Abstract: A colorless and transparent thermosetting polyimidesilicone resin comprising structural units of the following general formula (1) and structural units of the general formula (4), said resin being soluble in an organic solvent wherein X is a tetravalent organic group having 4 or more carbon atoms, none of the carbon atoms of X being bound to a plurality of carbonyl groups, Y is a diamine residue and Z is a diaminosiloxane residue.

Abstract: A solvent-free resin composition comprising (a) a polyimide silicone resin having repeating units represented by the following general formulas (1-1) and (1-2), wherein X is a tetravalent organic group, Y is a divalent organic group, and Z is a divalent organic group having an organosiloxane moiety, (b) a reactive diluent, and (c) a photo-polymerization initiator, characterized in that a film of said resin composition with a film thickness of 100 ?m prepared on a quartz glass substrate shows a light transmittance of 80% or higher at wavelengths of from 350 nm to 450 nm.

Abstract: A solvent-free polyimide silicone resin composition comprising (a) a polyimide silicone resin having repeating units represented by the following formula (1-1) and repeating units represented by the following formula (1-2), a film of said resin with a thickness of 100 ?m prepared on a quartz glass substrate having a light transmittance of 80% or higher at wavelengths of from 350 nm to 450 nm, (b) a reactive diluent, and (c) a photopolymerization initiator wherein X is a tetravalent organic group, Y is a divalent organic group, and Z is a divalent organic group represented by the following formula (2), wherein R1 may be different from each other and is a monovalent hydrocarbon group having 1 to 8 carbon atoms, which group may be substituted, R2 is a monovalent hydrocarbon group having a photopolymerizable group, a and b are each an integer of from 1 to 100 with a+b?100.

Abstract: An addition curing type silicone resin composition is provided including (A) 100 parts by weight of a specific organopolysiloxane with a phenyl group and at least two alkenyl groups within each molecule, (B) 1 to 100 parts by weight of a specific organohydrogenpolysiloxane with a phenyl group and at least two SiH groups within each molecule, and (C) an effective quantity of a hydrosilylation reaction catalyst. A cured product obtained by curing this composition is transparent, displays good strength and particularly good flexural strength, and moreover also displays a high degree of hardness. The composition is applicable to a variety of fields including electrical and electronic equipment, OA equipment and precision instruments.

Abstract: A colorless and transparent thermosetting polyimidesilicone resin comprising structural units of the following general formula (1) and structural units of the general formula (4), said resin being soluble in an organic solvent 1

Abstract: An addition curing type silicone resin composition is provided including (A) 100 parts by weight of a specific organopolysiloxane with a phenyl group and at least two alkenyl groups within each molecule, (B) 1 to 100 parts by weight of a specific organohydrogenpolysiloxane with a phenyl group and at least two SiH groups within each molecule, and (C) an effective quantity of a hydrosilylation reaction catalyst. A cured product obtained by curing this composition is transparent, displays good strength and particularly good flexural strength, and moreover also displays a high degree of hardness. The composition is applicable to a variety of fields including electrical and electronic equipment, OA equipment and precision instruments.