Abstract: A substrate processing apparatus includes a holder for holding a substrate horizontally, a rotator for rotating the holder, a liquid supplier for supplying liquid to the substrate, and a controller for controlling the holder, the rotator, and the liquid supplier. The holder includes a turntable configured to be rotated by the rotator, at least one first clamper configured to be rotated together with the turntable and moved between a clamping position and a releasing position, and at least one second clamper configured to be rotated with the turntable and moved between the clamping and releasing positions independently of the at least one first clamper. The controller controls the at least one first clamper and the at least one second clamper to alternately clamp the peripheral edge of the substrate while the holder is being rotated by the rotator and the liquid is being supplied to the substrate.

Abstract: An IC mounting/demounting system in which a centering tool 27 including a socket pusher 27c and a centering recess portion 27b constructed integrally with the tool is detachably attached to a head body 57. Also provided is a centering tool stocker for supporting a plurality of centering tools. This construction eliminates the need for the replacement of a mounting/demounting head with each change of the kind of IC, thus enhancing working efficiency.

Abstract: An IC mounting/demounting system wherein a plurality of holding sections are fixedly secured to an index plate rotatable by a servo motor. A plurality of IC's are successively mounted and demounted on a socket board or a tray, and the plurality of IC's are simultaneously held and transferred. This improves the efficiency of the IC transferring work between the socket board and the tray and shortens working time.

Abstract: An IC mounting/demounting system comprising a centering unit including first and second centering tools where socket pushers are constructed integrally with centering recess portions respectively. The centering unit is detachably fitted to a head body and replaceable with a centering unit corresponding to an IC having a different size. Accordingly, the replacement of the whole mounting/demounting head that normally accompanies the change in the kind of IC becomes unnecessary, thus enhancing work efficiency.