Abstract: A thin copper foil for a printed wiring board comprising a copper foil supporter having a surface with a roughness; a parting payer consisting of chrome compound; a thin copper foil layer formed on the parting layer which will be attached to a board as printed wiring. A copper-nickel compound metal layer is interposed between the parting layer and the thin copper foil layer, wherein said copper-nickel compound metal layer is formed to be integral with the thin copper foil layer with a peel strength therebetween such that said copper-nickel compound metal layer will be left on the thin copper layer when the parting layer with the copper foil supporter is peeled off.

Abstract: A thin copper foil for a printed wiring board comprising a copper foil supporter having a rough surface on at least a side thereof, a parting layer laid on the side of the rough surface, a thin copper foil layer laid on the parting layer, and a copper-nickel compound metal layer interposed between the parting layer and the thin copper foil layer, and a method of manufacturing thereof.

Abstract: The present invention relates to a method of treating the surface of the copper foil used in printed wire boards, in which the copper foil, of which the surface thereof was preliminarily roughened, is electrolytically treated in an aqueous solution of zinc chromate containing zinc ions and chromium (VI) ions at a definite range of ratio; the thus-treated copper foil is then preferably immersed in an aqueous solution containing amino silane, sodium silicate and/or potassium silicate at a definite ratio.The use of the so-treated copper foil in multi-layer glass/epoxy printed wire boards (NEMA grade, FR4, FR5) serves to prevent the generation of brown spottings and the elimination of the delamination of the copper conductors. In addition, the use of the so treated copper foil in flame resistant paper/phenol printed wiring boards (NEMA grade FR2) leads to the elimination of the poor adhesive properties and delamination of copper conductors.