape having a long side and a short side. The segment grindstones of the grindstone group are sequentially fixed on the free end portion of the annular base from an outer circumferential side toward an inner circumferential side such that directions in which the long sides of the segment grindstones extend are changed from the circumferential direction to a diametric direction of the free end portion.
    Type: Application
    Filed: August 10, 2021
    Publication date: March 3, 2022
    Inventor: Yoshinobu SAITO
  • Publication number: 20220020696
    Abstract: A workpiece management method includes a frame unit forming step of forming a frame unit with a workpiece supported in an opening of an annular frame via a resin sheet, a printing step of, after performing the frame unit forming step, printing identification information of the workpiece on the resin sheet in an area between an outer periphery of the workpiece and an inner periphery of the annular frame, a processing step of processing the workpiece by a processing machine, a separation step of separating the processed workpiece from the resin sheet, and a storage step of storing the resin sheet from which the workpiece has been separated. A sheet cutting machine suitable for use in the workpiece management method is also disclosed.
    Type: Application
    Filed: July 19, 2021
    Publication date: January 20, 2022
    Inventors: Yoshinobu SAITO, Daisuke YAMASHITA
  • Publication number: 20220020614
    Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 20, 2022
    Inventors: Yukiyasu MASUDA, Yoshikuni MIGIYAMA, Takashi UCHIHO, Ryosuke KUROSAWA, Toshiyuki YOSHIKAWA, Toshio TSUCHIYA, Masanobu TAKENAKA, Tomoyuki HONGO, Takashi MORI, Yoshinori KAKINUMA, Yoshinobu SAITO, Jonghyun RYU
  • Patent number: 11222806
    Abstract: A tape adapted to be attached to a workpiece. The tape has a pattern for checking tension applied to the tape. The pattern is provided on the whole or part of the front side of the tape. The tension may be checked before expansion of the tape, during expansion of the tape, or after expansion of the tape. The tension may be checked after attaching the tape to the workpiece. By using a tape expander having four holding units holding the four side edge portions of the tape, the tape is expanded by moving the four holding units holding the tape so that the holding units are moved away from the workpiece. Deformation of the pattern due to the expansion of the tape is checked by visual inspection or by using an imaging camera to thereby determine the attached condition of the tape to the workpiece.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: January 11, 2022
    Assignee: DISCO CORPORATION
    Inventor: Yoshinobu Saito
  • Publication number: 20210384076
    Abstract: In a processing method for a wafer with a mark formed in an outer peripheral portion thereof, a frame unit having the wafer, a tape, and a ring frame is provided, a set of processing conditions for processing the wafer is selected, and a representative image associated with the set of processing conditions is displayed on a display unit. The ring frame includes a notch formed in an outer periphery thereof. In the frame unit, the mark and the notch are in a positional relationship set in accordance with the set of processing conditions. The positional relationship is presented in the representative image.
    Type: Application
    Filed: May 18, 2021
    Publication date: December 9, 2021
    Inventor: Yoshinobu SAITO
  • Publication number: 20210358796
    Abstract: A holding mechanism includes a Bernoulli pad that holds a plate-shaped body, a hand on which the Bernoulli pad is disposed, a sensor that is disposed on the hand and detects that the plate-shaped body is held under suction by the Bernoulli pad, a lateral movement restriction section disposed on the hand, a tube that connects an air source supplying air to the Bernoulli pad and the Bernoulli pad, an adjustment valve that is disposed in the tube and adjusts a flow rate of air supplied to the Bernoulli pad, and a control section that controls operation of the adjustment valve. The control section gradually increases the flow rate of the air supplied from the adjustment valve to the Bernoulli pad and, when it is detected by the sensor that the plate-shaped body has been held under suction by the Bernoulli pad, fixes the flow rate of the air.
    Type: Application
    Filed: April 26, 2021
    Publication date: November 18, 2021
    Inventors: Yoshinori KAKINUMA, Yoshikuni Migiyama, Yoshinobu SAITO, Jonghyun RYU
  • Patent number: 11162881
    Abstract: A test apparatus for measuring strength of a specimen includes: a lower container having an opening that opens upward; an upper container having an opening that opens downward and being sized to be insertable into the opening of the lower container; a support unit that is provided in the opening of the lower container and supports the specimen; a pressing unit including an indenter that presses the specimen, and a load measurement unit that measures a load applied to the indenter; and a movement mechanism that moves the indenter closer and away relative to the support unit, in which when the specimen supported by the support unit is pressed by the indenter moved by the movement mechanism, the upper container is positioned so as to cover the specimen.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: November 2, 2021
    Assignee: DISCO CORPORATION
    Inventor: Yoshinobu Saito
  • Publication number: 20210260711
    Abstract: A processing apparatus includes a chuck table having a holding surface for holding a workpiece; a horizontal moving mechanism that moves the chuck table in a horizontal direction and is supplied with a first oil; and a vertical moving mechanism that moves a processing unit in a vertical direction and is supplied with a second oil. Before mounting the workpiece on the holding surface, the holding surface is imaged by a camera while being irradiated with light, and it is examined whether or not the picked-up image is emitting light. If there is a light-emitting part in the picked-up image, it is determined that oil is adhered to the light-emitting part.
