Patents by Inventor Yoshinobu TOYAMA

Yoshinobu TOYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid ejecting head and liquid ejecting apparatus
    Patent number: 10843463
    Abstract: A liquid ejecting head that includes a first piezoelectric element and a second piezoelectric element, a first wire that extends in a first direction and that electrically couples the first piezoelectric element and a wiring substrate to each other, and a second wire that is adjacent to the first wire in a second direction intersecting the first direction and that extends in the first direction, the second wire electrically coupling the second piezoelectric element and the wiring substrate to each other. A first protrusion is formed on a surface of the first wire in a mounting area to where the wiring substrate is joined, and a second protrusion is formed on a surface of the second wire in the mounting area and at a position different from that of the first protrusion in the first direction.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: November 24, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Sosuke Yamasaki, Hitoshi Takaai, Yuma Fukuzawa, Yoshinobu Toyama
  • LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
    Publication number: 20200070516
    Abstract: A liquid ejecting head that includes a first piezoelectric element and a second piezoelectric element, a first wire that extends in a first direction and that electrically couples the first piezoelectric element and a wiring substrate to each other, and a second wire that is adjacent to the first wire in a second direction intersecting the first direction and that extends in the first direction, the second wire electrically coupling the second piezoelectric element and the wiring substrate to each other. A first protrusion is formed on a surface of the first wire in a mounting area to where the wiring substrate is joined, and a second protrusion is formed on a surface of the second wire in the mounting area and at a position different from that of the first protrusion in the first direction.
    Type: Application
    Filed: August 23, 2019
    Publication date: March 5, 2020
    Inventors: Sosuke YAMASAKI, Hitoshi TAKAAI, Yuma FUKUZAWA, Yoshinobu TOYAMA