Patents by Inventor Yoshio Imamura
Yoshio Imamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11932118Abstract: The electric vehicle according to the present disclosure calculates motor torque using an MT vehicle model simulating an MT vehicle having a manual transmission and an internal combustion engine. In the first operation mode, an operation amount of a pseudo-clutch pedal and a shift position of a pseudo-gearshift are input to the MT vehicle model to reflect operation of the pseudo-clutch pedal and operation of the pseudo-gearshift in electric motor control. In the second operation mode where the operation of the pseudo-clutch pedal is not needed, an operation amount of a clutch pedal calculated by a driver model is input to the MT vehicle model instead of the operation amount of the pseudo-clutch pedal.Type: GrantFiled: June 16, 2021Date of Patent: March 19, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Akiko Nishimine, Yoichiro Isami, Yoshio Itou, Hiroyuki Amano, Tatsuya Imamura, Hiroaki Ebuchi, Hiroaki Kodera
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Patent number: 11926222Abstract: An electric vehicle is configured to be able to perform running by an MT mode that controls an electric motor with a torque characteristic like an MT vehicle having a manual transmission and an internal combustion engine, and running by an EV mode that controls the electric motor with a normal torque characteristic. The electric vehicle includes a mode changeover switch for switching to the running by the MT mode.Type: GrantFiled: June 22, 2021Date of Patent: March 12, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yoichiro Isami, Yoshio Itou, Hiroyuki Amano, Tatsuya Imamura, Akiko Nishimine, Hiroaki Ebuchi, Hiroaki Kodera
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Patent number: 9526182Abstract: The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.Type: GrantFiled: October 31, 2011Date of Patent: December 20, 2016Assignee: MEIKO ELECTRONICS CO., LTD.Inventors: Ryoichi Shimizu, Tohru Matsumoto, Takuya Hasegawa, Yoshio Imamura
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Patent number: 9320185Abstract: A thin conductive layer which is to form a conductor pattern (18) is prepared, a mask layer (3) is formed on the conductive layer except a plurality of actual connection spots and at least one dummy connection spot on the conductive layer, actual solder pads (6) and a dummy solder pad (7) are formed, with use of solder, on the actual connection spots and the dummy connection spot, respectively, where the conductive layer is exposed, connection terminals (9) of an electric or electronic component (8) are connected to the actual solder pads (6), an insulating base (16) of resin is formed which is laminated directly on or indirectly via the mask layer (3) on the conductive layer and in which the component (8) is embedded, and part of the conductive layer is removed by using the dummy solder pad (7) as a reference, to form the conductor pattern (18).Type: GrantFiled: October 1, 2010Date of Patent: April 19, 2016Assignee: MEIKO ELECTRONICS CO., LTD.Inventors: Yoshio Imamura, Tohru Matsumoto, Ryoichi Shimizu
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Patent number: 8921706Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.Type: GrantFiled: October 1, 2010Date of Patent: December 30, 2014Assignee: Meiko Electronics Co., Ltd.Inventors: Mitsuaki Toda, Yoshio Imamura, Takuya Hasegawa
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Publication number: 20140347835Abstract: The method includes positioning an electronic component using main marks formed on a metal layer and mounting the electronic component on a second surface of the metal layer with an adhesive layer interposed between the metal layer and both of the electronic component and terminals; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and forming a first window for exposing the main marks therefrom and a second window for exposing the adhesive layer including a position corresponding to the terminal therefrom; then using the exposed main marks as references and forming a laser via hole LVH reaching the terminal in the adhesive layer exposed from the second window; and thereby forming a wiring pattern from the metal layer electrically connected to the terminal through a first conductive via formed by plating the LVH with copper.Type: ApplicationFiled: October 31, 2011Publication date: November 27, 2014Applicant: C/O Meiko Electronics Co., Ltd.Inventors: Ryoichi Shimizu, Tohru Matsumoto, Takuya Hasegawa, Yoshio Imamura
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Publication number: 20140299367Abstract: The method includes forming an annular seat and main marks on a metal layer simultaneously so that the annular seat opposes with a terminal of an electronic component when the component is placed above the annular seat at a subsequent step; then positioning the electronic component in a mounting expected region using the main marks and mounting the electronic component with an adhesive layer therebetween; then burying the electronic component and the main marks in an insulating substrate; then removing part of the metal layer and thereby forming first and second windows; then irradiating the adhesive layer with laser using the exposed main marks thereby forming a laser via hole; and then filling the laser via hole with copper and forming a wiring pattern from the metal layer electrically connected to the terminal through a conductive via.Type: ApplicationFiled: November 8, 2011Publication date: October 9, 2014Applicant: Meiko Electronics Co., Ltd.Inventor: Yoshio Imamura
