Abstract: There is provided a method for forming a continuous thin film circuit pattern with good precision, at low cost and with low environmental burden; an electronic circuit fabricated by the same, and an electronic device including the same. There are a step for forming a mask layer 2 on a substrate 1; a step for forming an opening pattern in the mask layer 2; a step for forming a thin film 3 on the substrate 1 and on the mask layer 2; and a step for removing, from the substrate 1, the mask layer 2 and a portion of the thin film 3 formed on the mask layer 2; wherein the opening pattern is formed under a dry condition.

Abstract: To provide a method for forming electrodes and/or black stripes for a plasma display substrate, wherein display electrodes, bus electrodes and optionally black stripes for a plasma display panel are formed of the same material by the same dry step, whereby a clear image having reflection prevented, can be displayed on a PDP display device with a low load on the environment, at low costs, with low resistance, without erosion by a dielectric. A method for forming electrodes and/or black stripes for a plasma display substrate, which comprises applying a laser beam to a mask layer formed on a transparent substrate to form openings at areas corresponding to the respective patterns of display electrodes, bus electrodes and optionally black stripes, then continuously forming an antireflection layer to provide an antireflection effect over the entire surface and an electrode layer, and applying again a laser beam to peel off the mask layer and at the same time to remove an unnecessary thin film layer.

Abstract: To provide a method for forming electrodes and/or black stripes for a plasma display substrate, wherein display electrodes, bus electrodes and optionally black stripes for a plasma display panel are formed of the same material by the same dry step, whereby a clear image having reflection prevented, can be displayed on a PDP display device with a low load on the environment, at low costs, with low resistance, without erosion by a dielectric. A method for forming electrodes and/or black stripes for a plasma display substrate, which comprises applying a laser beam to a mask layer formed on a transparent substrate to form openings at areas corresponding to the respective patterns of display electrodes, bus electrodes and optionally black stripes, then continuously forming an antireflection layer to provide an antireflection effect over the entire surface and an electrode layer, and applying again a laser beam to peel off the mask layer and at the same time to remove an unnecessary thin film layer.

Abstract: There is provided a method for forming a continuous thin film circuit pattern with good precision, at low cost and with low environmental burden; an electronic circuit fabricated by the same, and an electronic device including the same. There are a step for forming a mask layer 2 on a substrate 1; a step for forming an opening pattern in the mask layer 2; a step for forming a thin film 3 on the substrate 1 and on the mask layer 2; and a step for removing, from the substrate 1, the mask layer 2 and a portion of the thin film 3 formed on the mask layer 2; wherein the opening pattern is formed under a dry condition.

Abstract: A method of soldering a component on a printed circuit board which has the steps of sucking the components supplied in an irregularly aligned disposition by a feeding sucking nozzle tube, then holding the components by a pair of holding arms of a soldering iron from right and left sides to always direct the component in a predetermined direction, placing the components at predetermined positions on a printed circuit board as in this state, melting the preliminary solder placed in advance on the board, air-cooling to solidify the solder to solder a number of components with a short time by always obtaining the desired designating direction so as not to displace the positions and to locally heat the chip components. Thus, this method can delete thermal adverse influence to the component and obviate an unintentional drop of chip components during the step of feeding the components.