Patents by Inventor Yoshinori Niwa

Yoshinori Niwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device
    Patent number: 7646089
    Abstract: A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: January 12, 2010
    Assignee: Fujitsu Limited
    Inventors: Futoshi Fukaya, Yuichi Asano, Yoshinori Niwa
  • SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE, AN ELECTRONIC DEVICE, METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
    Publication number: 20090283897
    Abstract: A semiconductor package including a substrate with a semiconductor device mounted on the substrate and a resin member sealing the substrate and semiconductor device. The resin member includes a first surface and a second surface located on the other side of the first surface and a plurality of leads electrically connected with the semiconductor device. The leads project from the resin member and extend to the second surface side; wherein the second surface of the resin member includes a first area having a first concave portion and a second area having a second concave portion which is different from the first area, and the second concave portion is deeper than the first concave portion.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 19, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Futoshi FUKAYA, Yuichi ASANO, Yoshinori NIWA