Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a container configured to contain a substrate, and a pipe configured to supply the container with liquid to treat the substrate. The apparatus further includes an ejector including a first passage where the liquid introduced from the pipe and the liquid introduced from the container are joined and pass through, and a first opening configured to eject the liquid that has passed through the first passage. Furthermore, the first passage has an area where a sectional area of the first passage becomes large as advancing downstream in the liquid.

Abstract: A power control device includes a mode setter configured to effect a change from a normal mode to a low-power mode upon detecting a light load in a burst operation, and a minimum on-period setter configured to, in response to a change to the low-power mode, change the minimum on-period of the switching transistor from a first minimum on-period to a second minimum on-period longer than the first minimum on-period.

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a naphthylene ether type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: According to one embodiment, a disk device includes a recording medium of a disk form, a magnetic head, a housing, and a first protective member made of a resin. The recording medium includes a recording layer. The magnetic head is configured to read/write information from/to the recording medium. The housing includes a base provided with an inner chamber in which the recording medium and the magnetic head are accommodated, a cover that covers the inner chamber, and a welded part at which the base and the cover are welded to each other. The first protective member is located outside the housing, to cover at least part of the welded part.

Abstract: A method for producing a polyarylene sulfide comprising: initiating a polymerization reaction by heating a mixture containing an organic polar solvent, a sulfur source, water, a polyhaloaromatic compound, and an alkali metal hydroxide in the presence of at least one auxiliary agent selected from the group consisting of carboxylates and the like, to form a reaction mixture containing a prepolymer having a conversion rate of a polyhaloaromatic compound of 50 mol % or greater, then a phase separation agent addition step of adding a phase separation agent into the reaction mixture, then continuing the polymerization reaction, and then cooling the reaction mixture, in the cooling step, the coolant being added to the reaction mixture at a temperature that is at least 5° C. higher than a maximum thickening temperature and lower than 250° C., and a cooling rate at the maximum thickening temperature being 2.2° C./min or higher and 3.9° C./min or lower.

Abstract: The present invention provides a laminated sheet for manufacturing a packaging container. The laminated sheet comprises a pair of plastic sheets, a barrier sheet, a barrier region, an easily peelable region, and a fixing region. The barrier sheet has flexibility and is disposed between the pair of plastic sheets. The barrier region is formed by overlapping the pair of plastic sheets and the barrier sheet with each other. The easily peelable region is provided in the barrier region. The fixing region is located in a circumference of the easily peelable region, in which the pair of plastic sheets are fixed to each other directly and/or via the barrier sheet. A peel strength between the pair of plastic sheets and the barrier sheet in the easily peelable region is smaller than a direct peel strength between the pair of plastic sheets and/or a peel strength between the pair of plastic sheets via the barrier sheet in the fixing region.

Abstract: A blow molding machine is subjected to a sterilizing treatment in a simple manner. A liquid sterilizer is filled into preforms of at least the same number as the number of spindles. In a heating unit that heats the preforms to a molding temperature, some of the liquid sterilizer is caused to diffuse, and blow air is blasted into preforms in which the liquid sterilizer remains to cause the liquid sterilizer to diffuse in a molding unit, and molded bottles are discharged.

Abstract: The invention provides a curable resin composition containing (A) a multifunctional benzoxazine compound having at least two benzoxazine rings, the compound being at least one multifunctional benzoxazine compound selected from a multifunctional benzoxazine compound having a structural unit of formula (1) and a multifunctional benzoxazine compound represented by a structure of formula (2), (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, and (D) a curing accelerator which is a bisphenol salt of a diazabicycloalkene. The invention also provides a cured product of the curable resin composition and methods of producing the curable resin composition and the cured product, as well as a semiconductor device using the cured product as a sealant.

Abstract: Disclosed is a wettable agrochemical composition comprising an agrochemical active component (A), which is a compound represented by the following formula (I) or an agriculturally and horticulturally acceptable acid addition salt thereof, one or more additives, and one or more surfactants, the wettable agrochemical composition being solid at 30° C. This wettable agrochemical composition has excellent physical properties of the formulation and storage stability.

Abstract: A blow molding machine is subjected to a sterilizing treatment in a simple manner. A liquid sterilizer is filled into preforms of at least the same number as the number of spindles. In a heating unit that heats the preforms to a molding temperature, some of the liquid sterilizer is caused to diffuse, and blow air is blasted into preforms in which the liquid sterilizer remains to cause the liquid sterilizer to diffuse in a molding unit, and molded bottles are discharged.

Abstract: This power supply IC is a semiconductor integrated circuit device serving as a main part for controlling a switching power supply and is formed by integrating a feedback resistor and an output feedback control unit on a single semiconductor substrate, said feedback resistor generating a feedback voltage by dividing the output voltage of the switching power supply (or the induced voltage appearing across an auxiliary winding provided on the primary side of a transformer included in an insulation-type switching power supply), said output feedback control unit performing output feedback control of the switching power supply in accordance with the feedback voltage. The feedback resistor is a polysilicon resistor having a withstand voltage of 100 V or more. A high-voltage region having higher withstand voltage in the substrate thickness direction than the other region is formed in the semiconductor substrate, and the feedback resistor is formed on the high-voltage region.

Abstract: An imaging device, including a photoelectric converter that generates a signal charge by photoelectric conversion of light; and a semiconductor substrate. The semiconductor substrate includes: a charge accumulation region that is an impurity region of a first conductivity type, and configured to accumulate the signal charge; a first impurity region of the first conductivity type, the first impurity region being one of a source or a drain of a first transistor and adjacent to the charge accumulation region; and a blocking structure located between the charge accumulation region and the first impurity region. The blocking structure includes a second impurity region of a second conductivity type different from the first conductivity type, a part of the second impurity region located on a surface of the semiconductor substrate, and the second impurity region is not in contact with the first impurity region on the surface of the semiconductor substrate.

Abstract: There is provided a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet having openings on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween; contacting or infiltrating the soluble adhesive layer with a liquid capable of dissolving the soluble adhesive layer through the openings to thereby dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the position of the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced so as to generate no large local warpage, thereby improving the reliable connection in the multilayer wiring layer and the flatness (coplanarity) on the surface of the multilayer wiring layer. The reinforcing sheet having finished its role can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.

Abstract: There is a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween, wherein an unoccupied region without the soluble adhesive layer is provided within a facing area where the reinforcing sheet faces the multilayer laminate; allowing a liquid capable of dissolving the soluble adhesive layer to infiltrate the unoccupied region to dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced to generate no large local warpage, thereby improving the reliable connection and the surface flatness (coplanarity) of the multilayer wiring layer. The used reinforcing sheet can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.

Abstract: An organic hydride production apparatus includes: an electrolyte membrane having proton conductivity; a cathode that includes a cathode catalyst layer used to hydrogenate a hydrogenation target substance using protons to produce an organic hydride and also includes a cathode chamber; an anode that includes an anode catalyst layer used to oxidize water to produce protons and also includes an anode chamber; and a gas introduction unit that introduces, into the anolyte at a certain position, a certain gas used to remove at least one of the hydrogenation target substance and the organic hydride that have passed through the electrolyte membrane and been mixed into the anolyte.

Abstract: A method for producing a fluoropolymer of the invention which includes polymerizing a fluoromonomer in an aqueous medium in the presence of a surfactant to provide a fluoropolymer. The surfactant includes at least one selected from the group consisting of a surfactant represented by R1a—CO—R2a—CO—R3a-Aa and a surfactant represented by R1b—CO—(CR2b2)n—(OR3b)p—(CR4b2)q-L-Ab.

Abstract: Even when the filling speed increases, the surface temperature of a molded bottle falls within a constant range, and a sterilizer adequately sterilizes the bottle. A preform is heated, the heated preform is sealed in a mold, the preform sealed in the mold is blow-molded into a bottle, the surface temperatures of a neck portion, a body portion, and a bottom portion of the molded bottle are measured, and the mold temperatures of a neck portion, a body portion, and a bottom portion of the mold is so adjusted that the measured surface temperature of the bottle falls within a specified temperature range.

Abstract: This power supply IC is a semiconductor integrated circuit device serving as a main part for controlling a switching power supply and is formed by integrating a feedback resistor and an output feedback control unit on a single semiconductor substrate, said feedback resistor generating a feedback voltage by dividing the output voltage of the switching power supply (or the induced voltage appearing across an auxiliary winding provided on the primary side of a transformer included in an insulation-type switching power supply), said output feedback control unit performing output feedback control of the switching power supply in accordance with the feedback voltage. The feedback resistor is a polysilicon resistor having a withstand voltage of 100 V or more. A high-voltage region having higher withstand voltage in the substrate thickness direction than the other region is formed in the semiconductor substrate, and the feedback resistor is formed on the high-voltage region.

Abstract: A non-isolated buck converter generates an output voltage by stepping down an input voltage obtained by subjecting an alternating-current voltage to full-wave rectification and smoothing, by using a step-down circuit including a switching element, an inductor, and a freewheeling diode. The switching element is disposed between a first terminal and a second terminal. A semiconductor device in charge of switching control operates with a potential at the second terminal as a reference. A control circuit provided in the semiconductor device includes a protecting circuit capable of referring to an evaluation voltage corresponding to a voltage between the first terminal and the second terminal at a sampling timing at which a predetermined period of time has passed from turning off of the switching element, and performing a protecting operation that fixes the switching element to an off state on the basis of the evaluation voltage.