Abstract: A copper alloy comprising 0.1-7.3% of titanium and optionally comprising one or more of zinc, silicon and silver in amounts of 0.001-10%, 0.001-3% and 0.001-1%, respectively, wherein its surface layer contains an oxide containing titanium. This copper alloy exhibits sterilizing effect based on copper and antibacterial effect based on optical catalyst function resulting from the oxide which contains titanium dispersed in the surface layer. The oxide containing titanium can be produced by heating the copper alloy which has the above-mentioned composition and is produced in the usual manner to 200-800° C. to oxidize titanium preferentially. In the case that zinc and silicon are contained, these elements are also preferentially oxidized by the heating, so as to produce oxides. Thus, zinc exhibits antibacterial effect and sterilizing effect. Silicon exhibits hydrophilicity. Silver exhibits sterilizing effect.

Abstract: A copper alloy for use in an electrical and electronic parts contains Fe of 1.8-2.0 weight %, P of 0.025-0.040 weight %, Zn of 1.7-1.9 weight %, Sn of 0.40-1.0 weight %, and Ca of 0.0001-0.01 weight %, the balance being Cu and inevitable impurities. Further the copper alloy may contain one kind or two kinds of the elements selected from the group of Cr of 0.001-0.01 weight % and Mg of 0.001-0.01 weight %, by 0.001-0.01 weight % at a total amount. This copper alloy for use in electrical and electronic parts can dissolve the prior problem that cracking is apt to occur on the ingot during heating on the hot working process or during hot working, and can prevent a short-circuit due to the migration phenomenon of copper which is apt to occur with the high density integration of the electrical and electronic parts made of copper alloy, and further can improve the tool service life (wear resistance) of the die and can decrease the producing cost thereof.