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Publication number: 20140216801Abstract: A method of manufacturing a component-embedded substrate comprises forming an adhesive layer on a metal layer formed on a supporting plate, and mounting an electric or electronic component on the adhesive layer, wherein the component includes a component main body and a protrusion that protrudes beyond the component main body toward the adhesive layer, the adhesive layer includes a first adhesive body and a second adhesive body, the first adhesive body is formed only at a position corresponding to the protrusion, the second adhesive body is formed in an area corresponding to the whole of the surface of the component facing the adhesive layer after the first adhesive body is cured, and the component is mounted with the protrusion aligned with the first adhesive body in the component mounting step.Type: ApplicationFiled: September 12, 2011Publication date: August 7, 2014Applicant: MEIKO ELECTRONICS CO., LTD.Inventors: Tohru Matsumoto, MItsuaki Toda, Yoshio Imamura
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Publication number: 20130242516Abstract: A thin conductive layer which is to form a conductor pattern (18) is prepared, a mask layer (3) is formed on the conductive layer except a plurality of actual connection spots and at least one dummy connection spot on the conductive layer, actual solder pads (6) and a dummy solder pad (7) are formed, with use of solder, on the actual connection spots and the dummy connection spot, respectively, where the conductive layer is exposed, connection terminals (9) of an electric or electronic component (8) are connected to the actual solder pads (6), an insulating base (16) of resin is formed which is laminated directly on or indirectly via the mask layer (3) on the conductive layer and in which the component (8) is embedded, and part of the conductive layer is removed by using the dummy solder pad (7) as a reference, to form the conductor pattern (18).Type: ApplicationFiled: October 1, 2010Publication date: September 19, 2013Applicant: MEIKO ELECTRONICS CO., LTD.Inventors: Yoshio Imamura, Tohru Matsumoto, Ryoichi Shimizu
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Publication number: 20130176701Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.Type: ApplicationFiled: October 1, 2010Publication date: July 11, 2013Applicant: Meiko Electronics Co., Ltd.Inventors: Mitsuaki Toda, Yoshio Imamura, Takuya Hasegawa
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Patent number: 5841317Abstract: A differential amplifier achieving a high throughput rate with reduced power consumption includes a differential circuit, output circuit, a constant current source transistor, a drive transistor, and a switching circuit. A difference voltage relative to a difference between voltages applied to non-inverting and inverting inputs of the differential circuit is applied to the switching circuit. The switching circuit supplies a drive signal to the drive transistor to enable the drive transistor when the difference voltage is below a predetermined threshold voltage, and to disable the drive transistor when the difference voltage is above the predetermined threshold voltage.Type: GrantFiled: February 26, 1996Date of Patent: November 24, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tetsurou Ohmori, Yoshito Date, Takashi Koizumi, Yoshio Imamura, Osamu Sarai
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Patent number: 5648791Abstract: A liquid crystal display control system comprises a liquid crystal panel, a plurality of data latches for storing digital gray scale data, and a plurality of D/A converters for converting the outputs of the data latches into analog signals to be applied to the liquid crystal panel. The display data is digital signals, and the digital signals are processed up to the D/A converters just before the liquid crystal panel. Afterwards, the digital signals are converted into analog signals in the horizontal display period of relatively slow operating speed, and therefore analog circuits having many adjusting points may be reduced. Accordingly, the adjusting positions are reduced, and the adjusting process in mass production is simplified. In the case of a large screen display, in particular, although the data transfer speed is high, since the display data are digital signals, a high display quality is obtained by transferring the signals without deteriorating the display data.Type: GrantFiled: May 31, 1995Date of Patent: July 15, 1997Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yoshito Date, Shoichi Takeshita, Tetsuro Ohmori, Junji Nakatsuka, Yoshio Imamura
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Patent number: 5453757Abstract: A liquid crystal display control system comprises a liquid crystal panel, a plurality of data latches for storing digital gray scale data, and a plurality of D/A converters for converting the outputs of the data latches into analog signals to be applied to the liquid crystal panel. The display data is digital signals, and the digital signals are processed up to the D/A converters just before the liquid crystal panel. Afterwards, the digital signals are converted into analog signals in the horizontal display period of relatively slow operating speed, and therefore analog circuits having many adjusting points may be reduced. Accordingly, the adjusting positions are reduced, and the adjusting process in mass production is simplified. In the case of a large screen display, in particular, although the data transfer speed is high, since the display data are digital signals, a high display quality is obtained by transferring the signals without deteriorating the display data.Type: GrantFiled: February 21, 1995Date of Patent: September 26, 1995Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yoshito Date, Shoichi Takeshita, Tetsuro Ohmori, Junji Nakatsuka, Yoshio Imamura