    Type: Application
    Filed: February 9, 2021
    Publication date: August 26, 2021
    Inventors: Yoshinobu SAITO, Yoshikuni MIGIYAMA
  • Publication number: 20210257232
    Abstract: After the inside of a sealed accommodating chamber of a tape attaching apparatus is decompressed, a dicing tape covering a back surface of a wafer is attached to an upper surface of an annular projection of the wafer. Thereafter, the inside of the accommodating chamber is pressurized, to press the dicing tape toward the recess in the back surface of the wafer. As a result, the dicing tape can be attached, substantially without a gap, to substantially the whole area of the back surface of the wafer inclusive of a corner part which is the boundary between the recess and the annular projection. By adjusting the air pressure inside the accommodating chamber, the dicing tape can be easily attached to substantially the whole area of the back surface of the wafer in a short time.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 19, 2021
    Inventor: Yoshinobu SAITO
  • Patent number: 11090921
    Abstract: There is provided a peeling method of a resin sheet for peeling off the resin sheet from a plate-shaped object to which the resin sheet is stuck. The peeling method includes a resin sheet heating step of heating an end part of the resin sheet of the plate-shaped object to which the resin sheet is stuck to turn up the resin sheet from the end part and form a peeling origin point and a resin sheet removal step of removing the resin sheet from the plate-shaped object through peeling off the resin sheet from the peeling origin point.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: August 17, 2021
    Assignee: DISCO CORPORATION
    Inventor: Yoshinobu Saito
  • Publication number: 20210134598
    Abstract: A resin protection member forming apparatus includes a stage having a resin placement surface on which a particulate thermoplastic resin is to be placed. The stage includes a Peltier device, a DC power source, and a switch. The Peltier device is disposed inside the stage and has an upper surface, which is parallel and close to the resin placement surface, and a lower surface, which is far from the resin placement surface. The DC power source supplies a DC current to the Peltier device. The switch changes a direction of the DC current to be supplied to the Peltier device, between a first direction to heat the upper surface of the Peltier device and a second direction, opposite to the first direction, to cool the upper surface of the Peltier device.
    Type: Application
    Filed: November 4, 2020
    Publication date: May 6, 2021
    Inventor: Yoshinobu SAITO
  • Publication number: 20210134623
    Abstract: A sheet holding unit of a resin sheet fixing apparatus includes: a Peltier element that has an upper surface parallel to a sheet holding surface of a sheet holding table and near the sheet holding surface and a lower surface far from the sheet holding surface; a direct current (DC) power source that supplies the Peltier element with a DC; and a switch that switches a direction of the DC supplied to the Peltier element. By causing a current to flow in the Peltier element in a first direction, a resin sheet is softened and welded to a wafer, and by switching the switch to cause a current to flow in the Peltier element in a second direction, the resin sheet held on the sheet holding surface is cured and fixed to a surface on one side of the wafer.
    Type: Application
    Filed: November 4, 2020
    Publication date: May 6, 2021
    Inventor: Yoshinobu SAITO
  • Publication number: 20210129394
    Abstract: A protective member forming method for forming a protective member on a surface on one side of a wafer includes a resin state recognizing step of heating a thermoplastic resin in contact with the surface on the one side of the wafer while propagating an ultrasonic vibration between a resin placing surface of a stage and a wafer holding surface and recognizing whether or not the thermoplastic resin sandwiched between the surface on the one side of the wafer held on the wafer holding surface and the resin placing surface has been unified. When the thermoplastic resin is recognized to have been unified, the thermoplastic resin is spread out onto a whole area of the surface on the one side of the wafer, followed by cooling the thermoplastic resin to cure the thermoplastic resin.
    Type: Application
    Filed: November 4, 2020
    Publication date: May 6, 2021
    Inventor: Yoshinobu SAITO
  • Publication number: 20210082764
    Abstract: A method of processing a workpiece includes a thermosetting step of heating an area of an expandable sheet around a workpiece to a predetermined temperature or higher and thereafter cooling the heated area of the expandable sheet to make the area harder than before the area has been heated, and after the thermosetting step, an expanding step of expanding the area of the expandable sheet around the workpiece in planar directions to divide the workpiece into chips or to increase distances between the adjacent chips.
    Type: Application
    Filed: September 10, 2020
    Publication date: March 18, 2021
    Inventor: Yoshinobu SAITO