Patents by Inventor Yoshinori Takasaki

Yoshinori Takasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8756803
    Abstract: A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: June 24, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Toru Nakai, Tetsuo Amano, Yoshinori Takasaki
  • Patent number: 8581104
    Abstract: A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: November 12, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Toru Nakai, Tetsuo Amano, Yoshinori Takasaki
  • Patent number: 8411576
    Abstract: A route monitor control system includes a plurality of OAM cell handlers (OCHs); a plurality of virtual path handlers (VPHs); a plurality of virtual channel handlers (VCHs); trunks; and a control unit. The control unit issues an OAM (operation and maintenance) cell send instruction to a specific one of the plurality of OAM cell handlers, and carries out a loop back control to at least one of the virtual path handler, the virtual channel handler, and the trunk, which are associated with the specific OAM cell handler, as an object unit in response to the OAM cell send instruction. Also, when the specific OAM cell handler sends out an OAM cell from the specific OAM cell handler to the object unit in response to the OAM cell send instruction, the control unit determines a fault position based on returning or non-returning of the OAM cell from the object unit to the specific OAM cell handler.
    Type: Grant
    Filed: August 20, 2001
    Date of Patent: April 2, 2013
    Assignee: Juniper Networks, Inc.
    Inventor: Yoshinori Takasaki
  • Publication number: 20130070585
    Abstract: A system includes a cell handler, a virtual path handler, a virtual channel handler, a trunk. and a controller. The controller initiates, based on issuing an instruction to the cell handler, a loop-back control test. The loop-back control test involving transmission of an operation and maintenance (OAM) cell from the cell handler, via the virtual path handler, the virtual channel handler, and the trunk, and back to the cell handler. The controller further monitors the OAM cell, detects a fault based on monitoring the OAM cell; and perform fault avoidance based on detecting the fault.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 21, 2013
    Applicant: JUNIPER NETWORKS INC.
    Inventor: Yoshinori TAKASAKI
  • Publication number: 20120067632
    Abstract: A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.
    Type: Application
    Filed: July 1, 2011
    Publication date: March 22, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Toru Nakai, Tetsuo Amano, Yoshinori Takasaki
  • Publication number: 20110300307
    Abstract: A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %.
    Type: Application
    Filed: June 1, 2011
    Publication date: December 8, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Toru NAKAI, Tetsuo Amano, Atsushi Kamano, Yoshinori Takasaki
  • Publication number: 20110240358
    Abstract: A wiring board includes an insulation layer containing a resin and a silica-type filler and having a roughened surface, and a conductive layer formed on the roughened surface of the insulation layer and having a first conductive portion and a second conductive portion positioned adjacent to the first conductive portion. The roughened surface of the insulation layer has a roughness under the first conductive portion, a roughness under the second conductive portion, and a roughness between the first conductive portion and the second conductive portion, and the roughness between the first conductive portion and the second conductive portion is set less than at least one of the roughness under the first conductive portion and the roughness under the second conductive portion.
    Type: Application
    Filed: December 30, 2010
    Publication date: October 6, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Toru NAKAI, Tetsuo AMANO, Yoshinori TAKASAKI
  • Publication number: 20020021660
    Abstract: A route monitor control system includes a plurality of OAM cell handlers (OCHs); a plurality of virtual path handlers (VPHs); a plurality of virtual channel handlers (VCHs); trunks; and a control unit. The control unit issues an OAM (operation and maintenance) cell send instruction to a specific one of the plurality of OAM cell handlers, and carries out a loop back control to at least one of the virtual path handler, the virtual channel handler, and the trunk, which are associated with the specific OAM cell handler, as an object unit in response to the OAM cell send instruction. Also, when the specific OAM cell handler sends out an OAM cell from the specific OAM cell handler to the object unit in response to the OAM cell send instruction, the control unit determines a fault position based on returning or non-returning of the OAM cell from the object unit to the specific OAM cell handler.
    Type: Application
    Filed: August 20, 2001
    Publication date: February 21, 2002
    Applicant: NEC Corporation
    Inventor: Yoshinori Takasaki