Abstract: A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.

Abstract: A joint device includes a regulation device, a heating device, and a transparent portion. The regulation device includes a support base that includes a placement surface, and a regulation member. The heating device applies heat for causing solid phase diffusion at a joint interface between the two metal members by radiating an electromagnetic beam to a beam irradiated region via the regulation member. The beam irradiated region is set on a surface of one of the two metal members that is farther from the placement surface while the regulation device regulates motion of the two metal members. The transparent portion is provided at least at a portion corresponding to the beam irradiated region of the metal member to which the electromagnetic beam is irradiated, to transmit the electromagnetic beam.

Abstract: Provided are a welding apparatus having a reduced size. A welding apparatus includes a support base having a placement surface, and a restriction member. A substrate with a semiconductor element disposed thereon is placed on the placement surface such that a surface electrode of the semiconductor element faces upward. A wiring member is placed on the surface electrode. The restriction member restricts movement of the surface electrode and the wiring member in the directions away from each other, by holding the substrate with the semiconductor element disposed thereon and the wiring member, between the placement surface and the restriction member. The welding apparatus further includes a laser device. The laser device locally heats a welding interface between the surface electrode and the wiring member by irradiating a laser beam onto the surface of the wiring member through a hole in the restriction member.

Abstract: A shaping method using an additively shaping device is a shaping method of additively shaping a shaped article by melting metal powder through irradiation of a shaping optical beam and then solidifying the melted metal powder. The shaping method includes: a first step of preparing, in an irradiation area on a baseplate, a first layer of the shaped article having on an upper surface of the first layer a trough portion that is formed in a recessed manner along a predetermined axis; a second step of feeding the metal powder to the trough portion; and a third step of, after the process of the second step, applying the shaping optical beam to the metal powder fed to the trough portion to melt the metal powder.

Abstract: To provide an additive manufacturing apparatus of a shaped article capable of suppressing evaporation of metal and scattering of spatters. An additive manufacturing apparatus of the shaped article includes a temporary heating device heating metal powder arranged in layers at a temperature equal to or lower than a fusing point of the metal powder to allow the metal powder to be diffusion bonded and a main heating device heating the metal powder at a temperature equal to or higher than the fusing point of the metal powder by irradiating the diffusion-bonded metal powder with a light beam to thereby form a shaped article. The temporary heating device heats a range wider than an irradiation range with the light beam by the main heating device.

Abstract: An additively shaped article manufacturing method includes: a first step of feeding a plurality of base material particles and a plurality of microparticles both constituting metal powder to an irradiation area of a shaping optical beam; and a second step of applying the shaping optical beam to the microparticles and respective irradiated surfaces that are respective surfaces of the base material particles on a side to be irradiated with the shaping optical beam. The microparticles are formed of a metal identical in type to the base material particles and have an average volume smaller than the average volume of the base material particles. The microparticles fed to the irradiation area at the first step are arranged to be in contact with the respective irradiated surfaces of the base material particles.

Abstract: A heating method includes an oxide film forming step and a heating step. The thickness of an oxide film is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the laser absorption having a periodic profile. The first maximal thickness corresponds to a first maximal value a of the laser absorption. The second maximal thickness corresponds to a second maximal value of the laser absorption. The second minimal thickness corresponds to a second minimal value of the laser absorption, namely the minimal value of the laser absorption that appears between the second maximal value and a third maximal value, or the maximal value of the laser absorption that appears subsequent to the second maximal value.

Abstract: A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.

Abstract: A heating method includes an oxide film forming step and a heating step. The thickness of an oxide film is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the laser absorption having a periodic profile. The first maximal thickness corresponds to a first maximal value a of the laser absorption. The second maximal thickness corresponds to a second maximal value of the laser absorption. The second minimal thickness corresponds to a second minimal value of the laser absorption, namely the minimal value of the laser absorption that appears between the second maximal value and a third maximal value, or the maximal value of the laser absorption that appears subsequent to the second maximal value.

