Abstract: A non-aqueous electrolyte secondary cell including: a cathode containing a compound expressed by a general formula AxMyPO4 (wherein A represents an alkali metal and M represents a transition element, which are contained in ranges: 0<x?2 and 1<y?2); an anode containing sintered carbon material prepared by sintering a carbon material capable of doping/dedoping lithium; and a non-aqueous electrolyte solution. This non-aqueous electrolyte secondary cell can exhibit a high temperature storage characteristic and a high capacity.

Abstract: A non-aqueous electrolyte secondary cell including: a cathode containing a compound expressed by a general formula AxMyPO4 (wherein A represents an alkali metal and M represents a transition element, which are contained in ranges: 0<x?2 and 1?y?2); an anode containing sintered carbon material prepared by sintering a carbon material capable of doping/dedoping lithium; and a non-aqueous electrolyte solution. This non-aqueous electrolyte secondary cell can exhibit a high temperature storage characteristic and a high capacity.

Abstract: A non-aqueous electrolyte secondary cell including: a cathode containing a compound expressed by a general formula AxMyPO4 (wherein A represents an alkali metal and M represents a transition element, which are contained in ranges: 0<x?2 and 1?y?2); an anode containing sintered carbon material prepared by sintering a carbon material capable of doping/dedoping lithium; and a non-aqueous electrolyte solution. This non-aqueous electrolyte secondary cell can exhibit a high temperature storage characteristic and a high capacity.

Abstract: Hydrogen lithium titanate prepared by an acid process of lithium titanate and having pH of 11.2 or smaller or hydrogen lithium titanate expressed by general formula H.sub.x Li.sub.y-x Ti.sub.z O.sub.4 (where y.gtoreq.x>0 0.8.ltoreq.y.ltoreq.2.7 and 1.3.ltoreq.z.ltoreq.2.2) is disclosed. Hydrogen lithium titanate may be employed as active materials of positive and negative electrodes of a non-aqueous electrolyte secondary battery thereby realizing a charging capacity greater than a theoretical capacity. It is preferable that hydrogen lithium titanate is formed into a particle shape and includes voids in the particles. It is preferable that the largest particle size is 0.1 .mu.m to 50 .mu.m and the specific surface area is 0.01 m.sup.2 /g to 300 m.sup.2 /g. Hydrogen lithium titanate of the foregoing type can be manufactured by bringing lithium titanate into contact with an acid, such as acetic acid, to substitute protons for lithium ions.

Abstract: A non-aqueous electrolyte secondary battery is disclosed in which hydrogen lithium titanate prepared by an acid process of lithium titanate and having pH of 11.2 or smaller or hydrogen lithium titanate expressed by general formula H.sub.x Li.sub.y-x Ti.sub.z O.sub.4 (where y.gtoreq.x>0, 0.8.ltoreq.y.ltoreq.2.7 and 1.3.ltoreq.z.ltoreq.2.2) is employed as an active material for an electrode. Hydrogen lithium titanate may be employed as an active material for a positive electrode or a negative electrode. Thus, a charging capacity greater than a theoretical capacity is realized. It is preferable that hydrogen lithium titanate is formed into a particle shape and includes voids in the particles. It is preferable that the largest particle size is 0.1 .mu.m to 50 .mu.m and the specific surface area is 0.01 m.sup.2 /g to 300 m.sup.2 /g.

Abstract: In a conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch, a conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken.

Abstract: A conductive connecting method for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken.

Abstract: A connecting structure for an electronic part employs an improved anisotropic electrically conductive layer. The layer includes a hot melt type insulative adhesive, heat resilient particles and carbon particles. Each of the heat resilient particles is made of thermoplastic resin and is plated with metal such as gold, nickel or the like. Each of the carbon particles is melted by a heat pressure and brings about an electric conductivity when it is dried and hardened. Thus, the anisotropically conductive layer disclosed in this invention does not include hard particles at all. Namely, an electronic part such as a solar battery cell or a semiconductor device is not damaged by particles of the conductive layer. In addition, the connecting structure employing the aforementioned layer improves the security of adherence and the reliability of the electric conductivity.

Abstract: A conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken.