Abstract: A holding mechanism includes a Bernoulli pad that holds a plate-shaped body, a hand on which the Bernoulli pad is disposed, a sensor that is disposed on the hand and detects that the plate-shaped body is held under suction by the Bernoulli pad, a lateral movement restriction section disposed on the hand, a tube that connects an air source supplying air to the Bernoulli pad and the Bernoulli pad, an adjustment valve that is disposed in the tube and adjusts a flow rate of air supplied to the Bernoulli pad, and a control section that controls operation of the adjustment valve. The control section gradually increases the flow rate of the air supplied from the adjustment valve to the Bernoulli pad and, when it is detected by the sensor that the plate-shaped body has been held under suction by the Bernoulli pad, fixes the flow rate of the air.

Abstract: A warning is issued about an irregularity concerning a wafer stored in a cassette if a difference between a value of an apparent thickness of the wafer and the previously obtained value of an actual thickness of the wafer exceeds a threshold value, the value of the apparent thickness of the wafer being obtained by a non-contact-type sensor for detecting a front portion of the wafer laterally of the wafer. Consequently, the wafer is prevented from being damaged when it is taken out of the cassette.

Abstract: An LED array includes: a substrate having a depressing-projecting structure formed on a surface of the substrate; a planarization layer formed on the depressing-projecting structure; a plurality of micro LED elements each of which is formed on the planarization layer; and a stray light attenuating groove formed between a pair of adjacent micro LED elements among the plurality of micro LED elements, and extending from toward the pair of micro LED elements to toward the depressing-projecting structure at least part way of the planarization layer.

Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to a back surface of the wafer, a frame unit carrying-out unit, and a beveled part removing unit that cuts and removes, in a ring manner, a beveled part formed in an outer circumferential surplus region from the wafer of a frame unit.

Abstract: An expanding machine for expanding a sheet having a workpiece bonded on the sheet. The expanding machine includes an expansion mechanism configured to expand the sheet, a cooling unit that cools the workpiece bonded on the sheet, and a temperature distribution detection unit that, before expanding the sheet by the expansion mechanism, detects a temperature distribution of the workpiece cooled by the cooling unit. A method for expanding a sheet having a workpiece bonded on the sheet is also disclosed.

Abstract: A wafer manufacturing method includes forming a first peel-off layer in an ingot by applying a laser beam with a focused spot of the laser beam in the ingot at a first depth from an end face of the ingot for fabricating a larger-diameter wafer, forming a second peel-off layer in the ingot for fabricating a smaller-diameter wafer by applying the laser beam to an area of the ingot that is smaller in diameter than the ingot while positioning the focused spot in the ingot at a second depth, which is smaller than the first depth, from the end face of the ingot, and forming an annular first separating wall along an outer circumferential edge of the smaller-diameter wafer by applying the laser beam to the ingot while positioning the focused spot on an annular area extending from the end face of the ingot to the second peel-off layer.

Abstract: A dryness detection method of detecting dryness of a liquid resin composition containing a solvent. The dryness detection method includes a wavelength selection step of selecting a light absorption wavelength of the solvent, a light source selection step of selecting a light source that emits light including light of the selected wavelength, a light receiving step of applying the light that has been emitted from the light source to the liquid resin composition, and receiving light that has passed through the liquid resin composition, and a determination step of finding whether or not the light of the selected wavelength after absorption in the solvent in the light receiving step exceeds in quantity a predetermined threshold, and if the threshold is found to be exceeded, determining that the solvent has evaporated and the liquid resin composition has dried. A dryness determination apparatus is also disclosed.

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

Abstract: After the inside of a sealed accommodating chamber of a tape attaching apparatus is decompressed, a dicing tape covering a back surface of a wafer is attached to an upper surface of an annular projection of the wafer. Thereafter, the inside of the accommodating chamber is pressurized, to press the dicing tape toward the recess in the back surface of the wafer. As a result, the dicing tape can be attached, substantially without a gap, to substantially the whole area of the back surface of the wafer inclusive of a corner part which is the boundary between the recess and the annular projection. By adjusting the air pressure inside the accommodating chamber, the dicing tape can be easily attached to substantially the whole area of the back surface of the wafer in a short time.

Abstract: A holding mechanism includes a wafer holding section that holds a wafer under suction, and a frame support section that is disposed on the outer circumference of the wafer holding section and that supports a frame. The frame support section includes a permanent magnet.

Abstract: There is provided a processing method of a workpiece by which the workpiece is processed. The processing method includes a thermocompression bonding step of executing thermocompression bonding of a first sheet composed of a thermoplastic resin to a front surface side of the workpiece by disposing the first sheet on the front surface side of the workpiece and heating the first sheet, a processing step of processing the workpiece together with the first sheet, and a separation step of separating the first sheet from the workpiece by moving a second sheet composed of a thermoplastic resin after executing thermocompression bonding of the second sheet to the first sheet by disposing the second sheet on the first sheet processed and heating the second sheet.

Abstract: A sheet holding unit of a resin sheet fixing apparatus includes: a Peltier element that has an upper surface parallel to a sheet holding surface of a sheet holding table and near the sheet holding surface and a lower surface far from the sheet holding surface; a direct current (DC) power source that supplies the Peltier element with a DC; and a switch that switches a direction of the DC supplied to the Peltier element. By causing a current to flow in the Peltier element in a first direction, a resin sheet is softened and welded to a wafer, and by switching the switch to cause a current to flow in the Peltier element in a second direction, the resin sheet held on the sheet holding surface is cured and fixed to a surface on one side of the wafer.

