Patents by Inventor Yoshinori Utikoshi

Yoshinori Utikoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molding compound composition, molding compound containing the same, and method for producing the molding compound
    Patent number: 5834547
    Abstract: A molding compound composition of the present invention comprises a resin composition, for example, unsaturated polyester, a succinic acid derivative, and a thickening agent such as magnesium oxide, and the moisture content thereof is adjusted in a range of from 0.1 to 0.45 percent by weight. A molding compound comprises the molding compound composition and reinforced fibers such as glass fibers, and the moisture content thereof is adjusted to be in a range of from 0.1 percent to 0.4 percent by weight. As shown in FIG. 1, the molding compound composition has excellent viscosity characteristics since the initial thickening action due to the thickering agent is restrained. Although the viscosity after thickened is lower than that of a conventional composition, the stickiness of the surface of the molding compound composition is reduced.
    Type: Grant
    Filed: June 17, 1997
    Date of Patent: November 10, 1998
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Kouji Takabatake, Katsura Hayashi, Yoshinori Utikoshi