Abstract: The epoxy resin composition of the present invention is characterized in that a polyamide compound having a moiety derived from a hydroxyl substituted aromatic amine having a phenolic hydroxyl group adjacent to an amino group is used as an epoxy resin hardener.

Abstract: A composite material obtained by laminating (A) a layer formed from an epoxy resin curing composition and (B) a layer of a polyimide to each other. The composite material is preferably obtained by applying the epoxy resin curing composition to at least one side of a polyimide film or sheet. The epoxy resin curing composition includes a curing agent containing a polyamide compound having a repeat unit comprising a phenolic hydroxyl group containing structure represented by the following formula (I) or (II): In formula (I), ring A and R each represent a phenylene group or a naphthylene group, each of which may be substituted with a halogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms. In formula (II), ring B is an arylene group having 6 to 18 carbon atoms or an alkylidenediarylene group having 13 to 25 carbon atoms, each of which may be substituted with a halogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms.

Abstract: An epoxy resin curable composition for a prepreg, comprising the following components (A) to (E): (A) a polyamide compound having a structure derived from an aromatic diamine including a phenolic hydroxyl group, the aromatic diamine having the phenolic hydroxyl group in a position adjacent to an amino group; (B) an epoxy resin; (C) an epoxy resin curing agent; (D) a filler; and (E) a solvent.

Abstract: The epoxy resin composition of the present invention is characterized in that a polyamide compound having a moiety derived from a hydroxyl substituted aromatic amine having a phenolic hydroxyl group adjacent to an amino group is used as an epoxy resin hardener.

Abstract: A composite material obtained by laminating (A) a layer formed of an epoxy resin curing composition including a polyamide compound having a structure containing a phenolic hydroxyl group represented by the following formula (I) or (II) in its repeating unit and (B) a layer of a polyimide to each other. The composite material is preferably obtained by applying the epoxy resin curing composition to at least one side of a polyimide film or sheet. In formula (I), ring A and R each represent an arylene group having 6 to 18 carbon atoms, an alkylidenediarylene group having 13 to 25 carbon atoms, etc. In formula (II), ring B is an arylene group having 6 to 18 carbon atoms or an alkylidenediaryl group having 13 to 25 carbon atoms.

Abstract: An epoxy resin curable composition for a prepreg, comprising the following components (A) to (E): (A): a polyamide compound having a structure derived from an aromatic diamine including a phenolic hydroxyl group, the aromatic diamine having the phenolic hydroxyl group in a position adjacent to an amino group; (B): an epoxy resin; (C): an epoxy resin curing agent; (D): a filler; and (E): a solvent.

Abstract: An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 ?m or less. The epoxy resin composition contains a large amount of the aluminum borate whisker being dispersed uniformly therein, is excellent in mechanical strength, and is suppressed with respect to the anisotropy of a mechanical property due to the direction of application.

Abstract: An epoxy resin composition is disclosed which contains (A) 1-10 weight % of a polyvalent epoxy compound, (B) 1-10 weight % of a curing agent selected among cyanate compounds and benzoxazine compounds, (C) 0.1-5 weight % of a polyvalent phenolic compound and (D) 80-97.9 weight % of a spherical filler having an elastic modulus of 300 GPa or more. The epoxy resin composition has a void fraction of 3% or less and a high elastic modulus.

Abstract: An epoxy resin composition which comprises 100 parts by weight of an epoxy resin and 1 to 800 parts by weight of an aluminum borate whisker having an average fiber diameter of 0.25 ?m or less. The epoxy resin composition contains a large amount of the aluminum borate whisker being dispersed uniformly therein, is excellent in mechanical strength, and is suppressed with respect to the anisotropy of a mechanical property due to the direction of application.