Abstract: A camera module (1) has an internal space (28) that abuts a wiring substrate (21) and is occluded, at least a part of a base material of the wiring substrate (21) is a porous portion (41) that is configured of porous ceramic, porous metal, organic fabric, or inorganic fabric and has interconnected air holes, and the internal space (28) is connected to the outside of the camera module (1) through the interconnected air holes.

Abstract: A camera module (1) has an internal space (28) that abuts a wiring substrate (21) and is occluded, at least a part of a base material of the wiring substrate (21) is a porous portion (41) that is configured of porous ceramic, porous metal, organic fabric, or inorganic fabric and has interconnected air holes, and the internal space (28) is connected to the outside of the camera module (1) through the interconnected air holes.

Abstract: A camera apparatus (100) includes: a first housing (1) including a lens section (10); a second housing (2) including an image pickup section (20); and a connecting section (3) which connects the first and second housings (1) and (2). During image pickup, a focal length is specified by a contact between a bottom surface of a lens holder (12) which is exposed in the first housing (1) and a top surface of a transparent cover section (25) which is exposed in the second housing (2). This allows a realization of a camera apparatus in which a focal length is specified with high accuracy.

Abstract: A camera apparatus (100) includes: a first housing (1) including a lens section (10); a second housing (2) including an image pickup section (20); and a connecting section (3) which connects the first and second housings (1) and (2). During image pickup, a focal length is specified by a contact between a bottom surface of a lens holder (12) which is exposed in the first housing (1) and a top surface of a transparent cover section (25) which is exposed in the second housing (2). This allows a realization of a camera apparatus in which a focal length is specified with high accuracy.

Abstract: An optical structure is disposed on a surface of a device substrate, and a lens system for introducing external light into a solid-state image pickup device is placed in the center of the optical structure. The outer shape of the optical structure seen from the light incident side of the lens system is rectangular, and its plane shape forms a rectangular frame section. An intermediate structure is disposed between the device substrate and the optical structure. The intermediate structure has a fitting section for fitting the optical structure in a part of side faces of the frame section.

Abstract: In accordance with the present invention of the solid-state image pickup device 100, a holder 31 is mounted along outer edge portion of the board 1 in such a manner that the holder 31 is mounted on a board 1 and on chip components 7 that are arranged on the outer edge portion of the board 1. The downsized solid-state image pickup device 100 can be attained hereby.

Abstract: In a module for an optical device as a semiconductor device module of the present invention, a bonding wire that electrically connects a substrate on which a conductor wiring is formed and an image pickup element as a semiconductor element is covered with a cover, and a holder as a lid is placed over the cover.

Abstract: In a camera device of the present invention, a camera module 2 is mounted on a substrate 1 provided in the camera device by use of contact pins 3 for connecting first terminals provided on a backside of the camera module 2 to second terminals provided on the substrate 1. The contact pins 3 have first and second ends, and the first ends are soldered to ones of the first and second terminals and the second ends have contact with the other ones of the first and second terminals, respectively, so that the camera module 2 is electrically connected to the substrate 1, and the contact pins 3 are provided independently. This decreases restrictions on mounting the camera module 2 on the substrate 1, and also makes it possible to provide a camera device, in which the camera module 2 can be easily mounted on the substrate 1.

Abstract: An image capturing device module is disclosed. The image capturing device module includes an image capturing device provided on a base circuit substrate; a translucent member adhered to the image capturing device with a first adhesive to cover an upper part of an effective pixel region in the image capturing device; a lens body including a lens portion that focuses light into the effective pixel region in the image capturing device and a support portion that is translucent and is provided around the lens portion to expose an upper part of the lens portion; and a non-translucent molding resin that molds the image capturing device, the translucent member, and the lens body, with the upper part of the lens portion being exposed.

Abstract: A camera module includes a solid-state imaging device; a lens unit having a lens for guiding light to the solid-state imaging device; a lens holder for holding the solid-state imaging device, the lens holder including a lens coupling section provided for adjusting the position of the lens, such that a distance between the lens and the solid-state imaging device becomes a prescribed focusing distance; and a shield cap for covering the lens coupling section and the lens unit so as to allow the light to be guided to the lens in the lens unit.

Abstract: There are provided a first casing 100A that has a photosensor section 113 for capturing an image, a second casing 100B that has a lens section 122 for projecting the image of a subject onto the photosensor section 113 of the first casing 100A and a connection section 100C that foldably connects the first casing 100A with the second casing 100B. The photosensor section 113 and the lens section 122 are arranged so that the photosensor section 113 and the lens section 122 are superposed on each other in a state in which the first casing 100A and the second casing 100B are folded together. With this arrangement, the folding type camera device and the folding type portable telephone equipped with this device can be reduced in thickness.

Abstract: In a module for an optical device as a semiconductor device module of the present invention, a bonding wire that electrically connects a substrate on which a conductor wiring is formed and an image pickup element as a semiconductor element is covered with a cover, and a holder as a lid is placed over the cover.

Abstract: The surface of the image pickup device 21 is covered by a transparent conductive member 26 that is made of, for example, a transparent conductive past resin and that is electrically connected to a ground potential GND. By having this arrangement, it is possible to electromagnetically shield the image pickup device 30 itself. The transparent conductive member 26 has one or more openings in the parts that correspond to the conductive unit of the signal wiring portion (the electrodes 23; A to D, F, and G, and the wiring patterns 25 that are connected thereto), out of the electrodes 23 and the wiring patterns 25 provided on the front surface side of the image pickup device body unit 21.

Abstract: An optical structure is disposed on a surface of a device substrate, and a lens system for introducing external light into a solid-state image pickup device is placed in the center of the optical structure. The outer shape of the optical structure seen from the light incident side of the lens system is rectangular, and its plane shape forms a rectangular frame section. An intermediate structure is disposed between the device substrate and the optical structure. The intermediate structure has a fitting section for fitting the optical structure in a part of side faces of the frame section.

Abstract: There are provided a first casing 100A that has a photosensor section 113 for capturing an image, a second casing 100B that has a lens section 122 for projecting the image of a subject onto the photosensor section 113 of the first casing 100A and a connection section 100C that foldably connects the first casing 100A with the second casing 100B. The photosensor section 113 and the lens section 122 are arranged so that the photosensor section 113 and the lens section 122 are superposed on each other in a state in which the first casing 100A and the second casing 100B are folded together. With this arrangement, the folding type camera device and the folding type portable telephone equipped with this device can be reduced in thickness.

Abstract: A camera module includes a solid-state imaging device; a lens unit having a lens for guiding light to the solid-state imaging device; a lens holder for holding the solid-state imaging device, the lens holder including a lens coupling section provided for adjusting the position of the lens, such that a distance between the lens and the solid-state imaging device becomes a prescribed focusing distance; and a shield cap for covering the lens coupling section and the lens unit so as to allow the light to be guided to the lens in the lens unit.