Abstract: A quasi resonant type switching power supplying unit includes an overcurrent limiting circuit and an oscillation level comparison circuit. The overcurrent limiting circuit (i.e., a level determining circuit and a reference voltage generating circuit) receives a reverse electromotive voltage generated from an auxiliary winding which is electromagnetically connected with a primary winding when a MOSFET is in an OFF state, and produces a reference voltage stepwise based on the reverse electromotive voltage. The oscillation level comparison circuit receives a feedback voltage corresponding to electric power supplied to a load, and produces a control signal that switches the MOSFET into an OFF state when the feedback voltage exceeds the reference voltage.

Abstract: A structure of a molding part of a weather strip for use in a rear door by firmly attaching the molding part in the rear door so as to reduce weight and manufacturing costs and ensures sufficient sealing property. The molding part is attached to a recess together with a slide arm 4. The recess is formed at the front lower end of the rear door. The molding part comprises merely a plate insert except sealing function parts. The sealing function parts elastically contact a car body side. The plate insert is fixed to the rear door by bolts and nuts.

Abstract: A weather strip for a sliding type rear door is applied to a car which is unfurnished with a center pillar, and is furnished with a front door turnable about hinges provided at the front end thereof and with a sliding rear door which slides back and forth. The weather strip is attached to the front end of the rear door and includes a tapered lip portion extending toward the front door. The tapered lip portion is formed on a molded portion of the weather strip formed at the upper end portion thereof. The tapered portion elastically contacts an opening seal attached to a roof side of a car body and a weather strip attached to a rear end of the front door when the rear door is closed. A guide portion is formed at the lower half of the lip portion. The guide portion is thicker than the lip portion, and it contacts the opening seal and the front door weather strip immediately before the tip end of the tapered lip portion contacts the opening seal and the front door weather strip.

Abstract: A weather strip for a sliding type rear door is applied to a car which is unfurnished with a center pillar, and is furnished with a front door turnable about hinges provided at the front end thereof and with a sliding rear door which slides back and forth. The weather strip is attached to the front end of the rear door and includes a tapered lip portion extending toward the front door. The tapered lip portion is formed on a molded portion of the weather strip formed at the upper end portion thereof. The tapered portion elastically contacts an opening seal attached to a roof side of a car body and a weather strip attached to a rear end of the front door when the rear door is closed. A guide portion is formed at the lower half of the lip portion. The guide portion is thicker than the lip portion, and it contacts the opening seal and the front door weather strip immediately before the tip end of the tapered lip portion contacts the opening seal and the front door weather strip.

Abstract: There is provided a structure of a molding part of a weather strip for use in a rear door by firmly attaching the molding part in the rear door so as to reduce weight and manufacturing costs and ensures sufficient sealing property. The molding part is attached to a recess together with a slide arm 4. The recess is formed at the front lower end of the rear door. The molding part comprises merely a plate insert except sealing function parts. The sealing function parts elastically contact a car body side. The plate insert is fixed to the rear door by bolts and nuts.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, a substantially pure alpha-alumina filler, and a silicone-modified epoxy or phenol resin is useful in encapsulating semiconductor devices. The composition can be molded and cured into a product having improved thermal conductivity and moisture resistance.

Abstract: A silicone composition adapted for impregnation of electronic parts comprising a vinyl group-containing organopolysiloxane, an organopolysiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule and a peroxide compound. The peroxide compound is soluble in both organopolysiloxanes and is contained in an amount of from 0.1 to 10 parts by weight per 100 parts by weight of the total of the organopolysiloxanes. The composition has a viscosity which is sufficient to allow easy impregnation, and is in the range of from 20 to 400 centistokes at 25.degree. C.

Abstract: The present invention provides a novel epoxy resin-based curable composition suitable for use as an encapsulating resin composition for semiconductor devices capable of being highly resistant against crack formation with low internal stress by curing and yet having very high heat conductivity and maintaining high glass transition temperature. The inventive composition comprises (a) 100 parts by weight of a curable epoxy resin blend which is a mixture of an epoxy resin and a curing agent therefor, (b) from 5 to 100 parts by weight of a block copolymer composed of at least one segment of an aromatic polymeric moiety, phenyl novolac, and at least one segment of an organopolysiloxane moiety having 30 to 200 silicon atoms and bonded to the aromatic polymeric moiety through a carbon-to-silicon linkage, and optionally (c) an inorganic filler which is preferably a silica filler such as powdered quartz in an amount not exceeding 1000 parts by weight.