Patents by Inventor Yoshio Fujieda

Yoshio Fujieda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition and semiconductor device
    Patent number: 6830825
    Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: December 14, 2004
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takafumi Sumiyoshi, Ayako Mizushima, Ken Oota, Yoshio Fujieda, Hiroki Nikaido, Takashi Aihara
  • Epoxy resin composition and semiconductor device
    Publication number: 20030187107
    Abstract: The present invention provides an epoxy resin composition for encapsulation of semiconductors which contains substantially neither halogen-based flame retarding agents nor antimony compounds and is excellent in moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. That is, the present invention is an epoxy resin composition for encapsulating semiconductors which contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.
    Type: Application
    Filed: October 31, 2002
    Publication date: October 2, 2003
    Inventors: Takafumi Sumiyoshi, Ayako Mizushima, Ken Oota, Yoshio Fujieda, Hiroki Nikaido, Takashi Aihara