Patents by Inventor Yoshinori Wakihara

Yoshinori Wakihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board and method for manufacturing the same
    Patent number: 7615162
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: November 10, 2009
    Assignee: IBIDEN Co., Ltd.
    Inventors: Motoo Asai, Yasuji Hiramatsu, Yoshinori Wakihara, Kazuhito Yamada
  • Printed wiring board and method for manufacturing the same
    Patent number: 7585541
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: September 8, 2009
    Assignee: IBIDEN Co., Ltd.
    Inventors: Yoshinori Wakihara, Kazuhito Yamada
  • Printed circuit boards and method of producing the same
    Patent number: 7449791
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: November 11, 2008
    Assignee: Ibiden Co., Ltd.
    Inventors: Yoshinori Wakihara, Kazuhito Yamada
  • Printed wiring board and method for manufacturing the same
    Patent number: 7371976
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: May 13, 2008
    Assignee: IBIDEN Co., Ltd.
    Inventors: Yoshinori Wakihara, Kazuhito Yamada
  • Printed wiring board and method for manufacturing the same
    Publication number: 20070062728
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Application
    Filed: September 19, 2006
    Publication date: March 22, 2007
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoshinori Wakihara, Kazuhito Yamada
  • Printed wiring board and method for manufacturing the same
    Publication number: 20070056924
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Application
    Filed: September 19, 2006
    Publication date: March 15, 2007
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoshinori Wakihara, Kazuhito Yamada
  • Printed wiring board and method for manufacturing the same
    Publication number: 20070051694
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Application
    Filed: September 19, 2006
    Publication date: March 8, 2007
    Applicant: IBIDEN CO., LTD.
    Inventors: Motoo Asai, Yasuji Hiramatsu, Yoshinori Wakihara, Kazuhito Yamada
  • Printed circuit boards and method of producing the same
    Publication number: 20060032668
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Application
    Filed: August 15, 2005
    Publication date: February 16, 2006
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoshinori Wakihara, Kazuhito Yamada
  • Printed circuit boards and method of producing the same
    Patent number: 6930255
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: August 16, 2005
    Assignee: Ibiden Co., LTD
    Inventors: Yoshinori Wakihara, Kazuhito Yamada
  • Printed circuit boards and method of producing the same
    Publication number: 20030132025
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Application
    Filed: January 27, 2003
    Publication date: July 17, 2003
    Applicant: IBIDEN CO., LTD.
    Inventors: Yoshinori Wakihara, Kazuhito Yamada
  • Printed wiring board and method for manufacturing the same
    Patent number: RE43509
    Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
    Type: Grant
    Filed: December 18, 1997
    Date of Patent: July 17, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Motoo Asai, Yasuji Hiramatsu, Yoshinori Wakihara, Kazuhito Yamada