Abstract: The present invention relates to a novel thermal spray material in any one of the forms of a particle mixture material, a granule material, and an electric fused material of 2CaO.SiO.sub.2 and CaO.ZrO.sub.2. As 2CaO.SiO.sub.2, .gamma.-2CaO.SiO.sub.2 is used. The ratio of .gamma.-2CaO.SiO.sub.2 to CaO.ZrO.sub.2 is specified by weight %. This invention relates also to a thermal sprayed member formed by thermal spraying this thermal spray material on a thermal resistant substrate.

Abstract: In order to prevent production of build-up resistance and wear resistance on a roll for use in heat treating furnace effectively, an alloy layer, a cermet sprayed layer having reinforced zone and a chemical conversion coating are provide in this order on a roll substrate to form a multi-coating layer.

Abstract: The present invention relates to a novel thermal spray material in any one of the forms of a particle mixture material, a granule material, and an electric fused material of 2CaO.multidot.SiO.sub.2 and CaO.multidot.ZrO.sub.2. As 2CaO.multidot.O.multidot.SiO.sub.2, .gamma.-2CaO.multidot.SiO.sub.2 is used. The ratio of .gamma.-2CaO.multidot.SiO.sub.2 to CaO.multidot.ZrO.sub.2 is specified by weight %. This invention relates also to a thermal sprayed member formed by thermal spraying this thermal spray material on a thermal resistant substrate.

Abstract: A roll for use in rolling process is disclosed. The roll is provided with a sprayed coating of cermet in such a way that a porosity of the sprayed coating of for example a compound of tungsten carbide and cobalt and nickel-chromium cermet is selected less than 1.8% and a surface roughness Rmax of the sprayed coating is selected less than 3.0 .mu.m.

Abstract: A process for mounting chip type circuit elements on printed circuit boards and apparatus therefor are capable of eliminating the necessity for arranging an X-Y table, thereby to simplify the structure of the apparatus, and decreasing the time required to mount one circuit element on a printed circuit board. Chip type circuit elements are sucked up by a plurality of suction pins arranged in each mounting head, transferred to a centering and turning section and then progressively mounted on a printed circuit board. The mounting head is adapted to carry out the reciprocating movement in the X-direction a plurality of times while it carries out the reciprocating movement in the Y-direction one time.

Abstract: A simplified apparatus for automatically inserting electronic components of different forms into printed circuitboards successively conveyed along a travel path which extends along a horizontal plane includes a feed mechanism for separately and simultaneously feeding different pluralities of electronic components of different forms to a pallet operative for separately and simultaneously receiving and conveying the electronic components to an inserting device operative for separately and simultaneously inserting the electronic components into successive printed circuitboards, each board in its turn.

Abstract: Apparatus for supplying and transferring electronic components includes a plurality of pallets each for receiving and holding one electronic component. An endless conveying mechanism conveys the pallets in and intermittent fashion on a substantially horizontal plane. A supply unit mechanism selectively supplies electronic components to the pallets.

Abstract: System for mounting an electronic component on a printed circuit board comprises a vacuum fastener (4) for picking up an electronic component (2), an image sensor (6) (like a television camera) for taking a picture of the electronic component (2) picked up by said vacuum fastener (4), an image signal processor (7) for providing error signals for compensation of positional error of said electronic component (2) on the vacuum fastener (4), and NC control device (8) for actuating the printed circuit board (10) under the electronic component (2) responsive to said error signals, so that the electronic component (2) is mounted on an accurate location on the printed circuit board (10).

Abstract: A manufacturing method of a semiconductor device is disclosed which includes the steps of forming oxide layers on a major surface of a substrate at first and second portions, forming first and second semiconductor layers, each having predetermined conductivity types and with predetermined patterns on the oxide layers of the first and second portions, forming a first region by introducing an impurity of the first conductivity type into the substrate while using the first semiconductor layer as a mask, etching out the oxide layer on the second portion by using the second semiconductor layer as a mask, forming a second region by introducing an impurity of the second conductivity type into the substrate while using the second semiconductor layer as a mask, and forming oxide layers on the surfaces of the first semiconductor layer, the second semiconductor layer and the second region by a thermal oxidization process.

Abstract: Apparatus for supplying and transferring electronic components includes a plurality of pallets each for receiving and holding one electronic component. An endless conveying mechanism conveys the pallets in an intermittent fashion in a substantially horizontal plane. A supply unit mechanism selectively supplies electronic components to the pallets.

Abstract: Apparatus for inserting square pins into a printed circuit board wherein during one stroke of a master cylinder, each square pin is cut by a movable cutter in combination with a fixed cutter from an elongated square pin-forming wire held in a chuck. The square pin is held by the movable cutter and then is moved over a guide member and then is further transferred into the guide member in accordance with the movement of a push rod moved by a main slider actuated by the master cylinder. The square pin is finally inserted into a printed circuit board by further movement of the push rod.

Abstract: A device for cutting lead wires of an electronic circuit element mounted on a printed circuit board into a desired length and for bending the lead wires to be close to the bottom surface of the printed circuit board is capable of dealing with an electronic circuit element having three lead wires as well as that having two lead wires. The device comprises a fixed block having a stationary blade which has two side holes and a central hole formed therethrough, a pair of side levers having laterally movable blade members which are slidable on the surface of the stationary blade to cut and bend lead wires inserted through the side holes of the stationary blade, and a central lever having a movable blade member which are slidable on the surface of the statonary blade to cut and bend a lead wire inserted through the central hole of the stationary blade.

Abstract: A self-registering temperature control device in which an electronic control section for controlling air temperature in a refrigerated container and an automatic temperature recording section are accommodated in a housing is provided. This structure permits easy survey of all the units concerned with temperature controlling and recording.