Abstract: A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.

Abstract: A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.

Abstract: A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad.

Abstract: A wiring board with lead pins having high reliability is provided. When the lead pins are attached to electrode pads, the lead pins are attached to the electrode pads without leaving voids in a conductive agent, and bonding strength of the lead pins are improved. When the wiring board to which the lead pins are attached is reheated, the lead pins are prevented from being inclined or shifted from their normal positions. In the wiring board with lead pins formed by attaching head portions of the lead pins to the electrode pads formed on the wiring board through the conductive agent, the lead pin has notch portions are formed in cut-out shapes in peripheral edge portion of the disk shaped head portion.

Abstract: A wiring board with lead pins having high reliability is provided. When the lead pins are attached to electrode pads, the lead pins are attached to the electrode pads without leaving voids in a conductive agent, and bonding strength of the lead pins are improved. When the wiring board to which the lead pins are attached is reheated, the lead pins are prevented from being inclined or shifted from their normal positions. In the wiring board with lead pins formed by attaching head portions of the lead pins to the electrode pads formed on the wiring board through the conductive agent, the lead pin has notch portions are formed in cut-out shapes in peripheral edge portion of the disk shaped head portion.