Abstract: A safety valve includes a cylinder having an open end and a plug for closing the open end with a hermetic seal. The interior of the cylinder communicates with a high-pressure gas passage. The cylinder is deformed as a function of gas pressure in the high-pressure gas passage to widen the open end. This allows gas in the high-pressure gas passage to escape and thus prevents the gas pressure from increasing beyond an acceptable level.

Abstract: A valve device includes a wire channel through which wires are routed from the inside of a gas tank to the outside of the gas tank, and a hermetic connector in which a sealing member is provided around wire pins that constitute part of the wires is provided in the wire channel. In addition, the wire channel has multiple (two) bent portions formed on the outer side of the hermetic connector. When pulling force acts on the wires from the outside, stress concentration portions are formed in the wires at these bent portions.

Abstract: A valve device includes a wire channel through which wires are routed from the inside of a gas tank to the outside of the gas tank, and a hermetic connector in which a sealing member is provided around wire pins that constitute part of the wires is provided in the wire channel. In addition, the wire channel has multiple (two) bent portions formed on the outer side of the hermetic connector. When pulling force acts on the wires from the outside, stress concentration portions are formed in the wires at these bent portions.

Abstract: A safety valve includes a cylinder having an open end and a plug for closing the open end with a hermetic seal. The interior of the cylinder communicates with a high-pressure gas passage. The cylinder is deformed as a function of gas pressure in the high-pressure gas passage to widen the open end. This allows gas in the high-pressure gas passage to escape and thus prevents the gas pressure from increasing beyond an acceptable level.

Abstract: A method for removing nitrogen oxides and organic chlorine compounds from a combustion waste gas, which comprises the steps of: adding ammonia (NH.sub.3) as a reducing agent to a combustion waste gas containing nitrogen oxides and organic chlorine compounds; causing the combustion waste gas added with ammonia to contact with, while keeping the temperature of the combustion waste gas within a prescribed range, with a catalyst comprising at least one selected from the group consisting of platinum (Pt), palladium (Pd), ruthenium (Ru), manganese (Mn), copper (Cu), chromium (Cr) and iron (Fe) and oxides thereof, supported on the surface of a carrier comprising at least one selected from the group consisting of titanium oxide (TiO.sub.2), silicon oxide (SiO.sub.2), aluminum oxide (Al.sub.2 O.sub.3) and zirconium oxide (ZrO.sub.2), thereby removing nitrogen oxides and organic chlorine compounds from the combustion waste gas.

Abstract: A method for removing detrimental organic chlorine compounds such as polychlorinated dibenzo-p-dioxins and polychlorinated dibenzofurans from a combustion waste gas, which comprises the steps of: bringing organic chlorine compounds contained in a combustion waste gas at a temperature within a range of from 150.degree. to 350.degree. C. into contact with a catalyst comprising at least one selected from the group consisting of platinum, palladium, ruthenium, manganese, copper, chromium and iron and oxides thereof, which catalyst is supported on the surface of a carrier containing at least titanium oxide, Aluminum oxide and silicon oxide, to cause a decomposition reaction of the organic chlorine compounds, thereby removing organic chlorine compounds from the combustion waste gas at a high efficiency.

Abstract: A catalyst composition including component A and component B, the component A being a carrier, preferably having a honeycomb structure, and being a single-component oxide or a multi-component composite oxide of at least one metal of titanium, silicon and zirconium, and the component B being a catalyst component deposited on the carrier of component A and being at least one member selected from the group of noble metals and other specifically limited metals and their oxides, is very effective for decomposing and removing poisonous organic chlorine compounds, such as dioxin and the like, or poisonous organic chlorine compound-forming substances contained in an exhaust gas exhausted from an incinerator of an incineration plant provided with the incinerator and a dust collector. In addition, and the generation of the poisonous organic chlorine compound from the incineration plant can be prevented.

Abstract: An excellent method of decomposing flon is provided which can decompose flon economically with high decomposition efficiency without necessitating high temperature and high pressure by contacting a gas containing a flon with a catalyst at a condition of a temperature of not less than 200.degree. C. and space velocity of not over than 50,000 (hr.sup.-1).