Abstract: An apparatus and method for mounting chip type electronic parts, in which the parts can be smoothly, reliably and accurately mounted on, for example, a printed circuit board. The apparatus for mounting the chip type parts comprises means for conveying the part to be mounted, means for supplying the part onto the conveying means, means for receiving the part from the conveying means and for mounting the same onto a printed circuit board for example, and also means for positioning the part upon the conveying means before transfer of the part to the receiving and mounting means. The method for mounting a chip type part according to the present invention comprises the steps of supplying the part onto means for conveying the same to be mounted, positioning of the part on the conveying means, and then removing the part off the conveying means and mounting the same.

Abstract: Apparatus for automatically mounting chip type circuit elements on printed circuit boards is constructed in a manner to mount a feed wheel for carrying out the delivery of a chip tape on a lower frame. A lever is mounted with respect to the feed wheel through a one way clutch, so as to allow the lever to be pressed by a cam provided on a reciprocating upper frame which supports a mounting head. The feed wheel is thus rotated in the actuating direction of the one-way clutch to intermittently feed the chip tape and permit another chip type circuit element to be disposed at a chip type circuit element removing position, each time when the mounting head is returned to its original position.

Abstract: An insert sub-assembly of an insert device of a machine for processing and inserting parallel lead electronic components from an electronic component web carrier into lead receiving openings in a printed circuit board includes a first slider device slidably mounted on a frame. A driver mounted on the frame drives the first slider device. A second slider device slidably mounted on the frame cooperates with movement of the first slider device and includes a lead holding and guiding device for holding and guiding an electronic component and a push bar for displacing the component from a predetermined position to an inserted position under the control of the lead holding and guiding device. A feed device mounted on the frame is driven by an intermittent drive to feed the electronic component web carrier intermittently, pitch by pitch. A cutter separates one electronic component from the electronic component web carrier fed by the feed device.

Abstract: A method whereby chip type circuit elements are mounted at predetermined locations on a printed circuit board by a suction means and apparatus for performing the method are disclosed. The suction means picks up each circuit element from a respective stack supported in a vertical magazine and transfers and positions them above the predetermined locations on the printed circuit board which can have a predetermined pattern of laminar conductors on the upper surface thereof. The circuit elements are then released by termination of the applied suction and adhered to the board by a thermoplastic adhesive setting operation.

Abstract: A machine for processing and inserting parallel lead electronic components from electronic component web carriers into lead receiving openings in a printed circuit board has improved supply apparatus for selectively receiving an electronic component at a first position and supplying the electronic component to a second predetermined position. The supply apparatus includes a supply sub-assembly having electronic component web carrier apparatus for supporting a plurality of electronic component web carriers at predetermined intervals. Each electronic component web carrier supported by the electronic component web carrier support apparatus is intermittently fed by an intermittent feed device. One electronic component located at the front end of the electronic component web carrier fed by the intermittent feed device is received and gripped at the first position by an electronic component grip device.

Abstract: An apparatus for trimming and securing parallel lead electronic components inserted in a printed circuit substrate is provided. The apparatus includes a selectively rotatable driving assembly selectively displaceable towards an electronic component inserted into a printed circuit substrate, a lead bending assembly mounted on the driving assembly for bending the leads, and a cutting assembly mounted on the bending assembly for cutting the leads, the bending and cutting assemblies actuated by displacement of the driving assembly. The apparatus may include a sub-assembly for disposal of chips removed from the leads during cutting and a detection sub-assembly for detecting the presence of an inserted electronic component.

Abstract: A machine for processing and securing parallel lead electronic circuit elements into lead receiving openings formed in a printed circuit board is provided. The machine includes a supply assembly for selectively supplying one group of a plurality of distinct groups of parallel lead electronic circuit elements, the supply assembly including a selecting sub-assembly for selecting one of the circuit elements from the selected group circuit elements to be supplied. A transfer assembly includes a chuck for receiving the supplied circuit elements and displacing same to a release position. An insert assembly is adapted to effect release of the circuit elements when the chuck is displaced to a release position and includes a holding sub-assembly for receiving each circuit element released by the chuck at the release position and a plunger sub-assembly adapted to engage the circuit elements at the release position and displace the circuit elements from the release position to an inserted position.