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Patent number: 4771663Abstract: To eliminate defects such as burr, rollover, sags, scar, etc. from cut-off surfaces of a workpiece in a turret punch press, for instance, a novel height-different punch formed with a lower front edge, an upper rear edge, and an intermediate edge extending between the two edges is used for the punch press. While feeding the workpiece on a horizontal plane in a predetermined direction, the punch is struck by a striker at a first stroke so that the lower front edge thereof cuts off the workpiece partially in cooperation with a die; at the succeeding strokes so that the intermediate edge thereof cuts off the workpiece mincingly and curls refuse within a recess of the die; and at the last stroke so that the upper rear edge thereof cuts curled refuse away from the workpiece to complete a multistroke punching operation.Type: GrantFiled: November 19, 1987Date of Patent: September 20, 1988Assignee: Amada Company, LimitedInventors: Kinshiro Naito, Yoshio Imamura
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Patent number: 4391616Abstract: The disclosure is directed to a method of dehumidification of air or gas which includes the steps of preparing a dehumidifying member composed of active carbon fiber material in the form of sheets, and bringing air or gas to be dehumidified into contact with the dehumidifying member in a direction parallel to the sheets for a less air passing resistance.Type: GrantFiled: July 21, 1981Date of Patent: July 5, 1983Assignee: Toyo Boseki Kabushiki KaishaInventor: Yoshio Imamura
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Patent number: 4378003Abstract: An internal combustion engine having first valve means disposed in the exhaust system and adapted to impart a resistance to the flow of exhaust gas to control the flow rate of the latter, and second valve means provided in the intake passage of said engine and adapted to introduce fresh air to the intake passage when r.p.m. of the engine has reached a predetermined value. During operation of the engine, a part of the exhaust gas is made to return into the combustion chamber due to the resistance imparted by the first valve means, and the unburned hydrocarbons in the exhaust gas returned to the combustion chamber are efficiently burned by the presence of fresh air which is introduced through the second valve means. Thus an improved internal combustion engine which can operate at a much improved fuel economy and which can minimize the emission of unburned hydrocarbons to the atmosphere is obtained.Type: GrantFiled: January 16, 1981Date of Patent: March 29, 1983Inventor: Yoshio Imamura
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Patent number: 4202307Abstract: An ignition plug for an internal combustion engine which comprises a hollow cylindrical main body having one externally threaded end portion and the other end portion in the form of a nut, said threaded end portion being provided with jet orifices, air guide grooves and a communication groove; a tubular anode member having an insulation body and extending through said main body; a center electrode extending through said insulation body; and a check valve assembly mounted about the intermediate portion between the two end portions of the main body, said valve assembly comprising a ring-shaped valve housing having a tapered seat face and air intake bores and a ring-shaped valve body reciprocally received in said valve housing and having a matingly tapered outer surface for opening and closing said air intake bores in the valve housing.Type: GrantFiled: November 2, 1978Date of Patent: May 13, 1980Inventor: Yoshio Imamura
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Patent number: 4001816Abstract: An electronic chime wherein at least two different audible frequency signals forming chime sound are generated by a frequency divider oscillated by an oscillating circuit capable of adjusting its output standard frequency clock pulse. These audible frequency signals are respectively amplitude modulated so as to be attenuated stepwise, and the chime sound is generated by such modulated signals and caused to disappear at attenuated state.Type: GrantFiled: January 19, 1976Date of Patent: January 4, 1977Assignees: Matsushita Electric Works, Ltd., Matsushita Electric Industrial Co., Ltd.Inventors: Kiyoshi Yamada, Kazushige Morisue, Hiroshi Shimomura, Yoshio Imamura
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Patent number: RE34602Abstract: To eliminate defects such as burr, rollover, sags, scar, etc. from cut-off surfaces of a workpiece in a turret punch press, for instance, a novel height-different punch formed with a lower front edge, an upper rear edge, and an intermediate edge extending between the two edges is used for the punch press. While feeding the workpiece on a horizontal plane in a predetermined direction, the punch is struck by a striker at a first stroke so that the lower front edge thereof cuts off the workpiece partially in cooperation with a die; at the succeeding strokes so that the intermediate edge thereof cuts off the workpiece mincingly and curls refuse within a recess of the die; and at the last stroke so that the upper rear edge thereof cuts curled refuse away from the workpiece to complete a multistroke punching operation.Type: GrantFiled: September 17, 1990Date of Patent: May 10, 1994Assignee: Amada Company, Ltd.Inventors: Kinshiro Naito, Yoshio Imamura