Patents by Inventor Yoshinori Kamikawa
Yoshinori Kamikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240101532Abstract: A compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy is provided. The present inventors have conducted studies on a compound useful as an active ingredient of a pharmaceutical composition for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy, and confirmed that a heteroaryl carboxamide compound has DGK ? (DGKzeta) inhibitory effect, leading to completion of the present invention. The heteroaryl carboxamide compound of the present invention has DGK ? inhibitory effect, and can be used as a therapeutic agent for treatment of cancer related to activation of immune cells or cancer resistant to anti-PD-1 antibody/anti-PD-L1 antibody therapy.Type: ApplicationFiled: November 28, 2023Publication date: March 28, 2024Inventors: Hideyuki Watanabe, Takashi Kamikubo, Akio Kamikawa, Takuya Washio, Yohei Seki, Keiichiro Okuyama, Osamu Ikeda, Hiroshi Tomiyama, Yoshinori Iwai, Akihiko Nakamura, Kozo Miyasaka
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Patent number: 6791835Abstract: A rectangular heating section is so shaped as to touch the electronic component except corners of the rectangle when the surface of the electronic component does not parallel the heating section. For example, the heating section is formed to be smaller than the electronic component surface, to be a rectangle which is smaller than the electronic component surface and comprises rounded corners, to be an octagon which is smaller than the electronic component surface and is formed by cutting off corners of the rectangle, or to be an octagon which is larger than the electronic component surface and is formed by cutting off corners of the rectangle. A die is prevented from being damaged due to a contact with the heating section of a cooling module at a given point of the die according to a mounting error or a usage state.Type: GrantFiled: March 18, 2003Date of Patent: September 14, 2004Assignee: Kabushiki Kaisha ToshibaInventors: Eiji Hashimoto, Yoshinori Kamikawa, Tornomi Murayama
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Publication number: 20040027800Abstract: An electronic apparatus includes a housing, a heat-receiving portion thermally connected to a heat-generating component, a heat-radiating portion for radiating heat generated by the component, a pump for supplying liquid coolant to the heat-radiating portion, and a holding member secured to fixing portions and holding the pump in the housing. The pump has a plurality of peripheral walls. A plurality of fixing areas are provided outside the pump, each being located between two corners defined by an adjacent three of the peripheral walls. The fixing portions are aligned with the fixing areas.Type: ApplicationFiled: April 10, 2003Publication date: February 12, 2004Applicant: Kabushiki Kaisha ToshibaInventors: Mitsuyoshi Tanimoto, Yoshinori Kamikawa, Fumihiko Koizumi, Teruo Kinoshita
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Publication number: 20040001316Abstract: An electronic apparatus has a housing, a heat generating component arranged in the housing, a heat pipe including a flat heat receiving surface integrally formed at one end, a deformable thermal conductive material, and a heat radiation member. The deformable thermal conductive material is arranged between the flat heat receiving surface and the heat generating component, and thermally connects the flat heat receiving surface and the heat generating component. The heat radiation member is thermally connected to the other end of the heat pipe.Type: ApplicationFiled: February 14, 2003Publication date: January 1, 2004Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Yoshinori Kamikawa, Satoshi Ooka
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Publication number: 20030198017Abstract: A rectangular heating section is so shaped as to touch the electronic component except corners of the rectangle when the surface of the electronic component does not parallel the heating section. For example, the heating section is formed to be smaller than the electronic component surface, to be a rectangle which is smaller than the electronic component surface and comprises rounded corners, to be an octagon which is smaller than the electronic component surface and is formed by cutting off corners of the rectangle, or to be an octagon which is larger than the electronic component surface and is formed by cutting off corners of the rectangle. A die is prevented from being damaged due to a contact with the heating section of a cooling module at a given point of the die according to a mounting error or a usage state.Type: ApplicationFiled: March 18, 2003Publication date: October 23, 2003Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Eiji Hashimoto, Yoshinori Kamikawa, Tomomi Murayama
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Patent number: 6144368Abstract: A portable information-processing apparatus comprising a housing having a first wall and a second wall opposing the first wall. A first manual operating member is provided on the first wall and exposed. A second manual operating member is provided on the second wall, is exposed, and facing away from the first manual operating member. In the housing there is provided a reinforcing plate for receiving the pressure which is generated when the first manual operating member is operated. The reinforcing member is located between the first and second operating members and supported by the first wall. The first and second manual operating members are supported by the first wall. The reinforcing plate is placed apart from the second manual operating member, forming a gap. The second wall has a projection which abuts on the reinforcing plate.Type: GrantFiled: September 2, 1997Date of Patent: November 7, 2000Assignee: Kabushiki Kaisha ToshibaInventors: Satoshi Ooka, Yoshinori Kamikawa, Tomomi Murayama
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Patent number: 6121554Abstract: Connecting pads in pad rows in a signal layer are connected to another signal layer through a plurality of through hole rows each including a plurality of plated through holes that extend through a power source layer. Each of the through hole rows includes a plurality of through holes arranged side by side between each two adjacent pad rows corresponding thereto. These plated through holes each face the space between each two adjacent connecting pads in each corresponding pad row, and are arranged at intervals about twice as long as the intervals between the connecting pads. Each two adjacent through hole rows are located with an offset not smaller than the diameter of each pad in the longitudinal direction of the rows, and the power source layer includes a plurality of clear regions that are cleared of a conductor and penetrated individually by the through holes.Type: GrantFiled: November 28, 1997Date of Patent: September 19, 2000Assignee: Kabushiki Kaisha ToshibaInventor: Yoshinori Kamikawa
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Patent number: 5923530Abstract: A circuit module comprising a circuit board, a function component, and a heat sink. The circuit board has a number of circuit components and a circuit element which generates heat while operating. The function component is secured to the circuit board by screws. The heat sink is connected to the circuit board by the screws, for radiating heat generated by the circuit element.Type: GrantFiled: September 12, 1997Date of Patent: July 13, 1999Assignee: Kabushiki Kaisha ToshibaInventors: Tomomi Murayama, Satoshi Ooka, Yoshinori Kamikawa
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Patent number: 5796579Abstract: A portable computer has a base unit with a first expansion connector mounted on a rear wall. The expansion connector is covered by a connector unit. The connector unit includes pivotally mounted upper and lower covers having laterally extending guide portions. The upper and lower covers have a closed position which covers the connector. An external expansion unit has a second expansion connector mounted on a connector mounting surface. A cover opening member projects from the connector mounting surface. When the expansion unit is connected to the portable computer the cover opening member pushes the upper and lower to covers to an open position which uncovers the first expansion connector.Type: GrantFiled: February 7, 1997Date of Patent: August 18, 1998Assignee: Kabushiki Kaisha ToshibaInventors: Yuji Nakajima, Masaru Seto, Yoshinori Kamikawa