Patents by Inventor Yoshinori Chiku

Yoshinori Chiku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Baked resin product and electronic device comprising the same
    Patent number: 8026335
    Abstract: The present invention provides a baked resin product that exhibits an excellent heat resistance and an electronic device that incorporates this baked resin product. The present invention provides a baked resin product obtained by baking a resin composition that contains a main chain-type aromatic benzoxazine structure, wherein the baked resin product has a peak measured by 13C-NMR at 58±2 ppm and a half width of this peak of 4 to 10 ppm. The present invention also provides a method of producing a baked resin product, comprising baking a resin composition that contains a main chain-type aromatic benzoxazine structure at 270° C. to 350° C. The present invention further provides an electronic device that incorporates this baked resin product.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: September 27, 2011
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Yoshinori Chiku, Yuji Eguchi, Kazuo Doyama
  • BAKED RESIN PRODUCT AND ELECTRONIC DEVICE COMPRISING SAME
    Publication number: 20090318658
    Abstract: The present invention provides a baked resin product that exhibits an excellent heat resistance and an electronic device that incorporates this baked resin product. The present invention provides a baked resin product obtained by baking a resin composition that contains a main chain-type aromatic benzoxazine structure, wherein the baked resin product has a peak measured by 13C-NMR at 58±2 ppm and a half width of this peak of 4 to 10 ppm. The present invention also provides a method of producing a baked resin product, comprising baking a resin composition that contains a main chain-type aromatic benzoxazine structure at 270° C. to 350° C. The present invention further provides an electronic device that incorporates this baked resin product.
    Type: Application
    Filed: May 1, 2007
    Publication date: December 24, 2009
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yoshinori Chiku, Yuji Eguchi, Kazuo Doyama