Abstract: To make the fracturing position controlled conveniently with high precision when the substrate end of the probe contact is fractured and cut off. By compressing the front face of the substrate end portion with the pushing member, brittle fracture is generated on the substrate along the carved groove, and the substrate end portion is cut off from the substrate. The fracturing position in the above-mentioned fracturing is controlled so as to be along the fracturing position whose extension puts thereon the stress concentrating ends of two fracturing control structures. Here, the fracturing control structure is located with high positional precision on the front face of the substrate through the alignment technique of photolithography. In this way, resilient armatures constituted of the tips projected from the fracturing position coming to be the end of the substrate 11a can be stably formed with high precision.

Abstract: To make the fracturing position controlled conveniently with high precision when the substrate end of the probe contact is fractured and cut off. By compressing the front face of the substrate end portion with the pushing member, brittle fracture is generated on the substrate along the carved groove, and the substrate end portion is cut off from the substrate. The fracturing position in the above-mentioned fracturing is controlled so as to be along the fracturing position whose extension puts thereon the stress concentrating ends of two fracturing control structures. Here, the fracturing control structure is located with high positional precision on the front face of the substrate through the alignment technique of photolithography. In this way, resilient armatures constituted of the tips projected from the fracturing position coming to be the end of the substrate 11a can be stably formed with high precision.

Abstract: In a carrier unit, a posture-stabilizing member 30 for stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheet 32 is placed on the electrode sheet 32 in a carrier unit 21.

Abstract: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.

Abstract: In a carrier unit, a posture-stabilizing member 30 for stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheet 32 is placed on the electrode sheet 32 in a carrier unit 21.

Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Abstract: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.

Abstract: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.

Abstract: The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

Abstract: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.

Abstract: The overhead wire tensioning device of the present invention is improved in reliability and eliminates the need for constant maintenance work by protecting the slide mechanism between the cylinder case of the gas spring type overhead wire tensioning device and the cylinder rod, and the pivoting mechanism for the connecting rod connecting this cylinder with the overhead wire from external influences.