Abstract: A substrate conveyance mechanism that includes conveyance units and a working area length change part to easily change the types of substrates to allow substrates of different lengths to be selected to mount electronic components onto the substrate. The conveyance units include a working area for substrates having different length that are conveyed from a stand-by area, an area length of the working area that is variable in accordance with the length of the substrate, and a stand-by unit corresponding to a stand-by area for the substrate to be carried in to the working area. The working area length change part changes an interval between a commonly used first pulley and one of a plurality of second pulleys selectively used in accordance with the area length of the working area by changing a belt winding path of a conveyance belt wound on the pulleys in the working unit.

Abstract: A substrate conveyance mechanism includes conveyance units and a clamp mechanism. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The clamp members include commonly used first clamp members and second clamp members which are attachable and detachable and are selectively used in accordance with the sizes of length of the plurality of types of substrates in addition to the first clamp members.

Abstract: A substrate conveyance mechanism includes conveyance units and a working area length change part. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The working area length change part changes an interval between a commonly used first pulley and one of second pulleys selectively used in accordance with the area length of the working area by changing a belt winding form of a conveyance belt wound on the pulleys in the working unit.

Abstract: A substrate conveyance mechanism includes conveyance units and a clamp mechanism. The conveyance units include a working unit corresponding to a working area for types of substrates having different sizes of length taken as objects, an area length of the working area being variable in accordance with the sizes of length, and a stand-by unit corresponding to a stand-by area for the substrate to be carried-in to the working area. The clamp members include commonly used first clamp members and second clamp members which are attachable and detachable and are selectively used in accordance with the sizes of length of the plurality of types of substrates in addition to the first clamp members.

Abstract: To improve characteristics of a semiconductor device. An element isolation region is etched by using a photoresist film as a mask, and thereby a p-type well that is a layer under the element isolation region is exposed. Thereafter, deposit over a surface of the photoresist film is etched. Then, a source region is formed by implanting impurity ions into the exposed p-type well by using the photoresist film as a mask, and thereafter, the photoresist film is removed. Thereby, it is possible to prevent a hardened layer from being formed due to injection of impurity ions into the deposit over the surface of the photoresist film. As a result, it is possible to suppress a popping phenomenon when the photoresist film is removed, so that it is possible to prevent a pattern of a gate and the like from being broken.