Abstract: A double-structured stick cosmetic includes a solid-form outer layer containing a first oil composition, and an inner core containing a second oil composition, in which the first oil composition contains (A) an alkyl-modified silicone having an alkyl group having 16 to 50 carbon atoms and (B) a wax in a solid-form at 25° C. other than (A). The component (A) may have a melting point of 25° C. or higher and 50° C. or lower. A mass ratio [(A)/(B)] of the component (A) to the component (B) contained in the first oil composition may be 0.2 or larger and 1.5 or smaller.

Abstract: A rod-shaped cosmetic includes a rod-shaped main body part composed of a cosmetic composition, and a cavity part extending in the longitudinal direction of the rod-shaped main body part and opening at one end or at both ends of the rod-shaped main body part is provided inside the rod-shaped main body part.

Abstract: A stick-shaped cosmetic material including two or more regions divided in a longitudinal direction of the stick-shaped cosmetic material, in which the two or more regions include a first region containing a first cosmetic composition containing a wax (A1) having a melting point of 65° C. or higher as an oil component in the first cosmetic composition, and a second region containing a second cosmetic composition containing, as oil components in the second cosmetic composition, the wax (A1) and a fatty acid triglyceride (A2) having a melting point of 30° C. or higher, the first region and the second region are adjacent to each other, and when content ratios (mass %) of the wax (A1) based on a total amount of the oil components in the first cosmetic composition and the second cosmetic composition are defined as M1 and M2, respectively, M1>M2 is satisfied.

Abstract: The present invention relates to a double-structured stick cosmetic, including: a solid-form outer layer containing a first oil composition; and an inner core containing a second oil composition, in which the first oil composition contains (A) an alkyl-modified silicone having an alkyl group having 16 to 50 carbon atoms and (B) a wax in a solid-form at 25° C. other than (A). the component (A) may have a melting point of 25° C. or higher and 50° C. or lower. A mass ratio [(A)/(B)] of the component (A) to the component (B) contained in the first oil composition may be 0.2 or larger and 1.

Abstract: It is an object of the present invention to provide a heat pump that can use, as a refrigerant, a substance with which a geometric isomer exists, and a method for designing the same. The present invention is a method for designing a heat pump (1) whose closed circuit configured by connecting a compressor (2), a condenser (3), an expansion valve (4), and an evaporator (5) in this order is filled with a refrigerant containing a refrigerant substance with which a geometric isomer may exist, the method including obtaining an upper limit of stable temperature at which isomerization of the refrigerant substance does not proceed, and setting an upper limit usage temperature of the heat pump (1) so as not to exceed the upper limit of the stable temperature.

Abstract: It is an object of the present invention to provide a heat pump that can use, as a refrigerant, a substance with which a geometric isomer exists, and a method for designing the same. The present invention is a method for designing a heat pump (1) whose closed circuit configured by connecting a compressor (2), a condenser (3), an expansion valve (4), and an evaporator (5) in this order is filled with a refrigerant containing a refrigerant substance with which a geometric isomer may exist, the method including obtaining an upper limit of stable temperature at which isomerization of the refrigerant substance does not proceed, and setting an upper limit usage temperature of the heat pump (1) so as not to exceed the upper limit of the stable temperature.

Abstract: A heat pump device and an organic Rankine cycle device that are capable of maintaining a stable thermal cycle even when an HFO or HCFO is used as the refrigerant. The refrigerant circulation device uses a refrigerant, wherein the refrigerant includes a hydrofluoroolefin or hydrochlorofluoroolefin having a carbon-carbon double bond within the molecular structure, and a reaction suppression unit which suppresses an isomerization reaction of the refrigerant is provided within the refrigerant circulation circuit.

Abstract: The present invention provides a heat pump device and an organic Rankine cycle device that are capable of maintaining a stable thermal cycle even when an HFO is used as the refrigerant in an environment in which the operating temperature reaches a high temperature. The refrigerant circulation device is filled with a refrigerant comprising a hydrofluoroolefin or hydrochlorofluoroolefin having a carbon-carbon double bond within the molecular structure, and has a region in the refrigerant circulation circuit where the operating temperature of the refrigerant reaches 175° C. or higher, wherein an acid suppression unit which suppresses any increase in the acid concentration in the refrigerant is provided in the region where the operating temperature of the refrigerant can reach 175° C.

Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film on a wafer. The liquid chemical is a liquid chemical containing a water-repellent-protecting-film-forming agent for forming the water-repellent protecting film, at the time of cleaning the wafer which has a finely uneven pattern at its surface and contains at least at a part of a surface of a recessed portion of the uneven pattern at least one kind of matter selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, ruthenium and silicon, at least on the surface of the recessed portion. The liquid chemical is characterized in that the water-repellent-protecting-film-forming agent is a water-insoluble surfactant. The water-repellent protecting film formed with the liquid chemical is capable of preventing a pattern collapse of the wafer, in a cleaning step.

Abstract: An object of the present invention is to provide a heat source machine that can reduce the environmental load and can output the thermal energy with high temperature, and a method for operating the heat source machine. A heat source machine of the present invention includes a centrifugal compressor, condensers, expansion valves, and an evaporator, in which a refrigerant enclosed in a refrigerant circulation circuit configured by sequentially connecting the centrifugal compressor, the condensers, the expansion valves, and the evaporator contains a composition A, a composition B, or a composition C, the composition A has 4 or 5 carbon atoms, 6 or more fluorine atoms, and one or more oxygen atoms, the composition B has 4 or 5 carbon atoms and 6 or more fluorine atoms, the composition C has 3 carbon atoms, 2 chlorine atoms, 3 fluorine atoms, and an intramolecular double bond, and the composition A, the composition B, or the composition C has a boiling point of 20° C. or more and a critical temperature of 180° C.

Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film at least on a surface of a recessed portion of an uneven pattern at the time of cleaning a wafer having a finely uneven pattern at its surface and containing silicon at at least a part of the uneven pattern. This liquid chemical contains a silicon compound A represented by the general formula: R1aSi(H)bX4-a-b and an acid A, the acid A being at least one selected from the group consisting of trimethylsilyl trifluoroactate, trimethylsilyl trifluoromethanesulfonate, dimethylsilyl trifluoroactate, dimethylsilyl trifluoromethanesulfonate, butyldimethylsilyl trifluoroactate, butyldimethylsilyl trifluoromethanesulfonate, hexyldimethylsilyl trifluoroacetate, hexyldimethylsilyl trifluoromethanesulfonate, octyldimethylsilyl trifluoroactate, octyldimethylsilyl trifluoromethanesulfonate, decyldimethylsilyl trifluoroacetate and decyldimethylsilyl trifluoromethanesulfonate.

Abstract: Disclosed is a liquid chemical for forming a water repellent protective film on a wafer that has at its surface a finely uneven pattern and contains silicon element at least at a part of the uneven pattern, the water repellent protective film being formed at least on surfaces of recessed portions of the uneven pattern at the time of cleaning the wafer. The liquid chemical contains: a silicon compound (A) represented by the general formula R1aSi(H)b(X)4?a?b and an acid; or a silicon compound (C) represented by the general formula R7gSi(H)h(CH3)w(Z)4?g?h?w and a base that contains no more than 35 mass % of water. The total amount of water in the liquid chemical is no greater than 1000 mass ppm relative to the total amount of the liquid chemical. The liquid chemical can improve a cleaning step that easily induces pattern collapse.

Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film on a wafer. The liquid chemical is a liquid chemical containing a water-repellent-protecting-film-forming agent for forming the water-repellent protecting film, at the time of cleaning the wafer which has a finely uneven pattern at its surface and contains at least at a part of a surface of a recessed portion of the uneven pattern at least one kind of matter selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, ruthenium and silicon, at least on the surface of the recessed portion. The liquid chemical is characterized in that the water-repellent-protecting-film-forming agent is a water-insoluble surfactant. The water-repellent protecting film formed with the liquid chemical is capable of preventing a pattern collapse of the wafer, in a cleaning step.

Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film. The liquid chemical contains an agent for forming a water-repellent protecting film, and a solvent. The agent is for provided to form a water-repellent protecting film on a wafer after a cleaning step for the wafer and before a drying step for the wafer, the wafer having at its surface an uneven pattern and containing at least one kind element of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water-repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized in that the agent for forming a water-repellent protecting film is a compound represented by the following general formula [1].

Abstract: A silicon wafer cleaning agent includes at least a water-based cleaning liquid, and a water-repellent cleaning liquid for providing water-repellent to an uneven pattern at least at recessed portions during a cleaning process. The water-repellent cleaning liquid is a liquid composed of a water-repellent compound containing a reactive moiety which is chemically bondable to Si in the silicon wafer, and a hydrophobic group, or is a liquid wherein 0.1 mass % or more of the water-repellent compound relative to the total quantity of 100 mass % of the water-repellent cleaning liquid and an organic solvent are mixed and contained therein. A cleaning process wherein a pattern collapse is easily induced can be improved by using the cleaning agent.

Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film on a wafer. The liquid chemical is a liquid chemical containing a water-repellent-protecting-film-forming agent for forming the water-repellent protecting film, at the time of cleaning the wafer which has a finely uneven pattern at its surface and contains at least at a part of a surface of a recessed portion of the uneven pattern at least one kind of matter selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, ruthenium and silicon, at least on the surface of the recessed portion. The liquid chemical is characterized in that the water-repellent-protecting-film-forming agent is a water-insoluble surfactant. The water-repellent protecting film formed with the liquid chemical is capable of preventing a pattern collapse of the wafer, in a cleaning step.

Abstract: The present invention provides a heat pump device and an organic Rankine cycle device that are capable of maintaining a stable thermal cycle even when an HFO is used as the refrigerant in an environment in which the operating temperature reaches a high temperature. The refrigerant circulation device is filled with a refrigerant comprising a hydrofluoroolefin or hydrochlorofluoroolefin having a carbon-carbon double bond within the molecular structure, and has a region in the refrigerant circulation circuit where the operating temperature of the refrigerant reaches 175° C. or higher, wherein an acid suppression unit which suppresses any increase in the acid concentration in the refrigerant is provided in the region where the operating temperature of the refrigerant can reach 175° C.

Abstract: The present invention provides a heat pump device and an organic Rankine cycle device that are capable of maintaining a stable thermal cycle even when an HFO or HCFO is used as the refrigerant. The refrigerant circulation device uses a refrigerant, wherein the refrigerant comprises a hydrofluoroolefin or hydrochlorofluoroolefin having a carbon-carbon double bond within the molecular structure, and a reaction suppression unit which suppresses an isomerization reaction of the refrigerant is provided within the refrigerant circulation circuit.