Abstract: A tape pressure bonding apparatus includes an upper chamber, a lower chamber, a lifting mechanism that switches between a closed state in which the upper chamber is moved downward to be brought into contact with the lower chamber and an open state in which the upper chamber is separated from the lower chamber, a vacuum section that evacuates the upper chamber and the lower chamber, and an atmosphere opening section that opens the upper chamber and the lower chamber to the atmosphere. The lower chamber accommodates a wafer table that has a holding surface including a circular recess for supporting only a peripheral surplus region of the wafer and making a device region in a non-contact state. The tape pressure bonding apparatus includes a positive pressure generating section that supplies air into the circular recess of the wafer table to establish a positive pressure state in the circular recess.

Abstract: A processing apparatus includes a wafer cassette table, a wafer carrying-out mechanism, a wafer table, a frame housing unit, a frame carrying-out mechanism, a frame table, a tape sticking unit, a tape-attached frame conveying mechanism, a tape pressure bonding unit, a frame unit carrying-out mechanism, a reinforcing part removing unit, a ring-free unit carrying-out mechanism, and a frame cassette table. The wafer carrying-out mechanism includes a Bernoulli chuck mechanism that jets gas to the back surface of the wafer and generates a negative pressure. The gas jetted by the Bernoulli chuck mechanism is inert gas. The wafer carrying-out mechanism jets the inert gas from the Bernoulli chuck mechanism to suppress oxidation of the back surface of the wafer when the wafer is carried out.

Abstract: A warning is issued about an irregularity concerning a wafer stored in a cassette if a difference between a value of an apparent thickness of the wafer and the previously obtained value of an actual thickness of the wafer exceeds a threshold value, the value of the apparent thickness of the wafer being obtained by a non-contact-type sensor for detecting a front portion of the wafer laterally of the wafer. Consequently, the wafer is prevented from being damaged when it is taken out of the cassette.

Abstract: Processing water regeneration equipment includes a waste liquid treatment apparatus that treats waste liquid discharged from a processing apparatus for processing a workpiece by use of processing water, and a fuel cell apparatus that causes a chemical reaction between hydrogen and oxygen to produce electricity and water. The waste liquid treatment apparatus includes a positive electrode and a negative electrode disposed in a tank for reserving the waste liquid, and a hydrogen production unit that supplies electric power to the positive electrode and the negative electrode to produce hydrogen. The fuel cell apparatus causes a chemical reaction between the hydrogen produced by the hydrogen production unit and oxygen in the air to produce electricity and water, and the electricity and water thus produced are utilized in the processing apparatus.

Abstract: A processing apparatus includes a wafer table that supports a wafer, a frame table that supports an annular frame, a first tape pressure bonding unit that includes a first pressure bonding roller for executing pressure bonding of a tape to the annular frame, and a second tape pressure bonding unit that includes a second pressure bonding roller for executing pressure bonding of the tape of the tape-attached annular frame to a front surface or a back surface of the wafer. A first heating unit is disposed in one of or both the frame table and the first pressure bonding roller, while a second heating unit is disposed in one of or both the wafer table and the second pressure bonding roller.

Abstract: A tape affixing apparatus includes a frame support table for supporting an annular frame, a lifting and lowering unit for lifting and lowering the frame support table, a tape affixing unit, and a controller. The tape affixing unit includes a tape uncoiler, a tape take-up reel, and a presser roller movable from one end to the other end of the annular frame supported on the frame support table while pressing a tape paid out from the tape uncoiler to affix the tape to the annular frame. The controller positions the presser roller in a pressing position, affixes the tape to one end of the annular frame while applying tension to the tape, moves the presser roller toward the other end of the annular frame, and keeps the tension on the tape constant by lifting the frame support table in synchronism with the presser roller as it is moved.

Abstract: A processing apparatus includes a wafer cassette table, a wafer carrying-out mechanism, a wafer table, a frame housing unit, a frame carrying-out mechanism, a frame table, a tape sticking unit, a tape-attached frame conveying mechanism, a tape pressure bonding unit, a frame unit carrying-out mechanism, a reinforcing part removing unit, a ring-free unit carrying-out mechanism, and a frame cassette table. The wafer carrying-out mechanism includes a Bernoulli chuck mechanism that jets gas to the back surface of the wafer and generates a negative pressure. The gas jetted by the Bernoulli chuck mechanism is inert gas. The wafer carrying-out mechanism jets the inert gas from the Bernoulli chuck mechanism to suppress oxidation of the back surface of the wafer when the wafer is carried out.

Abstract: A processing apparatus includes a chuck table having a holding surface for holding a workpiece; a horizontal moving mechanism that moves the chuck table in a horizontal direction and is supplied with a first oil; and a vertical moving mechanism that moves a processing unit in a vertical direction and is supplied with a second oil. Before mounting the workpiece on the holding surface, the holding surface is imaged by a camera while being irradiated with light, and it is examined whether or not the picked-up image is emitting light. If there is a light-emitting part in the picked-up image, it is determined that oil is adhered to the light-emitting part.