Abstract: A process for the preparation of a polyetherimide/epoxyimide resin composition comprising (a) mixing a polyetherimide and an epoxyimide in a mixing ratio, by weight, of polyetherimide to epoxyimide of from 6:1 to 1:1 in a polar solvent to form a mixed resin composition, said polyetherimide being represented by the following formula of: ##STR1## said epoxyimide being represented by the following general formula of: ##STR2## wherein n is an integer from from 0 to 10; and R.sub.2 is a bifunctional organic radical residue selected from the group consisting of diphenylmethane, diphenyl ether, diphenyl sulfone, m-phenylene, p-phenylene and 1,6-hexamethylene; (b) molding said mixed resin composition prepared in the preceding mixing step, followed by removal of said polar solvent from the molded mixture; and (c) heating molded composition at a temperature of 100.degree. C. to 300.degree. C. for 1 to 3 hours.

Abstract: The present invention provides a bis(hydroxyphthalimide) prepared by reacting 4-hydroxyphthalic anhydride and an organic diamine in the presence of an organic solvent under heating. The bis(hydroxyphthalimide) has two intramolecular imide rings and active hydrogens, and is thus polymerizable to form a variety of polycondensation products each having imide rings by condensation. The bis(hydroxyphthalimide) is also reacted with a dicarboxylic acid dihalide to form a polyesterimide, through condensation, which is excellent in transparency and heat resisting property.

Abstract: A polyetherimide/epoxyimide resin composition prepared by mixing a polyetherimide having a repeating unit represented, for example, by the formula of: ##STR1## with an epoxyimide represented by the following general formula of: ##STR2## wherein R is, for example, selected from the group consisting of diphenyl ether, diphenylmethane, diphenyl sulfone, m-phenylene, p-phenylene and 1,6-hexamehtylene;in a mixing ratio, by weight, of preferably from 6:1 to 1:1. The resin composition is mixed in a solvent to form a solution from which a film may be formed through a flow-coating method. The film made of the polyetherimde/epoxyimide resin composition of the invention, after being removed of the solvent followed by thermal treatment at a temperature of 150.degree. C. to 220.degree. C. for 1 to 3 hours, has improved thermal resistance, adaptability for adhesive, and low moisture permeability.

Abstract: The present invention provides a bis(hydroxyphthalimide) prepared by reacting 4-hydroxyphthalic anhydride and an organic diamine in the presence of an organic solvent under heating. The bis(hydroxyphthalimide) has two intramolecular imide rings and active hydrogens, and is thus polymerizable to form a variety of polycondensation products each having imide rings by condensation. The bis(hydroxyphthalimide) is also reacted with a dicarboxylic acid dihalide to form a polyesterimide, through condensation, which is excellent in transparency and heat resisting property.

Abstract: A thermal control coating composition comprising a binder made of a condensation polymerization product of Si--(OR).sub.4 added with titanium oxide acting as a white pigment, common mica particles for improving resistance to thermal cycling and cerium oxide particles for improving the resistance to UV irradiation. The thermal control coating composition has an initial solar absorptance (.alpha..sub.s) of not more than 0.3 and an initial thermal emittance (.epsilon.) of not less than 0.8. The coating composition exhibits excellent properties when subjected to an ageing test corresponding to the use thereof on a standstill orbit for 10 years. The weight of the paint may be reduced by the use of the coating composition of the invention such that an antenna (having a diameter of 3.5 m) of a large capacity communications satellite is coated with 3 kg of the coating composition of the invention to form a durable coating comparable to a coating formed by using 6 kg of a conventional thermal control paint.

Abstract: A flexible optical solar reflector (FOSR) which may be also used as an outermost layer of a multilayer thermal insulator comprising:a heat radiation layer of a resin selected from the group consisting of poly[(4'-phenoxy-4-carbonyl)diphenyl ether] represented by the following general formula of: ##STR1## and poly (ether imide) represented by the following general formula of: ##STR2## wherein R is a meta-substituted phenyl group, a para-substituted phenyl group or a 4,4'-substituted phenyl ether group; anda solar light reflecting layer disposed on said heat radiation layer and made of a thin coating of a metal selected from the group consisting of silver and aluminium, A CeO.sub.2 covering layer may be disposed over the heat radiation layer. The FOSR is excellent in resistance to ultraviolet rays, particularly in resistance to electron beam, and superior in optical and mechanical properties.